S9S08DZ16F1MLC vs S9S08DZ16F2MLC Vergleich
Detaillierter Direktvergleich von S9S08DZ16F1MLC von NXP Semiconductors und S9S08DZ16F2MLC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | S9S08DZ16F1MLC | S9S08DZ16F2MLC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,65 | $0,00 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | S08 | — |
| Core | HCS08 (40 MHz CPU, 20 MHz bus) | S08 8-bit core |
| Core Width | 8-Bit | — |
| Program Memory Size | 16 KB (16K x 8) Flash | — |
| RAM Size | 1 KB (1K x 8) | — |
| Maximale Taktfrequenz | 40 MHz | 40 MHz |
| Number of I/O | 25 | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Betriebstemperatur | -40 C to +125 C | -40°C to +125°C |
| ADC | 24-channel, 12-bit, 2.5 us conversion | 8-bit ADC |
| Communication Interfaces | CAN, I2C, LIN, SCI, SPI | CANbus, I2C, LINbus, SCI, SPI |
| Oscillator Type | External | — |
| Gehäuse / Bauform | 32-LQFP (7x7 mm) | — |
| Montageart | Surface Mount | Surface mount |
| Packaging | Tray | — |
| Program Memory | — | 16 KB Flash |
| RAM Memory | — | 4 KB |
| Automotive Qualification | — | Automotive qualified |
| Gehäuse | — | 32-LQFP, 7 mm x 7 mm |
| Anzahl der Pins | — | 32 pins |
| I/O Pins | — | 25 |
| Peripheral Functions | — | LVD, POR, PWM, WDT |
| Product Status | — | Active |
| Versorgungsspannung | — | 3.3 V / 5 V |
| EEPROM | — | [DATA_NEEDED: exact EEPROM size and organization] |
| Flash Endurance | — | [DATA_NEEDED: flash endurance] |
| RoHS-Status | — | [DATA_NEEDED: RoHS status] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Status | — | [DATA_NEEDED: exact AEC-Q100 qualification grade] |