S9S08DZ16F1MLC vs S9S08DZ16F2MLC 对比

详细并排对比 S9S08DZ16F1MLC 出自 NXP Semiconductors 和 S9S08DZ16F2MLC 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
S9S08DZ16F1MLC S9S08DZ16F1MLC - 16KB Flash 40MHz HCS08 MCU 32-LQFP | NXP

S9S08DZ16F1MLC - 16KB Flash 40MHz HCS08 MCU 32-LQFP | NXP

S9S08DZ16F1MLC ✓ 量产中
NXP Semiconductors
S9S08DZ16F2MLC S9S08DZ16F2MLC - 40MHz 16KB Flash MCU | NXP | Automotive

S9S08DZ16F2MLC - 40MHz 16KB Flash MCU | NXP | Automotive

S9S08DZ16F2MLC ✓ 量产中

规格对比

参数 S9S08DZ16F1MLC S9S08DZ16F2MLC
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $3.65 $0.00
Manufacturer NXP Semiconductors (formerly Freescale) —
Series S08 —
Core HCS08 (40 MHz CPU, 20 MHz bus) S08 8-bit core
Core Width 8-Bit —
Program Memory Size 16 KB (16K x 8) Flash —
RAM Size 1 KB (1K x 8) —
最大时钟频率 40 MHz 40 MHz
Number of I/O 25 —
Supply Voltage Range 2.7 V to 5.5 V —
工作温度 -40 C to +125 C -40°C to +125°C
ADC 24-channel, 12-bit, 2.5 us conversion 8-bit ADC
Communication Interfaces CAN, I2C, LIN, SCI, SPI CANbus, I2C, LINbus, SCI, SPI
Oscillator Type External —
封装 / 外壳 32-LQFP (7x7 mm) —
安装类型 Surface Mount Surface mount
Packaging Tray —
Program Memory — 16 KB Flash
RAM Memory — 4 KB
Automotive Qualification — Automotive qualified
封装 — 32-LQFP, 7 mm x 7 mm
引脚数 — 32 pins
I/O Pins — 25
Peripheral Functions — LVD, POR, PWM, WDT
Product Status — Active
电源电压 — 3.3 V / 5 V
EEPROM — [DATA_NEEDED: exact EEPROM size and organization]
Flash Endurance — [DATA_NEEDED: flash endurance]
RoHS 状态 — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Status — [DATA_NEEDED: exact AEC-Q100 qualification grade]

数据手册与资源

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