S9S12GN16F1VLC557 vs MC9S08QG84CFFE Vergleich
Detaillierter Direktvergleich von S9S12GN16F1VLC557 von NXP Semiconductors und MC9S08QG84CFFE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | S9S12GN16F1VLC557 | MC9S08QG84CFFE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $5,22 | $1,21 |
| Core Architecture | HCS12 (S12G family) | — |
| Datenbusbreite | 16-bit | — |
| Program Memory (Flash) | 16 KB | — |
| RAM | 1 KB | — |
| Maximum CPU Frequency | 25 MHz | — |
| Supply Voltage (VDD) | 3.15 V to 5.5 V | — |
| Communication Peripherals | CAN 2.0 A/B (msCAN), SCI, SPI | — |
| ADC | 10-bit | — |
| PWM Channels | 8-bit | — |
| Timers | 16-bit | — |
| Betriebstemperaturbereich | -40C to +125C (automotive) | — |
| Gehäuse | 32-pin LQFP (7 mm x 7 mm) | 16-QFN-EP (5x5 mm), Exposed Pad |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| RoHS-Status | Compliant | RoHS3 (per Mouser ROO listing) |
| Debug Interface | BDM (Background Debug Mode) | — |
| Core Processor | — | S08 (HCS08) 8-bit CISC |
| Core Size | — | 8-bit |
| Speed | — | 20 MHz |
| Flash Memory | — | 8 KB (8K x 8) |
| Versorgungsspannung | — | 2.5 V / 3.3 V |
| Architecture | — | S08 |
| Instruction Set | — | CISC |
| Peripherals | — | ADC, POR, PWM, WDT |
| RAM Size | — | [DATA_NEEDED: RAM size] |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |
| Number of I/O | — | [DATA_NEEDED: number of I/O] |
| Data Converters | — | A/D 8x10-bit |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature range] |
| Moisture Sensitivity | — | [DATA_NEEDED: MSL level] |
| Pin Pitch | — | 0.5 mm (QFN-16 class) |