S9S12GN16F1VLC557 vs MC9S08QG84CFFE 对比
详细并排对比 S9S12GN16F1VLC557 出自 NXP Semiconductors 和 MC9S08QG84CFFE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | S9S12GN16F1VLC557 | MC9S08QG84CFFE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $5.22 | $1.21 |
| Core Architecture | HCS12 (S12G family) | — |
| 数据总线宽度 | 16-bit | — |
| Program Memory (Flash) | 16 KB | — |
| RAM | 1 KB | — |
| Maximum CPU Frequency | 25 MHz | — |
| Supply Voltage (VDD) | 3.15 V to 5.5 V | — |
| Communication Peripherals | CAN 2.0 A/B (msCAN), SCI, SPI | — |
| ADC | 10-bit | — |
| PWM Channels | 8-bit | — |
| Timers | 16-bit | — |
| 工作温度范围 | -40C to +125C (automotive) | — |
| 封装 | 32-pin LQFP (7 mm x 7 mm) | 16-QFN-EP (5x5 mm), Exposed Pad |
| 安装类型 | Surface Mount | Surface Mount |
| MSL 等级 | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| RoHS 状态 | Compliant | RoHS3 (per Mouser ROO listing) |
| Debug Interface | BDM (Background Debug Mode) | — |
| Core Processor | — | S08 (HCS08) 8-bit CISC |
| Core Size | — | 8-bit |
| Speed | — | 20 MHz |
| Flash Memory | — | 8 KB (8K x 8) |
| 电源电压 | — | 2.5 V / 3.3 V |
| Architecture | — | S08 |
| Instruction Set | — | CISC |
| Peripherals | — | ADC, POR, PWM, WDT |
| RAM Size | — | [DATA_NEEDED: RAM size] |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |
| Number of I/O | — | [DATA_NEEDED: number of I/O] |
| Data Converters | — | A/D 8x10-bit |
| 工作温度 | — | [DATA_NEEDED: operating temperature range] |
| Moisture Sensitivity | — | [DATA_NEEDED: MSL level] |
| Pin Pitch | — | 0.5 mm (QFN-16 class) |