SC900844JVK vs SC900844JVKR2 Vergleich
Detaillierter Direktvergleich von SC900844JVK von NXP Semiconductors und SC900844JVKR2 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | SC900844JVK | SC900844JVKR2 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Power Management | Voltage Regulators |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,74 | $9,25 |
| Part Number | SC900844JVK | — |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (Freescale) |
| Funktion | Power Management IC (PMUIC) - Integrated PMIC for Ultra-Mobile and Embedded Applications | — |
| Topologie | PMUIC: 5 switching regulators + 14 LDOs + 10 buck converters + ADC | — |
| Eingangsspannungsbereich | 3 V to 4.4 V | [DATA_NEEDED: input voltage range] |
| Package Type | 338-ball MAP-BGA (11x11 mm) | — |
| Pin / Terminal Count | 338 | — |
| Package Code | TFBGA | — |
| Package Shape | Square | — |
| Montageart | Surface Mount (SMT) | Surface Mount |
| Temperature Grade | Industrial | — |
| Number of Switches | 5 | — |
| Number of LDOs | 14 | — |
| Number of Buck Converters | 10 | — |
| ADC Integration | Yes - multi-channel monitoring ADC | — |
| Primary Application | Ultra-Mobile and Embedded Platforms (PCs, PDAs, tablets) | — |
| RoHS-Status | Compliant | Compliant |
| Datasheet Document | Manufacturer datasheet (118 pages per alldatasheet index) | — |
| Product Type | — | Integrated Power Management IC (PMIC) |
| Number of Output Rails | — | 20 (5 switching + 14 LDO + 1 reserved/monitor rail) |
| Switching Regulators | — | 5 (buck/boost configurable) |
| LDO Regulators | — | 14 |
| Switching Frequency Range | — | 1.0 MHz to 4.0 MHz |
| Integrated ADC | — | Yes (rail voltage monitoring) |
| Voltage Control Bits | — | 10-bit programmable |
| Gehäuse | — | 338-TFBGA (11x11 mm) |
| Package Family | — | MAP-BGA / TFBGA |
| Packaging | — | Tape & Reel (TR) |
| Target Applications | — | PCs, PDAs, ultra-mobile platforms, tablets, netbooks, embedded devices |
| Betriebstemperaturbereich | — | [DATA_NEEDED: operating temperature range] |