SPC5567MZQ132R vs SPC5567MZQ80R Vergleich
Detaillierter Direktvergleich von SPC5567MZQ132R von NXP Semiconductors und SPC5567MZQ80R von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
SPC5567MZQ132R - 32-bit MCU 2MB Flash FlexRay PBGA324 | NXP
SPC5567MZQ132R ✓ AktivNXP Semiconductors
SPC5567MZQ80R - 32-bit MCU, 80MHz, 2MB Flash, FlexRay | NXP
SPC5567MZQ80R ✓ AktivSpezifikationsvergleich
| Parameter | SPC5567MZQ132R | SPC5567MZQ80R |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $24,85 | $51,40 |
| Core | Power Architecture e200z6 (32-bit RISC) | — |
| Maximum CPU Frequency | 132 MHz | 80 MHz |
| Flash Memory | 2 MB with ECC | — |
| SRAM | 64 KB with ECC | — |
| Instruction Cache | 32 KB unified | — |
| Operating Voltage | 1.5 V core / 3.3 V / 5 V I/O | — |
| CAN Interfaces | 5 (FlexCAN with CAN-FD) | — |
| FlexRay Channels | 2 (dual-channel) | — |
| Ethernet | 10/100 Mbps MAC | — |
| eDMA Channels | 64 | — |
| Gehäuse | PBGA-324 (ZQC) | PBGA-324 |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebstemperatur | -40 °C to +125 °C | — |
| Automotive Grade | AEC-Q100 qualified | — |
| MSL-Level | 3 (168 hours) | [DATA_NEEDED: MSL rating] |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Safety Architecture | FCCU, ECC on Flash/SRAM, watchdog, lockstep option | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Core Architecture | — | Power Architecture (e200 z6) |
| Bit Width | — | 32-bit |
| On-Chip Flash | — | 2 MB |
| On-Chip RAM | — | [DATA_NEEDED: SRAM size] |
| Betriebstemperaturbereich | — | -40C to +125C (Automotive Grade) |
| Communication Interfaces | — | FlexRay, CAN, SPI, SCI |
| Lockstep / Safety | — | Dual-core lockstep architecture |
| Automotive Qualification | — | AEC-Q100 (per automotive temperature grade) |
| Terminal Form | — | BALL |
| Number of Terminals | — | 324 |