SPC5567MZQ132R vs SPC5567MZQ80R Comparación
Comparación detallada lado a lado de SPC5567MZQ132R por NXP Semiconductors y SPC5567MZQ80R por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
SPC5567MZQ132R - 32-bit MCU 2MB Flash FlexRay PBGA324 | NXP
SPC5567MZQ132R ✓ ActivoNXP Semiconductors
SPC5567MZQ80R - 32-bit MCU, 80MHz, 2MB Flash, FlexRay | NXP
SPC5567MZQ80R ✓ ActivoComparación de especificaciones
| Parámetro | SPC5567MZQ132R | SPC5567MZQ80R |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $24,85 | $51,40 |
| Core | Power Architecture e200z6 (32-bit RISC) | — |
| Maximum CPU Frequency | 132 MHz | 80 MHz |
| Flash Memory | 2 MB with ECC | — |
| SRAM | 64 KB with ECC | — |
| Instruction Cache | 32 KB unified | — |
| Operating Voltage | 1.5 V core / 3.3 V / 5 V I/O | — |
| CAN Interfaces | 5 (FlexCAN with CAN-FD) | — |
| FlexRay Channels | 2 (dual-channel) | — |
| Ethernet | 10/100 Mbps MAC | — |
| eDMA Channels | 64 | — |
| Encapsulado | PBGA-324 (ZQC) | PBGA-324 |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de funcionamiento | -40 °C to +125 °C | — |
| Automotive Grade | AEC-Q100 qualified | — |
| Nivel MSL | 3 (168 hours) | [DATA_NEEDED: MSL rating] |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Safety Architecture | FCCU, ECC on Flash/SRAM, watchdog, lockstep option | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Core Architecture | — | Power Architecture (e200 z6) |
| Bit Width | — | 32-bit |
| On-Chip Flash | — | 2 MB |
| On-Chip RAM | — | [DATA_NEEDED: SRAM size] |
| Rango de temperatura de funcionamiento | — | -40C to +125C (Automotive Grade) |
| Communication Interfaces | — | FlexRay, CAN, SPI, SCI |
| Lockstep / Safety | — | Dual-core lockstep architecture |
| Automotive Qualification | — | AEC-Q100 (per automotive temperature grade) |
| Terminal Form | — | BALL |
| Number of Terminals | — | 324 |