SPC5601PEF0MLL6 vs SPC5602PEF0MLL6 Vergleich
Detaillierter Direktvergleich von SPC5601PEF0MLL6 von NXP Semiconductors und SPC5602PEF0MLL6 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
SPC5601PEF0MLL6 - 32-bit Power Arch MCU, 192KB Flash, 100-LQFP | NXP
SPC5601PEF0MLL6 ✓ AktivSpezifikationsvergleich
| Parameter | SPC5601PEF0MLL6 | SPC5602PEF0MLL6 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $8,75 | $8,20 |
| Core Processor | e200z0h (Power Architecture) | e200z0h (Power Architecture) |
| Core Size | 32-Bit Single-Core | 32-bit |
| Core Architecture | Power Architecture, single-issue, in-order | — |
| Speed (Max) | 64 MHz | — |
| Program Memory Size (Flash) | 192 KB (192K x 8) | — |
| RAM Size | 12 KB | 20 KB |
| Connectivity | CANbus, LINbus, SCI (UART), SPI | — |
| Peripherals | DMA, POR, PWM, WDT (Watchdog) | — |
| Number of I/O | 79 | [DATA_NEEDED: number of GPIO] |
| Gehäuse / Bauform | 100-LQFP (14x14 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Terminal Form | GULL WING | — |
| Peak Reflow Temperature | 260C (JEDEC lead-free profile) | — |
| Betriebstemperaturbereich | -40C to +125C | — |
| Supply Voltage Range | [DATA_NEEDED: VDD minimum/nominal/maximum] | — |
| Grade | Automotive Grade (AEC-Q100) | — |
| Series / Family | MPC56xx Qorivva | — |
| RoHS-Status | Compliant (lead-free per package datasheet) | [DATA_NEEDED: RoHS status] |
| Maximale Taktfrequenz | — | 64 MHz |
| Program Memory (Flash) | — | 256 KB (256K x 8) |
| Versorgungsspannung | — | 3.3 V / 5 V |
| Gehäuse | — | 100-LQFP (14x14 mm) |
| Qualification | — | AEC-Q100 (automotive) |
| Product Family | — | Qorivva MPC560xP |
| CAN Controller | — | FlexCAN integrated |
| Application Domain | — | Automotive chassis, body, industrial |
| Packaging | — | Tray |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature range] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution] |
| MSL-Level | — | [DATA_NEEDED: moisture sensitivity level] |