SPC5642AF2MVZ3 vs SPC5643LFF2MMM1R Vergleich

Detaillierter Direktvergleich von SPC5642AF2MVZ3 von NXP Semiconductors und SPC5643LFF2MMM1R von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
SPC5642AF2MVZ3 SPC5642AF2MVZ3 32-Bit 80MHz Automotive MCU | NXP

SPC5642AF2MVZ3 32-Bit 80MHz Automotive MCU | NXP

SPC5642AF2MVZ3 ✓ Aktiv
NXP Semiconductors
SPC5643LFF2MMM1R SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP

SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP

SPC5643LFF2MMM1R ✓ Aktiv

Spezifikationsvergleich

Parameter SPC5642AF2MVZ3 SPC5643LFF2MMM1R
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $24,85
Device Type 32-bit automotive microcontroller —
Processor Core Power Architecture core —
Architecture 32-bit —
Maximum Operating Frequency 80 MHz —
Flash Memory 2 MB —
Flash Organization 2M x 8 bits —
Family MPC56xx Qorivva —
Betriebstemperaturbereich -40°C to +105°C -40 °C to +125 °C (automotive grade)
Temperature Grade Automotive Grade —
Package Type PBGA-324 —
Package Body Size 23 mm x 23 mm —
Terminal Form Ball —
Montageart Surface Mount Surface Mount (BGA)
Intended Applications Powertrain, chassis, engine control, transmission control, and industrial applications —
Versorgungsspannung [DATA_NEEDED: Supply Voltage] —
RAM Memory [DATA_NEEDED: RAM Memory] —
Number of I/O Pins [DATA_NEEDED: Number of I/O Pins] —
Security and Diagnostics Features [DATA_NEEDED: Security and Diagnostics Features] —
Manufacturer — NXP Semiconductors (formerly Freescale)
Series — MPC5643L (MPC56xx Qorivva family)
Core Architecture — Power Architecture® e200z4 (dual-core with delayed lockstep)
Core Count — 2 (1 main + 1 lockstep checker)
Maximum CPU Clock — 120 MHz
Program Memory (Flash) — 1 MB (1M x 8)
Data Memory (SRAM) — [DATA_NEEDED: SRAM size]
Operating Voltage Range — [DATA_NEEDED: VDD range, typ. 3.3 V or 5 V I/O]
Gehäuse — 257-LFBGA / MAPBGA 14x14 mm
AEC-Q100 Qualification — Yes (Automotive qualified per NXP product page)
Functional Safety Target — ISO 26262 ASIL-D capable (via lockstep + ECC + FCU)
Communication Interfaces — FlexCAN, SPI, I²C, UART (LIN-capable via SCI)
Debug Interface — Nexus (JTAG, auxiliary)
Lead-Free / RoHS — Compliant (lead-free BGA)

Datenblätter & Ressourcen

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