SPC5642AF2MVZ3 vs SPC5643LFF2MMM1R Comparação

Comparação detalhada lado a lado de SPC5642AF2MVZ3 por NXP Semiconductors e SPC5643LFF2MMM1R por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
SPC5642AF2MVZ3 SPC5642AF2MVZ3 32-Bit 80MHz Automotive MCU | NXP

SPC5642AF2MVZ3 32-Bit 80MHz Automotive MCU | NXP

SPC5642AF2MVZ3 ✓ Ativo
NXP Semiconductors
SPC5643LFF2MMM1R SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP

SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP

SPC5643LFF2MMM1R ✓ Ativo

Comparação de especificações

Parâmetro SPC5642AF2MVZ3 SPC5643LFF2MMM1R
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $0,00 $24,85
Device Type 32-bit automotive microcontroller —
Processor Core Power Architecture core —
Architecture 32-bit —
Maximum Operating Frequency 80 MHz —
Flash Memory 2 MB —
Flash Organization 2M x 8 bits —
Family MPC56xx Qorivva —
Faixa de temperatura de operação -40°C to +105°C -40 °C to +125 °C (automotive grade)
Temperature Grade Automotive Grade —
Package Type PBGA-324 —
Package Body Size 23 mm x 23 mm —
Terminal Form Ball —
Tipo de montagem Surface Mount Surface Mount (BGA)
Intended Applications Powertrain, chassis, engine control, transmission control, and industrial applications —
Tensão de alimentação [DATA_NEEDED: Supply Voltage] —
RAM Memory [DATA_NEEDED: RAM Memory] —
Number of I/O Pins [DATA_NEEDED: Number of I/O Pins] —
Security and Diagnostics Features [DATA_NEEDED: Security and Diagnostics Features] —
Manufacturer — NXP Semiconductors (formerly Freescale)
Series — MPC5643L (MPC56xx Qorivva family)
Core Architecture — Power Architecture® e200z4 (dual-core with delayed lockstep)
Core Count — 2 (1 main + 1 lockstep checker)
Maximum CPU Clock — 120 MHz
Program Memory (Flash) — 1 MB (1M x 8)
Data Memory (SRAM) — [DATA_NEEDED: SRAM size]
Operating Voltage Range — [DATA_NEEDED: VDD range, typ. 3.3 V or 5 V I/O]
Encapsulamento — 257-LFBGA / MAPBGA 14x14 mm
AEC-Q100 Qualification — Yes (Automotive qualified per NXP product page)
Functional Safety Target — ISO 26262 ASIL-D capable (via lockstep + ECC + FCU)
Communication Interfaces — FlexCAN, SPI, I²C, UART (LIN-capable via SCI)
Debug Interface — Nexus (JTAG, auxiliary)
Lead-Free / RoHS — Compliant (lead-free BGA)

Fichas técnicas e recursos

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