STM8S103F3M6 vs STM8S103F2P6 Vergleich

Detaillierter Direktvergleich von STM8S103F3M6 von STMicroelectronics und STM8S103F2P6 von STMicroelectronics. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

STMicroelectronics
STM8S103F3M6 STM8S103F3M6 - 16MHz 8KB 8-Bit MCU | STMicroelectronics

STM8S103F3M6 - 16MHz 8KB 8-Bit MCU | STMicroelectronics

STM8S103F3M6 ✓ Aktiv
STMicroelectronics
STM8S103F2P6 STM8S103F2P6 - 16MHz 8-Bit 4KB MCU | STMicroelectronics

STM8S103F2P6 - 16MHz 8-Bit 4KB MCU | STMicroelectronics

STM8S103F2P6 ✓ Aktiv

Spezifikationsvergleich

Parameter STM8S103F3M6 STM8S103F2P6
Marke STMicroelectronics STMicroelectronics
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Microcontroller Type 8-bit microcontroller —
Product Series STM8S STM8S103 access line
Access Line STM8S103F2/x3 access line —
Maximum Clock Speed 16 MHz —
Flash Program Memory 8 KB 4 KB (4K x 8)
Flash Organization 8K × 8 —
Integrated Data EEPROM Present; true EEPROM —
Supply Voltage Range 2.95 V to 5.5 V [DATA_NEEDED: supply voltage range]
I/O Port Count 16 —
Package Type 20-pin SOIC —
Package Width 7.50 mm —
Montageart Surface mount Surface mount
Tube Shipping Package 20-SO tube —
Lifecycle Stage Active —
Program Memory Type Flash —
RAM Capacity [DATA_NEEDED: RAM capacity] —
Betriebstemperaturbereich [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
RoHS Compliance [DATA_NEEDED: RoHS compliance] —
REACH Compliance [DATA_NEEDED: REACH compliance] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] [DATA_NEEDED: AEC-Q100 qualification status]
Product Type — 8-bit microcontroller (MCU)
Maximale Taktfrequenz — 16 MHz
Data EEPROM — Integrated true data EEPROM; capacity [DATA_NEEDED: data EEPROM capacity]
ADC Resolution — 10 bit
Timer Count — 3 timers
Serial Interfaces — UART, SPI, and I2C
Core Architecture — STM8 core with Harvard architecture and 3-stage pipeline
Gehäuse — 20-TSSOP
Package Dimensions — 4.40 mm width
RAM — [DATA_NEEDED: RAM capacity]
GPIO Count — [DATA_NEEDED: GPIO count]
RoHS-Status — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]

Datenblätter & Ressourcen

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