STM8S103F3M6 vs STM8S103F2P6 Comparação

Comparação detalhada lado a lado de STM8S103F3M6 por STMicroelectronics e STM8S103F2P6 por STMicroelectronics. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

STMicroelectronics
STM8S103F3M6 STM8S103F3M6 - 16MHz 8KB 8-Bit MCU | STMicroelectronics

STM8S103F3M6 - 16MHz 8KB 8-Bit MCU | STMicroelectronics

STM8S103F3M6 ✓ Ativo
STMicroelectronics
STM8S103F2P6 STM8S103F2P6 - 16MHz 8-Bit 4KB MCU | STMicroelectronics

STM8S103F2P6 - 16MHz 8-Bit 4KB MCU | STMicroelectronics

STM8S103F2P6 ✓ Ativo

Comparação de especificações

Parâmetro STM8S103F3M6 STM8S103F2P6
Marca STMicroelectronics STMicroelectronics
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Ativo Ativo
Microcontroller Type 8-bit microcontroller —
Product Series STM8S STM8S103 access line
Access Line STM8S103F2/x3 access line —
Maximum Clock Speed 16 MHz —
Flash Program Memory 8 KB 4 KB (4K x 8)
Flash Organization 8K × 8 —
Integrated Data EEPROM Present; true EEPROM —
Supply Voltage Range 2.95 V to 5.5 V [DATA_NEEDED: supply voltage range]
I/O Port Count 16 —
Package Type 20-pin SOIC —
Package Width 7.50 mm —
Tipo de montagem Surface mount Surface mount
Tube Shipping Package 20-SO tube —
Lifecycle Stage Active —
Program Memory Type Flash —
RAM Capacity [DATA_NEEDED: RAM capacity] —
Faixa de temperatura de operação [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
RoHS Compliance [DATA_NEEDED: RoHS compliance] —
REACH Compliance [DATA_NEEDED: REACH compliance] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] [DATA_NEEDED: AEC-Q100 qualification status]
Product Type — 8-bit microcontroller (MCU)
Frequência máxima de clock — 16 MHz
Data EEPROM — Integrated true data EEPROM; capacity [DATA_NEEDED: data EEPROM capacity]
ADC Resolution — 10 bit
Timer Count — 3 timers
Serial Interfaces — UART, SPI, and I2C
Core Architecture — STM8 core with Harvard architecture and 3-stage pipeline
Encapsulamento — 20-TSSOP
Package Dimensions — 4.40 mm width
RAM — [DATA_NEEDED: RAM capacity]
GPIO Count — [DATA_NEEDED: GPIO count]
Status RoHS — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]

Fichas técnicas e recursos

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