XC3S400-4FT256C vs XC3S400A-4FTG256C Vergleich

Detaillierter Direktvergleich von XC3S400-4FT256C von AMD und XC3S400A-4FTG256C von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter XC3S400-4FT256C XC3S400A-4FTG256C
Marke AMD AMD
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Unknown Aktiv
Device Type Spartan-3 Field Programmable Gate Array (FPGA) IC —
System Gates 400,000 gates 400,000
Configurable Logic Cells 8,064 cells —
User I/O 173 I/O —
Core Voltage 1.2 V —
Performance Grade -4 speed grade —
Temperature Grade Commercial —
Gehäuse 256-LBGA 256-FTBGA (FTG256), 17 × 17 mm
Package Type FTBGA-256 —
Montageart Surface Mount Surface Mount (BGA)
Terminal Type Ball —
Terminal Count 256 balls —
Logic Family Spartan-3 —
RoHS-Status Compliant —
Programming Technology [DATA_NEEDED: Programming technology] —
Betriebstemperaturbereich [DATA_NEEDED: Operating temperature range] —
Maximum Operating Frequency [DATA_NEEDED: XC3S400-4FT256C maximum operating frequency] —
I/O Standards [DATA_NEEDED: Supported I/O standards] —
Block RAM [DATA_NEEDED: Block RAM capacity] —
Dedicated Multipliers [DATA_NEEDED: Dedicated multiplier count] 4 (18 × 18-bit signed)
Family — Spartan-3A
Manufacturer — AMD (Xilinx)
Logic Cells — 8,064
Block RAM Bits — 368,640
Block RAM Blocks — 20 (18 Kbit each)
User I/Os — 195
Digital Clock Managers (DCMs) — 4
Speed/Grade — -4 (commercial)
Max Internal Clock — 770 MHz
Betriebstemperatur — 0°C to +85°C (commercial)
Process — 90 nm CMOS
Configuration Modes — SPI, BPI, JTAG

Datenblätter & Ressourcen

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