XC6SLX16-3FT256C vs XC6SLX16-2FTG256C Vergleich

Detaillierter Direktvergleich von XC6SLX16-3FT256C von AMD und XC6SLX16-2FTG256C von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter XC6SLX16-3FT256C XC6SLX16-2FTG256C
Marke AMD AMD
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv NRND
Product Type Spartan-6 LX Field-Programmable Gate Array —
Logic Elements 14,579 LE —
Configurable Logic Blocks 1,139 CLBs —
Total Block RAM 589,824 bits —
Maximale Taktfrequenz 667 MHz —
Process Technology 45 nm CMOS —
Core Supply Voltage 1.2 V —
Input/Output Count 186 I/O —
Gehäuse 256-LBGA 256-ball Fine-Pitch Thin BGA (FTG256), 17×17 mm, 1.0 mm pitch
Package Dimensions 17 mm x 17 mm —
Package Pitch 1.0 mm —
Montageart Surface Mount Surface Mount
Performance Grade -3 speed grade —
Temperature Grade Suffix C suffix —
Lead-Free Status Lead-free —
RoHS-Status [DATA_NEEDED: RoHS compliance] —
REACH Status [DATA_NEEDED: REACH compliance] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Betriebstemperaturbereich [DATA_NEEDED: operating temperature range] —
Differential I/O [DATA_NEEDED: differential I/O capability] —
Family — Spartan-6 LX
Logic Cells — 14,579
Configurable Logic Blocks (CLBs) — 1,139
Slices — 2,278
Block RAM Bits — 589,824 bits
Block RAM Blocks (18 Kb) — 32
DSP Slices (18×18 multipliers) — 32
Maximum User I/Os — 186
Maximum Single-Ended I/O Banks — 4
Process Node — 45 nm CMOS, 9-metal layer
Speed Grade — -2
Supply Voltage (Core) — 1.2 V nominal
Betriebstemperatur — 0 °C to +85 °C (Commercial)
Lead-Free / RoHS — Yes (compliant)
Configuration Modes — JTAG, SPI (x1/x2/x4), BPI (x8/x16), Slave-Parallel
Clock Management Tiles (CMTs) — 2 (each with PLL + MMCM)
PCIe Support — Soft IP only (no integrated PCIe hard cores)

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