XC6SLX16-3FT256C vs XC6SLX16-2FTG256C 对比
详细并排对比 XC6SLX16-3FT256C 出自 AMD 和 XC6SLX16-2FTG256C 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | XC6SLX16-3FT256C | XC6SLX16-2FTG256C |
|---|---|---|
| 品牌 | AMD | AMD |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 不推荐新设计 |
| Product Type | Spartan-6 LX Field-Programmable Gate Array | — |
| Logic Elements | 14,579 LE | — |
| Configurable Logic Blocks | 1,139 CLBs | — |
| Total Block RAM | 589,824 bits | — |
| 最大时钟频率 | 667 MHz | — |
| Process Technology | 45 nm CMOS | — |
| Core Supply Voltage | 1.2 V | — |
| Input/Output Count | 186 I/O | — |
| 封装 | 256-LBGA | 256-ball Fine-Pitch Thin BGA (FTG256), 17×17 mm, 1.0 mm pitch |
| Package Dimensions | 17 mm x 17 mm | — |
| Package Pitch | 1.0 mm | — |
| 安装类型 | Surface Mount | Surface Mount |
| Performance Grade | -3 speed grade | — |
| Temperature Grade Suffix | C suffix | — |
| Lead-Free Status | Lead-free | — |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance] | — |
| REACH Status | [DATA_NEEDED: REACH compliance] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| 工作温度范围 | [DATA_NEEDED: operating temperature range] | — |
| Differential I/O | [DATA_NEEDED: differential I/O capability] | — |
| Family | — | Spartan-6 LX |
| Logic Cells | — | 14,579 |
| Configurable Logic Blocks (CLBs) | — | 1,139 |
| Slices | — | 2,278 |
| Block RAM Bits | — | 589,824 bits |
| Block RAM Blocks (18 Kb) | — | 32 |
| DSP Slices (18×18 multipliers) | — | 32 |
| Maximum User I/Os | — | 186 |
| Maximum Single-Ended I/O Banks | — | 4 |
| Process Node | — | 45 nm CMOS, 9-metal layer |
| Speed Grade | — | -2 |
| Supply Voltage (Core) | — | 1.2 V nominal |
| 工作温度 | — | 0 °C to +85 °C (Commercial) |
| Lead-Free / RoHS | — | Yes (compliant) |
| Configuration Modes | — | JTAG, SPI (x1/x2/x4), BPI (x8/x16), Slave-Parallel |
| Clock Management Tiles (CMTs) | — | 2 (each with PLL + MMCM) |
| PCIe Support | — | Soft IP only (no integrated PCIe hard cores) |