XC6SLX16-3FT256C vs XC6SLX16-3FT256I Vergleich

Detaillierter Direktvergleich von XC6SLX16-3FT256C von AMD und XC6SLX16-3FT256I von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter XC6SLX16-3FT256C XC6SLX16-3FT256I
Marke AMD AMD
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Product Type Spartan-6 LX Field-Programmable Gate Array —
Logic Elements 14,579 LE —
Configurable Logic Blocks 1,139 CLBs —
Total Block RAM 589,824 bits —
Maximale Taktfrequenz 667 MHz —
Process Technology 45 nm CMOS 45 nm CMOS
Core Supply Voltage 1.2 V 1.2 V
Input/Output Count 186 I/O —
Gehäuse 256-LBGA 256-LBGA / FTBGA-256 (FT256), surface-mount ball grid
Package Dimensions 17 mm x 17 mm —
Package Pitch 1.0 mm —
Montageart Surface Mount Surface Mount
Performance Grade -3 speed grade —
Temperature Grade Suffix C suffix —
Lead-Free Status Lead-free Lead-free package construction
RoHS-Status [DATA_NEEDED: RoHS compliance] —
REACH Status [DATA_NEEDED: REACH compliance] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Betriebstemperaturbereich [DATA_NEEDED: operating temperature range] —
Differential I/O [DATA_NEEDED: differential I/O capability] —
Device Type — Field Programmable Gate Array (FPGA)
FPGA Family — Spartan-6 LX (logic-optimized)
Logic Cells — 14,579 cells
Configurable Logic Blocks (CLBs) — 1,139 CLBs
User I/O Count — 186 I/O
Max Internal Frequency — 667 MHz
Speed Grade — -3 (highest Spartan-6 LX performance grade)
Package Body Size — 17 x 17 mm, 1.0 mm ball pitch
Terminal Count — 256 terminals
Betriebstemperatur — 0 C to +85 C (32 F to 185 F)
Temperature Grade Marking — Industrial
Package Code — LBGA / FT256
Block RAM Capacity — [DATA_NEEDED: block RAM capacity]
DSP Slice Count — [DATA_NEEDED: DSP slice count]
Configuration Interface Details — [DATA_NEEDED: configuration interface details]

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