XC6SLX16-3FT256C vs XC6SLX16-3FT256I Comparaison
Comparaison détaillée côte à côte de XC6SLX16-3FT256C par AMD et XC6SLX16-3FT256I par AMD. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | XC6SLX16-3FT256C | XC6SLX16-3FT256I |
|---|---|---|
| Marque | AMD | AMD |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Product Type | Spartan-6 LX Field-Programmable Gate Array | — |
| Logic Elements | 14,579 LE | — |
| Configurable Logic Blocks | 1,139 CLBs | — |
| Total Block RAM | 589,824 bits | — |
| Fréquence d'horloge maximale | 667 MHz | — |
| Process Technology | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Input/Output Count | 186 I/O | — |
| Boîtier | 256-LBGA | 256-LBGA / FTBGA-256 (FT256), surface-mount ball grid |
| Package Dimensions | 17 mm x 17 mm | — |
| Package Pitch | 1.0 mm | — |
| Type de montage | Surface Mount | Surface Mount |
| Performance Grade | -3 speed grade | — |
| Temperature Grade Suffix | C suffix | — |
| Lead-Free Status | Lead-free | Lead-free package construction |
| Statut RoHS | [DATA_NEEDED: RoHS compliance] | — |
| REACH Status | [DATA_NEEDED: REACH compliance] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Plage de température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Differential I/O | [DATA_NEEDED: differential I/O capability] | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| FPGA Family | — | Spartan-6 LX (logic-optimized) |
| Logic Cells | — | 14,579 cells |
| Configurable Logic Blocks (CLBs) | — | 1,139 CLBs |
| User I/O Count | — | 186 I/O |
| Max Internal Frequency | — | 667 MHz |
| Speed Grade | — | -3 (highest Spartan-6 LX performance grade) |
| Package Body Size | — | 17 x 17 mm, 1.0 mm ball pitch |
| Terminal Count | — | 256 terminals |
| Température de fonctionnement | — | 0 C to +85 C (32 F to 185 F) |
| Temperature Grade Marking | — | Industrial |
| Package Code | — | LBGA / FT256 |
| Block RAM Capacity | — | [DATA_NEEDED: block RAM capacity] |
| DSP Slice Count | — | [DATA_NEEDED: DSP slice count] |
| Configuration Interface Details | — | [DATA_NEEDED: configuration interface details] |