XC6SLX16-3FT256I vs XC6SLX16-2FT256C Vergleich

Detaillierter Direktvergleich von XC6SLX16-3FT256I von AMD und XC6SLX16-2FT256C von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter XC6SLX16-3FT256I XC6SLX16-2FT256C
Marke AMD AMD
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Device Type Field Programmable Gate Array (FPGA) FPGA
FPGA Family Spartan-6 LX (logic-optimized) Spartan-6 LX
Logic Cells 14,579 cells —
Configurable Logic Blocks (CLBs) 1,139 CLBs —
User I/O Count 186 I/O —
Max Internal Frequency 667 MHz —
Process Technology 45 nm CMOS 45 nm CMOS
Core Supply Voltage 1.2 V 1.2 V
Speed Grade -3 (highest Spartan-6 LX performance grade) -2
Gehäuse 256-LBGA / FTBGA-256 (FT256), surface-mount ball grid 256-LBGA
Package Body Size 17 x 17 mm, 1.0 mm ball pitch —
Terminal Count 256 terminals 256 terminals
Betriebstemperatur 0 C to +85 C (32 F to 185 F) 0°C to 85°C
Temperature Grade Marking Industrial —
Lead-Free Status Lead-free package construction Lead free
Montageart Surface Mount Surface Mount
Package Code LBGA / FT256 —
Block RAM Capacity [DATA_NEEDED: block RAM capacity] —
DSP Slice Count [DATA_NEEDED: DSP slice count] —
Configuration Interface Details [DATA_NEEDED: configuration interface details] —
Configurable Logic Cells — 14,579 cells
Configurable Logic Blocks — 1,139 CLBs
Internal Frequency — 667 MHz
I/O Count — 186 I/O
Temperature Grade — C, commercial
Package Shape — Square
Terminal Form — Ball
RoHS-Status — [DATA_NEEDED: RoHS compliance status]
REACH Status — [DATA_NEEDED: REACH compliance status]
Block RAM — [DATA_NEEDED: block RAM capacity]
DSP Resources — [DATA_NEEDED: DSP resource count]

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