XC6SLX16-3FTG256C vs XC6SLX16-2FTG256C Vergleich
Detaillierter Direktvergleich von XC6SLX16-3FTG256C von AMD und XC6SLX16-2FTG256C von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | XC6SLX16-3FTG256C | XC6SLX16-2FTG256C |
|---|---|---|
| Marke | AMD | AMD |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $24,50 | $16,41 |
| Family | Spartan-6 LX | Spartan-6 LX |
| Series | XC6SLX16 | — |
| Logic Cells | 14,579 | 14,579 |
| Configurable Logic Blocks (CLBs) | 1139 | 1,139 |
| Distributed RAM | 256 kbit | — |
| Block RAM | [DATA_NEEDED: total Kbits] | — |
| DSP48A1 Slices | 32 | — |
| Maximum User I/Os | 186 | 186 |
| User I/O Banks | [DATA_NEEDED: count] | — |
| Number of CMTs | 2 | — |
| Process Technology | 45 nm CMOS | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Auxiliary Voltage (VCCAUX) | 2.5 V to 3.3 V | — |
| Speed Grade | -3 | -2 |
| Gehäuse | 256-LBGA / FTBGA-256, 17 x 17 mm, 1.0 mm pitch | 256-ball Fine-Pitch Thin BGA (FTG256), 17×17 mm, 1.0 mm pitch |
| Betriebstemperatur | 0 C to +85 C (Commercial) | 0 °C to +85 °C (Commercial) |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | — |
| Slices | — | 2,278 |
| Block RAM Bits | — | 589,824 bits |
| Block RAM Blocks (18 Kb) | — | 32 |
| DSP Slices (18×18 multipliers) | — | 32 |
| Maximum Single-Ended I/O Banks | — | 4 |
| Process Node | — | 45 nm CMOS, 9-metal layer |
| Supply Voltage (Core) | — | 1.2 V nominal |
| Lead-Free / RoHS | — | Yes (compliant) |
| Configuration Modes | — | JTAG, SPI (x1/x2/x4), BPI (x8/x16), Slave-Parallel |
| Clock Management Tiles (CMTs) | — | 2 (each with PLL + MMCM) |
| PCIe Support | — | Soft IP only (no integrated PCIe hard cores) |