XC6SLX45-2FGG676I vs XC6SLX75-2FGG676I Vergleich
Detaillierter Direktvergleich von XC6SLX45-2FGG676I von AMD und XC6SLX75-2FGG676I von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | XC6SLX45-2FGG676I | XC6SLX75-2FGG676I |
|---|---|---|
| Marke | AMD | AMD |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Family | Spartan-6 LX | — |
| Part Number | XC6SLX45-2FGG676I | — |
| Logic Cells | 43,661 | 74,637 cells |
| Configurable Logic Blocks (CLBs) | 3,411 | — |
| Total Flip-Flops | 54,576 | — |
| Block RAM | 2,088 Kbit | [DATA_NEEDED: block RAM capacity] |
| DSP48A1 Slices | 58 | — |
| User I/Os | 358 | — |
| Number of I/O Banks | 4 | — |
| Core Voltage | 1.2 V | — |
| Internal Frequency | 500 MHz | 667 MHz |
| Gehäuse | 676-ball FBGA (FGG676), 27 x 27 mm, 1.0 mm pitch | — |
| Operating Temperature (Industrial) | -40 °C to +100 °C | — |
| Speed Grade | -2 | -2 |
| Process Technology | 45 nm CMOS | 45 nm CMOS |
| Compliance | RoHS compliant, Lead Free | — |
| Device Type | — | Spartan-6 LX field-programmable gate array (FPGA) |
| Configurable Logic Blocks | — | 5,831 CLBs |
| Input/Output Count | — | 408 I/O |
| Versorgungsspannung | — | 1 V |
| Package Type | — | 676-ball FBGA |
| Package Dimensions | — | 27 mm × 27 mm |
| Ball Pitch | — | 1 mm |
| Montageart | — | Surface mount |
| Betriebstemperatur | — | -40°C to +100°C |
| Lead-Free Status | — | Lead free |
| Device Family | — | Spartan-6 LX |
| FPGA Configuration | — | [DATA_NEEDED: FPGA configuration interface and supported configuration modes] |
| DSP Resources | — | [DATA_NEEDED: DSP slice count] |
| RoHS Compliance | — | [DATA_NEEDED: RoHS compliance status] |
| REACH Compliance | — | [DATA_NEEDED: REACH compliance status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification status] |