XC6SLX9-N3FT256I vs XC6SLX9-2FTG256C Vergleich
Detaillierter Direktvergleich von XC6SLX9-N3FT256I von AMD und XC6SLX9-2FTG256C von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | XC6SLX9-N3FT256I | XC6SLX9-2FTG256C |
|---|---|---|
| Marke | AMD | AMD |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Unknown | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $27,85 |
| Device Type | Spartan-6 LX Field Programmable Gate Array (FPGA) | — |
| Logic Elements | 9,152 | — |
| I/O Count | 186 | — |
| RAM Bits | 589,824 | — |
| Gehäuse | 256-LBGA | 256-ball FTBGA (FTG256), 17 x 17 mm, 1.0 mm pitch |
| Package Description | 256-FTBGA surface-mount package, 17 mm x 17 mm | — |
| Supply Voltage Range | 1.14 V to 1.26 V | — |
| Betriebs-Sperrschichttemperatur | -40°C to 100°C | — |
| Speed Designation | N3 | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Programmable Logic Type | FPGA | — |
| Configuration Memory | [DATA_NEEDED: configuration memory type and capacity] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards] | — |
| Betriebstemperaturbereich | [DATA_NEEDED: full operating temperature range] | — |
| Lebenszyklusstatus | [DATA_NEEDED: manufacturer lifecycle status] | — |
| RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH | [DATA_NEEDED: REACH status] | — |
| Pin-Anzahl | 256 balls | — |
| Manufacturer | AMD | — |
| Series | — | Spartan-6 LX |
| Device Logic Cells | — | 9,152 LE |
| Adaptive Logic Modules (ALMs) | — | 1,430 ALM |
| Configurable Logic Blocks (CLBs) | — | 715 CLB |
| Embedded Block RAM | — | 576 Kbits |
| Distributed RAM | — | 32 Kbits |
| DSP / Multiplier Blocks | — | 16 (18 x 18 multipliers) |
| Maximum User I/Os | — | 186 |
| Speed Grade | — | -2 (commercial) |
| Internal Performance | — | Up to 667 MHz |
| Process Technology | — | 45 nm low-power CMOS |
| Betriebstemperatur | — | 0 C to 85 C (commercial) |
| Versorgungsspannung | — | 1.2 V core / 1.2 V-3.3 V I/O (per DS160) |
| RoHS-Status | — | Compliant (lead-free FTBGA) |
| Configuration Modes | — | SPI, JTAG, BPI, Master Serial |