XPC8260CVVIFBC vs MPC8260ACZUMIBB Vergleich
Detaillierter Direktvergleich von XPC8260CVVIFBC von NXP Semiconductors und MPC8260ACZUMIBB von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
XPC8260CVVIFBC - 200MHz PowerQUICC II G2 MPU | NXP | Network/Telecom
XPC8260CVVIFBC ✓ AktivNXP Semiconductors
MPC8260ACZUMIBB - PowerQUICC II MPU 266MHz 480-TBGA | NXP
MPC8260ACZUMIBB ObsoleteSpezifikationsvergleich
| Parameter | XPC8260CVVIFBC | MPC8260ACZUMIBB |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $219,50 | $200,00 |
| Processor Type | PowerPC G2 Microprocessor IC MPC82xx (PowerQUICC II) | — |
| Core Architecture | PowerPC G2, 1 Core, 32-Bit | — |
| CPU Clock Speed | 200 MHz | — |
| Core Supply Voltage | 2.5 V | — |
| Communications Processor Module (CPM) | Integrated (per PowerQUICC II architecture) | — |
| Gehäuse / Bauform | 480-LBGA (TBGA), 37.5 x 37.5 mm | — |
| Terminal Form | Ball | — |
| Number of Terminals | 480 | — |
| Package Body Material | Plastic / Epoxy | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Packaging | Tray | — |
| Manufacturer Lifecycle Source | NXP Semiconductors (Freescale/Motorola legacy) | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance] | — |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| Series | PowerQUICC II (PQ II HIP 3) | — |
| Core Processor | — | PowerPC G2 |
| Architecture | — | RISC 32-bit |
| Number of Cores | — | 1 |
| Core Clock Speed | — | 266 MHz |
| Co-Processor / DSP | — | Communications; RISC CPM |
| RAM Controllers | — | DRAM, SDRAM |
| Graphics Acceleration | — | No |
| Display & Interface Controllers | — | None (per datasheet) |
| Supply Voltage - Core | — | 1.8 V |
| Supply Voltage - I/O | — | 3.3 V |
| Process Technology | — | 0.25 µm CMOS |
| Gehäuse | — | 480-TBGA (37.5 x 37.5 mm) |
| Betriebstemperatur | — | [DATA_NEEDED: full operating temperature range] |
| Part Status | — | Not For New Designs (No Longer Manufactured) |