XPC8260CVVIFBC vs MPC8260ACZUMIBB Comparación
Comparación detallada lado a lado de XPC8260CVVIFBC por NXP Semiconductors y MPC8260ACZUMIBB por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
XPC8260CVVIFBC - 200MHz PowerQUICC II G2 MPU | NXP | Network/Telecom
XPC8260CVVIFBC ✓ ActivoNXP Semiconductors
MPC8260ACZUMIBB - PowerQUICC II MPU 266MHz 480-TBGA | NXP
MPC8260ACZUMIBB ObsoleteComparación de especificaciones
| Parámetro | XPC8260CVVIFBC | MPC8260ACZUMIBB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $219,50 | $200,00 |
| Processor Type | PowerPC G2 Microprocessor IC MPC82xx (PowerQUICC II) | — |
| Core Architecture | PowerPC G2, 1 Core, 32-Bit | — |
| CPU Clock Speed | 200 MHz | — |
| Core Supply Voltage | 2.5 V | — |
| Communications Processor Module (CPM) | Integrated (per PowerQUICC II architecture) | — |
| Encapsulado / Carcasa | 480-LBGA (TBGA), 37.5 x 37.5 mm | — |
| Terminal Form | Ball | — |
| Number of Terminals | 480 | — |
| Package Body Material | Plastic / Epoxy | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Packaging | Tray | — |
| Manufacturer Lifecycle Source | NXP Semiconductors (Freescale/Motorola legacy) | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance] | — |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| Series | PowerQUICC II (PQ II HIP 3) | — |
| Core Processor | — | PowerPC G2 |
| Architecture | — | RISC 32-bit |
| Number of Cores | — | 1 |
| Core Clock Speed | — | 266 MHz |
| Co-Processor / DSP | — | Communications; RISC CPM |
| RAM Controllers | — | DRAM, SDRAM |
| Graphics Acceleration | — | No |
| Display & Interface Controllers | — | None (per datasheet) |
| Supply Voltage - Core | — | 1.8 V |
| Supply Voltage - I/O | — | 3.3 V |
| Process Technology | — | 0.25 µm CMOS |
| Encapsulado | — | 480-TBGA (37.5 x 37.5 mm) |
| Temperatura de funcionamiento | — | [DATA_NEEDED: full operating temperature range] |
| Part Status | — | Not For New Designs (No Longer Manufactured) |