XPC8260VVIFBC vs MPC8260ACZUMIBB Vergleich
Detaillierter Direktvergleich von XPC8260VVIFBC von NXP Semiconductors und MPC8260ACZUMIBB von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8260ACZUMIBB - PowerQUICC II MPU 266MHz 480-TBGA | NXP
MPC8260ACZUMIBB ObsoleteSpezifikationsvergleich
| Parameter | XPC8260VVIFBC | MPC8260ACZUMIBB |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $140,00 | $200,00 |
| Manufacturer | NXP Semiconductors | — |
| Part Family | PowerQUICC II (MPC82xx) | — |
| Core Architecture | PowerPC G2 (603e-derived), 32-bit RISC | — |
| Core Count | 1 | — |
| Maximum Core Clock | 200 MHz | — |
| Process Technology | 0.29 µm CMOS | 0.25 µm CMOS |
| Versorgungsspannung | 3.3 V | — |
| Communications Processor Module | PowerQUICC II CPM (dual 10/100 Ethernet, ATM, HDLC/PDMA) | — |
| External Data Bus | 64-bit | — |
| External Address Bus | 32-bit | — |
| Gehäuse | 480-TBGA (37.5 x 37.5 mm) | 480-TBGA (37.5 x 37.5 mm) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Temperature Grade | Commercial | — |
| RoHS-Status | Compliant | — |
| Lead-Free | Yes | — |
| Core Processor | — | PowerPC G2 |
| Architecture | — | RISC 32-bit |
| Number of Cores | — | 1 |
| Core Clock Speed | — | 266 MHz |
| Co-Processor / DSP | — | Communications; RISC CPM |
| RAM Controllers | — | DRAM, SDRAM |
| Graphics Acceleration | — | No |
| Display & Interface Controllers | — | None (per datasheet) |
| Supply Voltage - Core | — | 1.8 V |
| Supply Voltage - I/O | — | 3.3 V |
| Betriebstemperatur | — | [DATA_NEEDED: full operating temperature range] |
| Part Status | — | Not For New Designs (No Longer Manufactured) |