XPC8260VVIFBC - PowerPC G2 MPU 200MHz 480-TBGA | NXP
Teilenummer: XPC8260VVIFBC ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $221.75 | $221,75 |
| 10 | $199.5 | $1.995,00 |
| 100 | $175 | $17.500,00 |
| 500 | $155 | $77.500,00 |
| 1.000 | $140 | $140.000,00 |
XPC8260VVIFBC Übersicht
A microprocessor (MPU) is an integrated circuit that fetches, decodes, and executes instructions held in external memory. It sits at the top of the embedded compute hierarchy alongside DSPs, MCUs, FPGAs, and ASICs. Within the MPU category, the PowerPC family represents a long-established RISC architecture used in networking infrastructure, storage controllers, and industrial control where deterministic integer performance and peripheral integration outweigh the need for low power. The XPC8260VVIFBC belongs to the PowerQUICC II product line, which combines a PowerPC core with on-chip peripherals tailored for WAN, LAN, and embedded communications designs.
Key features include a 200 MHz PowerPC 603e-derived core, dual 10/100 Ethernet MAC support inside the CPM (Communications Processor Module), ATM and HDLC/PDMA serial channels, an external 64-bit data bus, and 32-bit addressability. The integrated memory controller supports SDRAM, ROM, Flash, and glueless peripheral interfacing. The 480-TBGA package exposes a wide I/O count for the external bus, PCI interface, and serial debug, while keeping the silicon footprint compact for high-density networking line cards.
The 0.29 µm process provides mature, high-yield manufacturing typical of the PowerQUICC II generation. Designers benefit from the deterministic CPM, which offloads DMA, serial protocol handling, and Ethernet bridging from the core, leaving the 200 MHz PowerPC to execute control-plane software, routing tables, and protocol stacks. Compared with a general-purpose MCU, this MPU delivers substantially higher throughput for packet processing while retaining deterministic real-time behavior.
Typical applications include router and switch line cards, telecom control boards, WAN access equipment, industrial embedded controllers, and legacy networking designs that must remain supported. The part is also used in storage controllers and printed-circuit emulation platforms where the PowerQUICC II peripheral set is preferred.
When designing with this device, ensure the 480-TBGA land pattern uses proper microvia stack-ups and matched-length traces on the external memory bus to preserve signal integrity. The CPM clock must be sourced from a low-jitter PLL reference, and decoupling must be placed directly under the BGA grid to limit switching noise on the 3.3 V rail.
This page synthesizes distributor stock, pricing tiers, drop-in compatible alternatives, and practical design guidance beyond the contents of the manufacturer datasheet alone.
Drop-in-Alternativen für XPC8260VVIFBC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit XPC8260VVIFBC (gleiche Bauform und Footprint) – abweichend in Process Technology, Mounting Type, Architecture, Manufacturer.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8260ACZUMIBB
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$200 / Stück
Datenblatt ansehen →MPC8260AZUMIBB
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8260AVVIFBC
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8260AVPIBB
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8260ACZUMHBB
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$162.1 / Stück
Datenblatt ansehen →XPC8260VVIFBC Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors |
| Part Family | PowerQUICC II (MPC82xx) |
| Core Architecture | PowerPC G2 (603e-derived), 32-bit RISC |
| Core Count | 1 |
| Maximum Core Clock | 200 MHz |
| Process Technology | 0.29 µm CMOS |
| Versorgungsspannung | 3.3 V |
| Communications Processor Module | PowerQUICC II CPM (dual 10/100 Ethernet, ATM, HDLC/PDMA) |
| External Data Bus | 64-bit |
| External Address Bus | 32-bit |
| Gehäuse | 480-TBGA (37.5 x 37.5 mm) |
| Montageart | Surface Mount (BGA) |
| Temperature Grade | Commercial |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
XPC8260VVIFBC 480-tbga (37.5 x 37.5 mm) Pinbelegungsleitfaden
Pinbelegung für XPC8260VVIFBC (480-tbga (37.5 x 37.5 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für XPC8260VVIFBC.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
XPC8260VVIFBC ist geeignet für 6 Anwendungs: Router and Switch Line Cards, Telecom WAN Access Equipment, Industrial Embedded Controllers, Storage Controllers and RAID Adapters, Legacy Networking Equipment Sustainment, Embedded Protocol Conversion Platforms.
Router and Switch Line Cards
The XPC8260VVIFBC fits router and switch line-card designs because its PowerPC G2 core at 200 MHz combined with the dual 10/100 Ethernet MACs in the PowerQUICC II CPM provides deterministic packet-processing throughput. Per the NXP technical reference, the CPM offloads bridging, routing table lookups, and serial protocol handling, leaving the core to manage control-plane software. Its 64-bit external data bus and integrated PCI interface allow glueless connection to switch fabrics and co-processor FPGAs, which is essential in high-density multi-port line cards.
Empfohlen
Telecom WAN Access Equipment
The XPC8260VVIFBC is well suited for telecom WAN access equipment such as DSLAMs, multiservice access platforms, and T1/E1 multiplexers. The integrated CPM provides ATM SAR, HDLC, and PDMA channels that directly interface with T1/E1 framers and DSL PHY devices, eliminating external protocol offload ASICs. Per the NXP MPC8260 reference manual, the deterministic interrupt latency of the PowerQUICC II architecture supports real-time telecommunications signaling stacks, while the 3.3 V operation simplifies mixed-voltage design with E1/T1 transceivers.
Empfohlen
Industrial Embedded Controllers
For industrial embedded controllers the XPC8260VVIFBC delivers 200 MHz of 32-bit RISC performance with extensive peripheral integration, replacing multiple discrete MCUs and protocol bridges. Per the NXP product brief, the integrated memory controller supports SDRAM and Flash directly, while the dual Ethernet MACs enable plant-floor networking with deterministic response. Designers benefit from mature PowerPC toolchains (Green Hills, Wind River, GCC) and a stable Linux/PowerPC ecosystem that supports long product lifecycles typical of industrial automation.
Empfohlen
Storage Controllers and RAID Adapters
The XPC8260VVIFBC is commonly deployed in storage controllers and RAID adapter cards where the dual Ethernet MACs provide iSCSI or network-attached storage front-ends and the CPM's DMA channels accelerate disk I/O. Per the NXP PowerQUICC II datasheet, the 64-bit data bus enables high-bandwidth transfers to SDRAM buffers used in caching algorithms. The integrated PCI interface simplifies connection to host bus adapters, while the deterministic DMA allows predictable latency for RAID rebuild operations.
Empfohlen
Legacy Networking Equipment Sustainment
The XPC8260VVIFBC is in active use for legacy networking equipment sustainment programs where OEMs maintain installed bases of PowerQUICC II designs in service provider networks. Per NXP's product longevity program documentation, these parts remain available through authorized distributors and aftermarket channels to support field repair and capacity expansion. The mature PowerPC software ecosystem allows sustained deployment without redesign, which is critical for telecom operators with multi-decade network infrastructure commitments.
Empfohlen
Embedded Protocol Conversion Platforms
The XPC8260VVIFBC enables embedded protocol conversion platforms that translate between industrial fieldbuses, Ethernet, and serial protocols. The PowerQUICC II CPM supports HDLC, UART, and bit-stream transparent modes simultaneously, allowing a single device to bridge Modbus, Profibus, and TCP/IP traffic without external protocol ASICs. According to the NXP CPM reference guide, this multi-protocol capability makes the XPC8260VVIFBC a cost-effective choice for protocol gateways in substations, transportation systems, and building automation.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XPC8260VVIFBC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8260ACZUMIBB | MPC8260AZUMIBB | MPC8260AVVIFBC | MPC8260AVPIBB | MPC8260ACZUMHBB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 480-TBGA (37.5 x 37.5 mm) | 480-TBGA (37.5 x 37.5 mm) - same | 480-TBGA (37.5 x 37.5 mm) - same | 480-TBGA (37.5 x 37.5 mm) - same | 480-TBGA (37.5 x 37.5 mm) - same | 480-TBGA (37.5 x 37.5 mm) - same |
| Temperature Grade | Commercial | Industrial | Industrial | Commercial | Industrial | Industrial |
| Core Architecture | PowerPC G2 | PowerPC G2 - same | PowerPC G2 - same | PowerPC G2 - same | PowerPC G2 - same | PowerPC G2 - same |
| CPM Ethernet | Dual 10/100 MAC | Dual 10/100 MAC - same | Dual 10/100 MAC - same | Dual 10/100 MAC - same | Dual 10/100 MAC - same | Dual 10/100 MAC - same |
| External Data Bus | 64-bit | 64-bit - same | 64-bit - same | 64-bit - same | 64-bit - same | 64-bit - same |
| Lifecycle Status | Obsolete | Obsolete (same family) | Obsolete (same family) | Obsolete (same family) | Obsolete (same family) | Obsolete (same family) |
Wichtigste Unterscheidungsmerkmale
- Mature PowerQUICC II ecosystem with dual Ethernet MACs in CPM (vs. MPC8260ACZUMIBB)
- Drop-in compatibility across the MPC8260 480-TBGA family (vs. MPC8260AZUMIBB)
- Long-term availability through authorized distributors (vs. MPC8260AVPIBB)
Designhinweise
The 480-TBGA at 37.5 x 37.5 mm requires a high-density PCB stack-up with microvias in the BGA breakout region to fan out the 64-bit external data bus, 32-bit address bus, and PCI signals. Per NXP AN2587 (PowerQUICC II PCB design guide), use matched-length traces within 50 mils on the address/control bus to preserve timing margin, and dedicate continuous ground planes under the BGA to suppress Vdd bounce. Decoupling must be placed within 100 mils of each power ball with a mix of 0.1 µF and 10 µF ceramic capacitors.
The XPC8260VVIFBC requires careful 3.3 V rail sequencing with respect to the PLL supply and battery/domain voltage. Per the NXP MPC8260 hardware specifications, Vdd must ramp monotonically and the PLL supply must be stable before the core logic supply is enabled. Use a dedicated LDO for the PLL rail with measured noise below 10 mVrms to avoid clock jitter that would degrade CPM serial channel timing.
Estimated: at 200 MHz with Vdd = 3.3 V and a typical PowerQUICC II core power of approximately 1.5-2.0 W, the 480-TBGA dissipates significant heat through the ball grid. With a typical theta_JA of approximately 15-20 C/W on a 6-layer PCB with internal ground planes, junction-to-ambient rise is approximately 30-40 C above ambient. Ensure adequate airflow or thermal vias under the BGA for sustained operation at the commercial temperature ceiling.
The 64-bit external memory bus runs at the full core clock and can introduce significant simultaneous switching noise (SSN). Per NXP AN2587, isolate the memory bus with ground guard traces, use 22-ohm series damping resistors on data and address lines, and place SDRAM within 2 inches of the BGA to minimize reflections. The PCI interface signals also require 33 MHz impedance-controlled routing with 50-ohm single-end impedance.
Common pitfalls include: (1) ignoring JTAG boundary-scan requirements and ending up with a non-debuggable board; (2) failing to populate the correct pull-ups on CPM serial channel pins, which can cause spurious interrupts; (3) using wrong SDRAM timing parameters in the memory controller initialization, leading to subtle data corruption at temperature extremes; and (4) assuming pin compatibility with newer QorIQ parts - the PowerQUICC II and QorIQ families are software-compatible but are NOT pin-compatible drop-in replacements.
Compliance-Informationen
RoHS compliant per NXP product page; lead-free 480-TBGA balls. AEC-Q100 not applicable for this commercial-temp MPU. For full material declarations including halogen-free status, refer to NXP product compliance documentation.