10AS066K4F35I3SG - Arria 10 SX SoC FPGA, 660K LE, 1152-FBGA | Intel
Teilenummer: 10AS066K4F35I3SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3135.45 | $3.135,45 |
| 10 | $2821.9 | $28.219,00 |
| 50 | $2532.05 | $126.602,50 |
| 100 | $2287.45 | $228.745,00 |
| 250 | $2098.6 | $524.650,00 |
10AS066K4F35I3SG Übersicht
An SoC FPGA is a class of programmable logic device that combines a hard processor subsystem (HPS) with traditional FPGA fabric on a single die, enabling deterministic hardware acceleration alongside software programmability. Within the broader taxonomy, this places the device as: SoC FPGA -> FPGA -> programmable logic -> digital integrated circuit -> semiconductor. Hard processor integration reduces BOM count, board area, and inter-chip latency versus two-chip CPU+FPGA solutions.
Key features include 660K logic elements, dual-core ARM Cortex-A9 MPCore with NEON media engine, integrated peripherals such as EMAC, USB, NAND/NOR flash controllers, and DDR3/DDR4 memory controller support on the HPS, plus high-speed transceivers and DSP blocks on the FPGA fabric. The 1152-FBGA package exposes 396 user I/Os and supports industrial-grade operation. This combination enables mixed deterministic control plus high-throughput data-plane processing on a single device.
The Arria 10 SX architecture is built on TSMC's 20 nm process with a coherent interconnect between HPS and FPGA fabric. Designers can partition compute tasks between software running on the Cortex-A9 and custom hardware accelerators in the FPGA, achieving both flexibility and performance. Hardware-to-software DMA channels and ACP (Accelerator Coherency Port) maintain cache coherency across domains.
Typical applications include industrial motor control and machine vision, software-defined radio baseband, broadcast video processing, military/aerospace signal processing, and high-performance embedded computing. For engineers comparing SoC FPGA options, the 10AS066K4F35I3SG is positioned in the mid-density tier of the Arria 10 family, offering more logic and HPS throughput than Cyclone V SoCs but at lower cost and power than Stratix 10 devices.
When designing with this device, plan PCB layout carefully around the 35x35 mm BGA with controlled-impedance routing for transceivers, robust power-rail decoupling, and thermal management via copper pours or heatsinks. The Quartus Prime design suite supports the SoC variant with Qsys / Platform Designer toolflow. This page synthesizes distributor pricing, drop-in alternatives from the same Arria 10 SX family, and practical design notes not collected in any single datasheet.
Drop-in-Alternativen für 10AS066K4F35I3SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AS066K4F35I3SG (gleiche Bauform und Footprint) – abweichend in Package, Process Node, Speed Grade, Mounting Type, Operating Temperature Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AS066K4F35I3LG
✅ Drop-In✓ Auf Lager
$2350 / Stück
Datenblatt ansehen →10AS066K4F35E3SG
✅ Drop-In✓ Auf Lager
$2150 / Stück
Datenblatt ansehen →10AS066K4F35E3LG
✅ Drop-In✓ Auf Lager
$2845.83 / Stück
Datenblatt ansehen →10AS066K3F35I2SG
✅ Drop-In✓ Auf Lager
$3405 / Stück
Datenblatt ansehen →10AS066K3F35I2LG
✅ Drop-In✓ Auf Lager
$3712.06 / Stück
Datenblatt ansehen →10AS066K2F35I2SG
✅ Drop-In✓ Auf Lager
$5750 / Stück
Datenblatt ansehen →10AS066K4F35I3SG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 SX SoC FPGA |
| Device | 10AS066 |
| Logic Elements | 660K |
| Processor Cores | Dual ARM Cortex-A9 MPCore |
| HPS Maximum Frequency | 1.5 GHz |
| User I/O | 396 |
| Gehäuse | 1152-FBGA, FC (F35, 35x35 mm) |
| Montageart | Surface Mount |
| Operating Temperature Grade | Industrial |
| RoHS-Status | Compliant |
| Lead Free | Yes |
| Process Node | 20 nm |
| Series | Arria 10 SX |
| Terminal Form | Ball |
| Number of Terminals | 1152 |
| Package Code | BGA |
| Package Shape | Square |
10AS066K4F35I3SG square Pinbelegungsleitfaden
Pinbelegung für 10AS066K4F35I3SG (square-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AS066K4F35I3SG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AS066K4F35I3SG ist geeignet für 6 Anwendungs: Industrial Motor Control and Drives, Software-Defined Radio (SDR) Baseband, Machine Vision and Video Processing, Broadcast and Professional Video, Aerospace and Defense Signal Processing, High-Performance Embedded Computing.
Industrial Motor Control and Drives
The 10AS066K4F35I3SG's dual ARM Cortex-A9 MPCore HPS handles real-time motion control loops (current, velocity, position) running control firmware, while its 660K logic elements implement field-oriented control (FOC) hardware accelerators and multi-axis PWM generation. The 396 user I/Os interface to multiple encoder inputs, gate drivers, and isolated feedback channels, while the industrial temperature grade supports factory-floor environments with ambient up to 100C junction. The 1.5 GHz HPS clock enables deterministic interrupt latency under 1 microsecond for closed-loop control, and 20 nm process efficiency keeps drive-stage switching noise manageable.
Empfohlen
Software-Defined Radio (SDR) Baseband
The Arria 10 SX architecture's combination of dual Cortex-A9 MPCore for protocol stack processing and 660K FPGA fabric for baseband DSP makes this device well suited for SDR baseband. The FPGA fabric implements channelization, FFT/iFFT, modulation/demodulation, and channel coding in hardware, while the HPS handles higher-layer MAC and network protocols. The 1152-FBGA F35 package exposes transceivers capable of multi-Gbps data rates needed for LTE and 5G NR baseband. The 1.5 GHz HPS clock rate allows real-time processing of multiple LTE carriers without external processors.
Empfohlen
Machine Vision and Video Processing
The 10AS066K4F35I3SG's 660K logic elements and DSP blocks enable real-time image processing pipelines (noise reduction, edge detection, color space conversion, object tracking) at multi-megapixel resolutions and frame rates above 60 fps. The dual Cortex-A9 handles video compression (H.264/H.265 codec control), network protocols for industrial GigE Vision, and host-side analytics. The 396 user I/Os interface to MIPI CSI-2 cameras, HDMI displays, and high-speed memory (DDR3/DDR4). Industrial temperature grade supports camera deployments in factory environments.
Empfohlen
Broadcast and Professional Video
Broadcast applications require simultaneous processing of multiple video streams (3G-SDI, HDMI, DisplayPort) with low-latency, real-time pixel processing. The 10AS066K4F35I3SG's FPGA fabric handles video scaling, deinterlacing, color correction, and overlay composition at 4K/60p rates, while the HPS manages control planes and network connectivity. The 1.5 GHz HPS clock supports real-time metadata processing. Industrial temperature rating enables chassis-level integration in broadcast studio equipment without active cooling extremes.
Empfohlen
Aerospace and Defense Signal Processing
Defense applications such as radar, electronic warfare, and secure communications demand high-throughput DSP with radiation-tolerant logic. The 10AS066K4F35I3SG (industrial grade) is used in non-rad-hard deployments, while its military-grade equivalents (10AS066K4F35E3SG) are used in extended-temperature military environments. The FPGA fabric implements FFT, beamforming, and signal classification, while the dual Cortex-A9 MPCore handles control and data logging. The 1152-FBGA F35 package supports the high I/O density required for multi-receiver RF front ends.
Empfohlen
High-Performance Embedded Computing
For embedded computing platforms that require both deterministic software execution and hardware acceleration, the 10AS066K4F35I3SG integrates the entire compute subsystem. The HPS runs a real-time OS (VxWorks, RTEMS, or Linux with PREEMPT_RT) for control, while the FPGA fabric accelerates custom algorithms (cryptography, signal processing, AI inference). The 1.5 GHz dual-core ARM Cortex-A9 delivers ~3000 DMIPS aggregate, and 396 user I/Os support high-speed PCIe, Ethernet, and DDR4 memory interfaces. Industrial temperature enables deployment in ruggedized enclosures.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AS066K4F35I3SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AS066K4F35I3LG | 10AS066K4F35E3SG | 10AS066K4F35E3LG | 10AS066K3F35I2SG | 10AS066K3F35I2LG | 10AS066K2F35I2SG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA (F35, 35x35 mm) | 1152-FBGA (F35) - same | 1152-FBGA (F35) - same | 1152-FBGA (F35) - same | 1152-FBGA (F35) - same | 1152-FBGA (F35) - same | 1152-FBGA (F35) - same |
| Logic Elements | 660K | 660K | 660K | 660K | 660K | 660K | 660K |
| Temperature Grade | Industrial (I3) | Industrial (I3) | Extended (E3) | Extended (E3) | Industrial (I2) | Industrial (I2) | Industrial (I2) |
| User I/O | 396 | 396 | 396 | 396 | 396 | 396 | 396 |
| RoHS Status | Compliant | Compliant (LG lead-free) | Compliant | Compliant (LG lead-free) | Compliant | Compliant (LG lead-free) | Compliant |
Wichtigste Unterscheidungsmerkmale
- High-density SoC FPGA with 660K LE and dual ARM Cortex-A9 MPCore (vs. 10AS066K3F35I2SG)
- Industrial temperature grade with broad distributor availability (vs. 10AS066K4F35E3SG)
- Mainstream Arria 10 SX SoC platform supported by mature Quartus Prime toolchain (vs. 10AS066H4F34I3SG)
- Highest speed grade in the 10AS066 K4 family (vs. 10AS066K2F35I2SG)
Designhinweise
The 1152-FBGA F35 package dissipates substantial power at full SoC and FPGA utilization (typical 15-25W at industrial conditions). Use a multi-layer PCB with at least 6 layers and dedicate the top layer under the BGA to a thermal copper pour stitched with vias to inner ground planes. Without active airflow, de-rate I/O bank usage above 80% switching to maintain junction temperature below 100C. Estimated: at 20W total dissipation with a typical theta_JA of 1.5 C/W on a 6-layer board with thermal vias, junction temperature rises ~30C above ambient.
Route high-speed transceiver channels (up to 12.5 Gbps on Arria 10 SX) with controlled differential impedance (100 ohm +/- 10%) and length matching within 150 mil. Use GND stitching vias every lambda/10 along the trace, and place AC-coupling capacitors within 200 mil of the FPGA pin. The HPS DDR3/DDR4 interfaces require matched-length routing with +-25 mil tolerance, separate power planes, and isolated guard traces. Refer to Intel AN 583 (Arria 10 PCB Design Guidelines) for full layout rules.
Power sequencing is mandatory: bring up the FPGA core voltage (0.95V) before the HPS core voltage and the I/O banks. Each bank requires its own VCCIO rail. Decoupling strategy: use 100nF X7R 0402 capacitors as close to every power pin as possible, plus 10uF bulk caps per rail. Estimate: at full utilization, the FPGA fabric core can draw 8-12A transient; use a multi-phase VRM to meet peak current without droop. Follow the power management guide in Arria 10 Device Handbook Volume 3.
Common mistakes include: (1) attempting to assign non-existent I/O standards to specific banks (consult pin connection guidelines for bank VCCIO compatibility), (2) configuring the HPS and FPGA fabric to incompatible clock domains without CDC modules, (3) failing to enable configuration mode pins correctly during FPGA configuration mode selection, (4) not connecting JTAG pull-ups (TMS, TCK, TDI) which prevents detection by Quartus Programmer, (5) using ceramic capacitors with insufficient voltage rating on HPS power rails (use at least 2x the nominal voltage).
For DDR4 interfaces on the HPS, route DQS to match within 20 ps to its associated DQ/DQS# lanes. Use IBIS-AMI simulations with Quartus Prime's EDA toolchain before tape-out. Cross-talk can degrade ADC performance on sensitive analog signals; keep at least 3W spacing between high-speed digital and analog nets. Estimated: each aggressor Aggressor/Victim pair adds ~25 mV of coupled noise at 5 Gbps; budget analog noise floors accordingly.
Compliance-Informationen
RoHS compliance confirmed via Altera / Intel product page. AEC-Q100 not applicable for FPGAs. Reach, halogen-free, and conflict minerals status not explicitly listed in retrieved data.
