XC7A200T-2FFG1156I - Artix-7 FPGA 215K Logic Cells | AMD
Teilenummer: XC7A200T-2FFG1156I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $107.41 | $107,41 |
| 10 | $98.5 | $985,00 |
| 100 | $89.6 | $8.960,00 |
| 500 | $80.7 | $40.350,00 |
| 1.000 | $71.8 | $71.800,00 |
XC7A200T-2FFG1156I Übersicht
An FPGA (Field-Programmable Gate Array) is an integrated circuit that can be configured by the designer after manufacturing, allowing for custom digital logic implementations. FPGAs sit within the broader category of programmable logic devices (PLDs), which are part of the semiconductor industry. They offer flexibility and parallel processing capabilities that are often superior to microprocessors for specific tasks, making them essential in prototyping, signal processing, and hardware acceleration.
Key features of the XC7A200T-2FFG1156I include 740 DSP slices for high-speed digital signal processing, 10 clock management tiles (CMTs) with MMCM and PLL for robust clock generation, and support for MicroBlaze soft-core processors. The device also integrates analog-to-digital converters (XADC) for on-chip temperature and voltage monitoring. With a maximum operating frequency of 628 MHz, it delivers high performance for demanding logic designs.
Built on 28nm technology, the Artix-7 family provides the highest performance-per-watt fabric in its class. The device supports various I/O standards, including LVCMOS, LVDS, and HSTL, and features high-speed transceivers for serial communication. The 1156-ball FCBGA package offers excellent thermal and electrical characteristics, enabling reliable operation in industrial temperature ranges (-40°C to +100°C).
Typical applications include software-defined radio, motor control, medical imaging, and aerospace systems. The combination of logic density, DSP capability, and I/O flexibility makes it suitable for both prototyping and production deployments. Designers can leverage AMD's Vivado Design Suite for comprehensive development support.
When designing with this FPGA, careful attention to power supply decoupling and thermal management is essential. The device requires multiple supply rails, and proper sequencing is critical to ensure reliable operation. Additionally, utilizing the on-chip XADC for monitoring can enhance system reliability.
Drop-in-Alternativen für XC7A200T-2FFG1156I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
XC7A200T-2FFG1156C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC7A200T-2FFV1156C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC7A350T-2FFG1156I
⚡ Gleiches Gehäuse ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7A200T-2FFG1156I Grenzwerte & elektrische Eigenschaften
| Family | Artix-7 |
| Logic Cells | 215360 |
| Block RAM | 13455360 bits |
| DSP Slices | 740 |
| User I/Os | 500 |
| Clock Management Tiles | 10 (CMT) |
| Maximum Frequency | 628 MHz |
| Core Voltage | 0.95 V to 1.05 V |
| Gehäuse | 1156-BBGA, FCBGA |
| Betriebstemperatur | -40°C to +100°C |
| Technology | 28nm |
| Transceivers | 16 (GTX) |
| I/O Standards | LVCMOS, LVDS, HSTL |
| RoHS-Status | Compliant |
| Montageart | Surface Mount |
XC7A200T-2FFG1156I Pin-Konfiguration
| Pin A1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| Pin A2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| Pin B1 | VCCINT — Internal core voltage supply (1.0V) |
| Pin B2 | GND — Ground |
| Pin C1 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| Pin C2 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| Pin D1 | VCCAUX — Auxiliary voltage supply (1.8V) |
| Pin D2 | GND — Ground |
| Pin E1 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| Pin E2 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| Pin F1 | VCCBRAM — Block RAM voltage supply (1.0V) |
| Pin F2 | GND — Ground |
Typische Anwendungen
XC7A200T-2FFG1156I ist geeignet für 6 Anwendungs: Software Defined Radio, Motor Control, Medical Imaging, Aerospace Systems, Data Center Acceleration, Industrial Automation.
Software Defined Radio
The XC7A200T-2FFG1156I is ideal for software-defined radio (SDR) systems due to its high DSP slice count (740) and 500 I/Os, enabling complex digital signal processing. Its 628 MHz maximum frequency supports wideband signal processing, while the 13.4 Mb block RAM facilitates buffering. The device's low power consumption at 28nm makes it suitable for portable and field-deployed SDR units, where thermal management is critical.
Empfohlen
Motor Control
In motor control applications, the XC7A200T-2FFG1156I provides the logic density and DSP capabilities needed for implementing complex control algorithms like field-oriented control (FOC). With 740 DSP slices, it can handle multiple motor axes simultaneously. The 500 I/Os allow for interfacing with various sensors and drivers. Its industrial temperature range (-40°C to +100°C) ensures reliable operation in harsh factory environments.
Empfohlen
Medical Imaging
The XC7A200T-2FFG1156I is well-suited for medical imaging systems like ultrasound and CT scanners, where high-speed data acquisition and processing are essential. Its 13.4 Mb block RAM and 740 DSP slices enable real-time image filtering and enhancement. The 500 I/Os support high-speed ADC/DAC interfaces. The device's reliability and long-term availability make it a preferred choice for medical equipment manufacturers.
Empfohlen
Aerospace Systems
For aerospace applications, the XC7A200T-2FFG1156I offers the logic density and I/O flexibility required for avionics, flight control, and communication systems. Its industrial temperature range and robust 28nm technology ensure reliable operation in extreme conditions. The 500 I/Os allow for extensive sensor and actuator interfacing. The device's support for MicroBlaze soft-core processors enables flexible system-on-chip designs.
Empfohlen
Data Center Acceleration
In data center applications, the XC7A200T-2FFG1156I can be used for network packet processing, storage acceleration, and workload offloading. Its 500 I/Os and high-speed transceivers enable high-bandwidth data movement. The 740 DSP slices accelerate encryption and compression algorithms. The device's low power consumption is critical for dense server environments where thermal and power budgets are tight.
Empfohlen
Industrial Automation
The XC7A200T-2FFG1156I is ideal for industrial automation systems, including PLCs, robotics, and vision systems. Its 500 I/Os support various industrial protocols like EtherCAT and PROFINET. The 740 DSP slices enable real-time image processing for machine vision. The device's industrial temperature range and long lifecycle make it suitable for 24/7 operation in manufacturing plants.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XC7A200T-2FFG1156I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XC7A200T-2FFG1156C | XC7A200T-2FFV1156C | XC7A200T-2FBG484I |
|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA - same | 1156-BBGA, FCBGA - same | 484-BBGA, FCBGA - different |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 215360 | 215360 | 215360 | 215360 |
| User I/Os | 500 | 500 | 500 | 285 |
| Block RAM | 13455360 bits | 13455360 bits | 13455360 bits | 13455360 bits |
| DSP Slices | 740 | 740 | 740 | 740 |
| Temperature Grade | Industrial (-40°C to +100°C) | Commercial (0°C to +85°C) | Commercial (0°C to +85°C) | Industrial (-40°C to +100°C) |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade (vs. XC7A200T-2FFG1156C)
- Higher I/O count (vs. XC7A200T-2FBG484I)
- Balanced logic density (vs. XC7A100T-2CSG324I)
Designhinweise
The XC7A200T-2FFG1156I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (varies by I/O bank). Proper decoupling with 100nF and 10uF capacitors near each power pin is essential. Use a dedicated power management IC to ensure correct power-up sequencing, as improper sequencing can damage the device. Refer to the Artix-7 datasheet for detailed power supply requirements.
With a maximum power dissipation that can exceed 10W under heavy utilization, adequate thermal management is required. The 1156-ball FCBGA package has a thermal resistance (theta_JA) of approximately 8-10°C/W. A heatsink or forced airflow is recommended for high-density designs. Ensure the PCB has sufficient copper planes for heat spreading, especially in industrial environments with ambient temperatures up to 100°C.
For high-speed serial transceivers, use controlled impedance traces (50 ohm single-ended, 100 ohm differential) and minimize stub lengths. Place termination resistors close to the receiver. For the 500 user I/Os, follow the pinout guidelines in UG475 to avoid signal integrity issues. Use ground planes under all high-speed signals to reduce EMI.
Compliance-Informationen
RoHS compliant per distributor listings. Not AEC-Q100 qualified as it is not an automotive-grade part.