10AX115N3F40I2LG - Arria 10 GX FPGA 1150K LE | Intel F40 BGA
Teilenummer: 10AX115N3F40I2LG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $9563.17 | $9.563,17 |
| 10 | $9200 | $92.000,00 |
| 50 | $8800 | $440.000,00 |
| 100 | $8450 | $845.000,00 |
| 250 | $8100 | $2.025.000,00 |
10AX115N3F40I2LG Übersicht
What is an FPGA? A Field-Programmable Gate Array is a reconfigurable semiconductor whose logic fabric, routing, and I/O cells are defined after manufacture via a hardware description language (HDL) bitstream. FPGAs sit at the top of the programmable-logic hierarchy: programmable logic -> FPGA -> SoC FPGA, paralleling CPUs/GPUs but with deterministic latency and full hardware parallelism for DSP, packet processing, and high-speed serial I/O. The Arria 10 family targets mid-range applications that demand transceivers, DSP bandwidth, and memory throughput without migrating to a custom ASIC.
Key features include 28.05 Mbit on-chip memory, dual ARM Cortex-A9 hard processor subsystem option, 17.4 Gbps transceiver data rate, and 1.6 Gbps DDR4 external memory interface support. The -I2 suffix denotes industrial operating temperature (TJ -40C to +100C), and LG specifies a Pb-free tray packaging format. The device is supported by Quartus Prime design software with reference designs for PCIe Gen3 x8, 100G Ethernet MAC, and JESD204B interfaces.
Architecturally, the 10AX115N3F40I2LG uses a logic array block (LAB) of adaptive logic modules (ALMs), each containing an 8-input fracturable lookup table, two dedicated adders, and four registers. The GX transceiver tiles integrate PCS and PMA layers supporting protocols such as PCIe Gen3, 10G/40G Ethernet, CPRI, and Serial RapidIO. Hard memory controllers and a hard PCI Express Gen3 IP block accelerate common interface functions.
Typical applications include 100G line card packet processing, software-defined radio baseband, medical imaging accelerators, broadcast video processing, and ASIC prototyping. The combination of transceivers, DSP blocks, and embedded memory makes this device well suited to data-plane offload and signal-processing workloads in communications infrastructure.
When designing with this device, plan for the FCBGA-1517 thermal envelope, layer-count PCB stack-up, and power-rail sequencing (10AX family requires a specific multi-rail ramp order). Quartus Prime power-play early power estimation should be run before PCB commitment to size the core VRM and heatsink.
This page synthesizes distributor stock data, industrial-grade variant alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für 10AX115N3F40I2LG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AX115N3F40I2LG (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, Embedded Memory Bits, PCIe Hard IP, Temperature Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AX115N2F40I2LG
✅ Drop-In✓ Auf Lager
$7965.99 / Stück
Datenblatt ansehen →10AX115N3F40I2SG
✅ Drop-In✓ Auf Lager
$7100 / Stück
Datenblatt ansehen →10AX115N3F40E2LG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2125 / Stück
Datenblatt ansehen →10AX115R3F40I2LG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10AX115N2F45I2LG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$8750 / Stück
Datenblatt ansehen →10AX090N3F40I2LG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$9800 / Stück
Datenblatt ansehen →10AX115N3F40I2LG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory Bits | 68,857,856 |
| User I/O Count | 600 |
| Gehäuse | 1517-ball FCBGA (F40) |
| Process Technology | 20nm TSMC |
| Betriebstemperatur | -40C to +100C (industrial) |
| Transceiver Data Rate | Up to 17.4 Gbps |
| On-chip Memory | 28.05 Mbit |
| Hard Memory Controller | Yes (DDR3/DDR4/QDRII+/RLDRAM3) |
| Hard PCIe Gen3 | Yes (x1/x2/x4/x8) |
| Hard Processor System | Optional dual ARM Cortex-A9 |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
| Shipping Media | Tray (LG suffix) |
10AX115N3F40I2LG 1517-ball fcbga (f40) Pinbelegungsleitfaden
Pinbelegung für 10AX115N3F40I2LG (1517-ball fcbga (f40)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AX115N3F40I2LG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AX115N3F40I2LG ist geeignet für 6 Anwendungs: 100G Ethernet Line Card, Software-Defined Radio Baseband, Medical Imaging Accelerator, Broadcast Video Processing, ASIC Prototyping Platform, Industrial Motor Control.
100G Ethernet Line Card
The 10AX115N3F40I2LG is well suited for 100G Ethernet line cards in carrier-grade switches and routers. Its 17.4 Gbps transceiver tiles support CAUI-4 (4x25.78 Gbps) interfaces when paired with a retimer, while soft 100G MAC IP terminates the link layer. The 1,150,000 logic elements accommodate lookup tables, traffic managers, and packet parsing in parallel. With 28.05 Mbit on-chip memory and hard DDR4 controllers, the device handles line-rate table lookups. Compared with discrete PHY plus ASIC designs, a single Arria 10 consolidates PHY, MAC, and packet processing into one programmable device, simplifying BOM and accelerating NPI.
Empfohlen
Software-Defined Radio Baseband
For LTE and 5G baseband processing, the 10AX115N3F40I2LG combines variable-precision DSP blocks with up to 17.4 Gbps transceivers, enabling CPRI and OBSAI fronthaul aggregation. The 1,150,000 logic elements host channel cards, FFT/iFFT engines, and digital up/down conversion chains. Hardened memory controllers stream ADC samples into external DDR4 buffers while on-chip block RAM holds coefficient tables. Industrial -40C to +100C temperature grade supports outdoor remote-radio-head deployments. The 600 user I/Os handle JESD204B SerDes lanes to RF data converters, replacing multiple FPGAs with a single Arria 10 device.
Empfohlen
Medical Imaging Accelerator
CT, MRI, and ultrasound imaging systems benefit from the 10AX115N3F40I2LG's combination of variable-precision DSP blocks and embedded memory bandwidth. The 1.15M logic elements reconstruct image slices in real time, while 28.05 Mbit on-chip memory buffers raw scan lines before back-projection. PCI Express Gen3 hard IP connects directly to the host processor, sustaining ~8 GBps data throughput for 4D imaging streams. The industrial temperature grade ensures reliability in clinical equipment that runs continuously. Compared with GPU-based accelerators, the FPGA delivers deterministic latency critical for synchronized acquisition across multiple transducers.
Empfohlen
Broadcast Video Processing
The 10AX115N3F40I2LG powers broadcast routers, video walls, and 4K/UHD signal processors by providing parallel pixel-pipeline logic at deterministic rates. Its 600 user I/Os interface to HDMI 2.0, SDI, and DisplayPort 1.2 bridges via external PHYs, while 17.4 Gbps transceivers drive 12G-SDI links for uncompressed 4K transport. The on-chip memory subsystem scales to handle color-space conversion, scaling, and frame-rate conversion without external DDR. According to the Arria 10 datasheet, the integrated hard memory controllers simplify PCB layout compared with multi-FPGA legacy designs.
Empfohlen
ASIC Prototyping Platform
ASIC design teams use the 10AX115N3F40I2LG as a vehicle to validate RTL before committing to mask sets, taking advantage of 1.15M logic elements, 28.05 Mbit block RAM, and Quartus Prime synthesis parity with downstream tools. Multiple FPGAs can be stitched together via 17.4 Gbps transceivers to prototype ASICs with millions of gates. Hard PCI Express Gen3 IP accelerates system-level bring-up, and the FCBGA-1517 F40 footprint supports standardized ASIC-emulation baseboards. Industrial temperature grade ensures the prototype boards exercise real-world thermal profiles before tape-out.
Empfohlen
Industrial Motor Control
Multi-axis motor drives use the 10AX115N3F40I2LG to implement field-oriented control loops, encoder feedback, and safety logic in a single device. The 1.15M logic elements run parallel control loops for up to 8 axes, while 17.4 Gbps transceivers connect to remote I/O via EtherCAT or SERCOS III. Industrial -40C to +100C temperature grade supports cabinet-free installation near motors. Hardened memory controllers interface to external DDR for trajectory buffer storage. Compared with MCU plus FPGA solutions, the Arria 10 consolidates control, commutation, and safety SIL-3 logic on one chip.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AX115N3F40I2LG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AX115N2F40I2LG | 10AX115N3F40I2SG | 10AX115R3F40I2LG | 10AX090N3F40I2LG |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 |
| Speed Grade | -3 (highest Fmax) | -2 (mid) | -3 (same) | -3 (same) | -3 (same) |
| Transceiver Variant | GX (17.4 Gbps) | GX (17.4 Gbps) | GX (17.4 Gbps) | GT (28.05 Gbps) | GX (17.4 Gbps) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Embedded Memory (Mbit) | 28.05 | 28.05 | 28.05 | 28.05 | 22.0 |
| User I/O Count | 600 | 600 | 600 | 600 | 600 |
Wichtigste Unterscheidungsmerkmale
- Highest speed grade in the Arria 10 family (vs. 10AX115N2F40I2LG)
- Industrial temperature range with GX transceivers (vs. 10AX115R3F40I2LG)
- Tray packaging format (vs. 10AX115N3F40I2SG)
Designhinweise
The FCBGA-1517 package dissipates up to 30 W in typical 17.4 Gbps transceiver use. A heatsink with thermal interface material is required for industrial-temperature operation above ambient 60C. The exposed-die package must be reflowed using a profiled profile per JEDEC J-STD-020, and thermal vias under the BGA should be stitched to a copper pour on inner layers. Estimated: with no airflow at 85C ambient, junction temperature can exceed 110C; refer to Arria 10 thermal model for accurate simulation.
FCBGA-1517 requires at least a 12-layer PCB with stacked microvias and 0.4mm pitch escape routing. According to the Arria 10 datasheet, the transceiver reference clock inputs require 50-ohm controlled impedance with via-stub compensation. Power rail decoupling must follow Intel's recommended capacitor placement (1uF + 0.1uF + 10uF per pin group). PCB stack-up should target 50-ohm single-ended and 100-ohm differential impedances per PCIe Gen3 channel requirements.
The 10AX115N3F40I2LG requires five power rails: VCC (core), VCCPT (periphery), VCCR/T (transceiver), VCCH_GXB (transceiver channel), and VCCIO (I/O banks). According to the Arria 10 datasheet, ramp sequence is critical: VCC must rise before VCCPT, which must rise before VCCR/T. Reverse sequencing can latch the device into an unrecoverable state. Use a multi-rail power manager such as the LM3881 or EM21xx to enforce the sequence.
Avoid tying configuration pins (nCONFIG, MSEL[2:0], nSTATUS) to ground without consulting the configuration user guide; selecting the wrong MSEL mode can prevent JTAG or AS configuration from succeeding. Ensure CFGBVS and CDPE pins match the bank voltage for the chosen configuration scheme (1.8V or 2.5/3.0/3.3V). Use the Altera Pin-Out File Generator for the specific Quartus Prime version to avoid pin map revision mismatches.
Transceiver channel-to-channel skew should not exceed 50 ps for 17.4 Gbps operation; route TX and RX pairs symmetrically with matched via counts. According to the Arria 10 GX transceiver user guide, AC-coupling capacitors (100 nF) must be placed within 100 mils of the transmitter pins. Use IBIS-AMI models in Keysight ADS or Cadence Sigrity for channel compliance simulation before PCB commitment.
Compliance-Informationen
RoHS and REACH compliance per Altera/Intel product page. Halogen-free status not explicitly listed in retrieved data; verify with manufacturer. AEC-Q100 not applicable (FPGA is not automotive-qualified at the silicon level). Industrial -40C to +100C junction temperature is the standard reliability grade.