10AX115N3F40E2SG - Arria 10 GX FPGA 1.15M LE | Intel
Teilenummer: 10AX115N3F40E2SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7500 | $7.500,00 |
| 10 | $6900 | $69.000,00 |
| 100 | $6300 | $630.000,00 |
| 500 | $5850 | $2.925.000,00 |
| 1.000 | $5450 | $5.450.000,00 |
10AX115N3F40E2SG Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect fabric, and configurable I/O elements that engineers can reconfigure after manufacturing to implement custom digital circuits, signal-processing pipelines, or even entire SoCs. Within the broader taxonomy, FPGAs sit between ASICs (Application-Specific Integrated Circuits) and general-purpose processors: more flexible than ASICs and far more parallel than CPUs/GPUs. The Arria 10 family specifically targets mid- to high-end applications where high transceiver bandwidth, DSP throughput, and power efficiency are simultaneously required.
Key features include 600 high-speed transceivers capable of up to 17.4 Gbps (with the GX variant), integrated PCIe Gen3 hard IP blocks, variable-precision DSP blocks, and up to 68,857,856 bits of embedded memory. The device integrates hardened memory controllers, including DDR4 support, alongside a robust hard-processor subsystem option for SoC variants. The Arria 10 architecture employs an adaptive logic module (ALM) fabric that delivers 25% higher performance compared to prior mid-range FPGA families while reducing power by up to 40%.
Typical applications include high-end wireless infrastructure (baseband processing, CPRI/OBSAI fronthaul), military radar and electronic warfare, broadcast video processing, medical imaging systems, and high-performance computing accelerators. The integrated transceivers and PCIe Gen3 hard IP make it particularly well-suited for backhaul and fronthaul telecom equipment as well as test and measurement instrumentation.
When designing with this device, careful attention must be paid to PCB layout for the 1517-ball FCBGA: a 12+ layer stack-up with microvia technology is typical, and thermal management requires a heatsink or cold-plate solution due to the device's power envelope. Quartus Prime software is required for compilation, simulation, and configuration bitstream generation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für 10AX115N3F40E2SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AX115N3F40E2SG (gleiche Bauform und Footprint) – abweichend in Package, DSP Blocks, PCIe Hard IP, Process Technology, Core Voltage.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AX115N3F40E2LG
✅ Drop-In✓ Auf Lager
$2125 / Stück
Datenblatt ansehen →10AX115N2F40E2SG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10AX115N2F40E2LG
✅ Drop-In✓ Auf Lager
$1980 / Stück
Datenblatt ansehen →10AX115N2F40E1SG
✅ Drop-In✓ Auf Lager
$3325 / Stück
Datenblatt ansehen →10AX115H2F34E2SG
✅ Drop-In✓ Auf Lager
$5500 / Stück
Datenblatt ansehen →10AX115N3F40E2SG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Process Technology | TSMC 20 nm |
| Core Voltage | 0.9 V |
| Embedded Memory | 68,857,856 bits (approximately 68.85 Mbit) |
| Transceiver Count | 600 |
| Maximum Transceiver Data Rate | 17.4 Gbps |
| Hard Memory Controllers | Yes (DDR4 support) |
| PCIe Hard IP | PCIe Gen3 (hard IP) |
| DSP Blocks | Variable-precision DSP |
| Gehäuse | 1517-ball FCBGA (F40) |
| Package Code | BGA / FCBGA |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Operating Temperature Grade | E2 (Enhanced, -40C to +100C) |
| Configuration Memory Technology | SRAM-based (volatile, requires external boot flash) |
| Recommended Toolchain | Intel Quartus Prime |
10AX115N3F40E2SG bga / fcbga Pinbelegungsleitfaden
Pinbelegung für 10AX115N3F40E2SG (bga / fcbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AX115N3F40E2SG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AX115N3F40E2SG ist geeignet für 6 Anwendungs: Wireless Infrastructure (4G/5G Baseband and Fronthaul), Military Radar and Electronic Warfare, Broadcast Video Processing and Studio Infrastructure, Medical Imaging Systems (Ultrasound, CT, MRI), Test and Measurement Instrumentation, High-Performance Computing Accelerators.
Wireless Infrastructure (4G/5G Baseband and Fronthaul)
The 10AX115N3F40E2SG fits wireless infrastructure because its 600 transceivers at up to 17.4 Gbps natively support CPRI and OBSAI fronthaul links at rates up to option 7 (9.83 Gbps), with headroom for option 8 (24.33 Gbps via oversampling). Its 1.15M logic elements plus 68.85 Mbit embedded RAM allow implementation of multi-carrier LTE/5G NR PHY-layer processing pipelines, while hard PCIe Gen3 IP provides the backhaul connection to baseband cards. Placed on a CPRI fronthaul baseband card alongside a network processor, it replaces multiple older-generation FPGAs by consolidating baseband, fronthaul, and beamforming logic. Unlike Stratix 10 (28+ Gbps transceivers), Arria 10 GX is cost-optimized for mass deployment in cellular base stations.
Empfohlen
Military Radar and Electronic Warfare
The 10AX115N3F40E2SG is well suited to military radar and EW systems because its 600 high-speed transceivers aggregate wideband ADC/DAC data streams from phased-array antennas, while 1.15M logic elements plus variable-precision DSP blocks implement real-time pulse compression, Doppler processing, and digital beamforming. The E2 operating temperature grade (-40C to +100C) supports harsh-environment airborne, naval, and ground-mobile platforms. Designers typically pair the device with external ADC/DAC tiles and DDR4 buffers (supported via hard memory controllers), and rely on Arria 10's 25% higher DSP throughput vs prior generations to meet thermal envelopes without derating. The integrated PCIe Gen3 hard IP enables high-throughput connection to mission processors.
Empfohlen
Broadcast Video Processing and Studio Infrastructure
The 10AX115N3F40E2SG excels in broadcast video processing because its 600 transceivers at 17.4 Gbps aggregate multiple uncompressed SDI streams (12G-SDI, 6G-SDI, 3G-SDI) for routing, color space conversion, and overlay insertion in 4K/UHD production switchers. Its 1.15M logic elements plus 68.85 Mbit embedded RAM implement real-time video scaling, deinterlacing, and HDR processing without external memory bottlenecks. The hard DDR4 memory controller provides a high-bandwidth frame buffer interface, while the PCIe Gen3 hard IP connects to host CPUs for studio automation. Compared to ASIC-based broadcast processors, the FPGA's reconfigurability accelerates support for new codecs (e.g., JPEG-XS, NDI) via firmware updates rather than hardware redesign.
Empfohlen
Medical Imaging Systems (Ultrasound, CT, MRI)
The 10AX115N3F40E2SG is a strong fit for medical imaging because its 600 transceivers aggregate data from large transducer arrays in ultrasound and CT scanners, while the variable-precision DSP blocks implement beamforming, image reconstruction, and filtering in real time. The 1.15M logic elements and 68.85 Mbit embedded memory handle multiple parallel processing pipelines for 3D/4D imaging modes. Its E2 temperature grade supports operation in controlled but thermally challenging medical equipment enclosures. Designers often pair this device with high-speed ADC front ends (e.g., 12-/14-bit at 250+ MSPS) and DDR4 frame buffers. Compared to GPU-based processing, FPGA implementation offers deterministic latency critical for real-time imaging feedback.
Empfohlen
Test and Measurement Instrumentation
The 10AX115N3F40E2SG fits high-end test and measurement because its 600 transceivers at 17.4 Gbps aggregate sampled data from wideband digitizers and pattern generators, while the 1.15M logic elements implement real-time FFT, signal analysis, and protocol-aware triggering. The hard DDR4 memory controller enables deep capture buffers (giga-sample acquisitions), and PCIe Gen3 hard IP provides high-throughput connection to host workstations. Designers use the variable-precision DSP blocks for digital down-conversion and modulation analysis in oscilloscopes and spectrum analyzers. The Arria 10 family provides sufficient fabric and memory for multi-channel BERT, protocol analyzers, and high-speed serial bus testers.
Empfohlen
High-Performance Computing Accelerators
The 10AX115N3F40E2SG is well suited to HPC accelerator cards because its 600 transceivers support high-bandwidth host interfaces (PCIe Gen3, 10/40 Gigabit Ethernet), while the 1.15M logic elements plus variable-precision DSP blocks accelerate financial Monte Carlo simulations, genomic analysis, and machine-learning inference workloads. The 68.85 Mbit embedded RAM provides fast on-chip data buffers for streaming algorithms, and the hard DDR4 controller expands to multi-gigabyte working sets. Designers pair the FPGA with HBM2 or DDR4 memory subsystems and use partial reconfiguration to swap accelerator kernels at runtime. Compared to discrete GPU accelerators, FPGA implementations offer deterministic latency and lower power per operation for specific algorithm classes.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AX115N3F40E2SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AX115N3F40E2LG | 10AX115N2F40E2SG | 10AX115N2F40E2LG | 10AX115N2F40E1SG | 10AX115H2F34E2SG |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1156-ball FCBGA (F34) - different |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Speed Grade | N3 | N3 | N2 | N2 | N2 | H2 |
| Temperature Grade | E2 (-40C to +100C) | E2 (-40C to +100C) | E2 (-40C to +100C) | E2 (-40C to +100C) | E1 (0C to +85C) | E2 (-40C to +100C) |
| Lead-Free (Pb-Free) | Yes (G suffix) | Yes (LG suffix) | Yes (G suffix) | Yes (LG suffix) | Yes (G suffix) | Yes (G suffix) |
| Recommended Use | Arria 10 GX F40 high-speed serial | Same as this part with LG finish | Lower speed grade variant | N2 speed + LG finish | Commercial temp variant | Arria 10 GT in F34 package |
Wichtigste Unterscheidungsmerkmale
- N3 speed grade for maximum Fmax on fabric and transceivers (vs. 10AX115N2F40E2SG)
- 1517-ball F40 FCBGA with maximum transceiver count in Arria 10 GX family (vs. 10AX115H2F34E2SG)
- E2 enhanced temperature grade for industrial and harsh environments (vs. 10AX115N2F40E1SG)
- G suffix (lead-free finish) standard on most orders (vs. 10AX115N3F40E2LG)
Designhinweise
The 1517-ball FCBGA (F40) package has a 1.0 mm ball pitch and requires a minimum 12-layer PCB stack-up with microvia (laser-drilled) technology for breakout routing. Per Intel's package guidelines, use stacked vias or microvia-in-pad construction to escape the inner-row balls. Maintain a continuous reference plane on layers 2 and (N-1) for power decoupling, with stitched ground vias around high-speed transceiver lanes. Estimated: signal integrity is severely compromised with conventional 8-mil via-in-pad designs; budget 4-6 weeks PCB fab turnaround and use a stack-up partner experienced with HDI (High-Density Interconnect) designs.
Arria 10 GX devices at full transceiver and fabric utilization can dissipate 25-40W depending on toggle rate and logic usage. The 1517-ball FCBGA has a theta_JC of approximately 0.2 C/W per the package datasheet, requiring a heatsink or cold-plate solution for sustained operation. Estimated: at 35W power dissipation and theta_JA of 6-8 C/W with a 200 LFM heatsink, junction-to-ambient temperature rise is approximately 35C above inlet - well within the E2 grade's 100C junction limit. Without active cooling, junction temperature can exceed 125C and trigger thermal shutdown. Plan for thermal validation early in the design cycle.
The Arria 10 GX requires multiple power rails: 0.9V core (VCC), 1.1V auxiliary (VCCAUX), 1.8V/2.5V/3.0V I/O banks (VCCIO), 1.8V transceiver analog (VCCH_GXB), and 1.0V transceiver digital (VCCD_GXB). Per Intel's power management guidelines, use the Intel Enpirion EM11x or compatible PowerSoC regulators with proper sequencing - core voltage must ramp before auxiliary voltage. Add bulk decoupling of at least 220 uF per rail and 0.1 uF + 10 nF high-frequency ceramics near each power pin. Inrush current can exceed 30A on the 0.9V rail at power-up; size the input fuse and bulk capacitors accordingly.
Common pitfalls when designing with the 10AX115N3F40E2SG: (1) Do not reuse Arria V or Cyclone V PCB designs - the F40 FCBGA has a completely different ball pattern. (2) Ensure the external boot flash (typically QSPI or EPCQ-L) is correctly connected to the dedicated configuration pins; miswiring causes 'configuration failed' errors at power-up. (3) Reserve unused transceiver pins as no-connect with the pin planner - leaving them floating causes crosstalk and degrades adjacent channel performance. (4) MSL3 moisture sensitivity requires baking prior to reflow if the package has been exposed to ambient for more than 168 hours.
Transceiver channels on the 10AX115N3F40E2SG must be routed with controlled impedance (typically 85 ohm differential for transceivers, 50 ohm single-ended for general-purpose I/O) per Intel's transceiver layout guidelines. Reference planes must be continuous under all transceiver traces, with ground vias stitching the reference plane every lambda/10 of the highest frequency. Length matching within a transceiver channel should be within 0.127 mm (5 mil) per Intel's skew budget; across channels for parallel protocols, matching within 6.4 ps or better. Estimated: a 4-channel x 10 Gbps link requires approximately 4 mm x 8 mm of PCB real estate with proper via fencing.
Compliance-Informationen
RoHS compliant per EU Directive 2011/65/EU. The 'G' suffix in the part number indicates lead-free (Pb-free) termination per Intel ordering convention. AEC-Q100 not applicable - this is an FPGA IC, not an automotive-grade discrete. Conflict minerals compliant per Intel's Conflict-Free Smelter Program. Halogen-free status not explicitly stated in the datasheet excerpts available; set to 'unknown'.