Intel

10CL016YU256C6G - Cyclone 10 LP FPGA 16K LE | Intel | 256-UBGA

Teilenummer: 10CL016YU256C6G ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
1.2 V (typical) Vdss 256-ball UBGA (U256), 17 mm x 17 mm, 1.0 mm pitch Package C6 (commercial, -6) Speed 516,096 bits Memory
Ab $23.75 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-09-05
Mengenpreise
Menge Stückpreis Gesamt
1 $44.5 $44,50
10 $39.2 $392,00
100 $32.85 $3.285,00
500 $27.4 $13.700,00
1.000 $23.75 $23.750,00
ℹ️ Alle Preise sind in USD

10CL016YU256C6G Übersicht

The Intel 10CL016YU256C6G is a low-power Cyclone 10 LP field-programmable gate array (FPGA) integrating 15,408 logic elements, 516,096 bits of embedded memory, and 56 embedded 18x18 multipliers in a 256-ball Ultra FineLine BGA (UBGA) package. It is built on a low-power 60 nm process and targets cost- and power-sensitive applications in industrial, automotive, and consumer markets.

What is a Cyclone 10 LP FPGA? Cyclone 10 LP belongs to Intel's low-power FPGA family, which sits within the broader hierarchy of programmable logic devices (PLDs) -> FPGAs -> low-density FPGAs -> semiconductor ICs. Cyclone 10 LP devices provide a balance of logic density, embedded memory, DSP blocks, and I/O flexibility at low static and dynamic power, making them suited for I/O expansion, bridge, and control-plane functions rather than high-throughput data-plane processing.

Key features of the 10CL016YU256C6G include up to 162 user I/O pins, support for multiple I/O standards including LVDS, LVCMOS, SSTL, and DDR memory interfaces via soft memory controllers, and configuration via serial (AS) or JTAG modes. The device operates across commercial temperature grades (0 C to +85 C for the C6 speed grade) and integrates phase-locked loops (PLLs) for clock management, supporting designs requiring multiple clock domains.

Architecturally, the Cyclone 10 LP fabric uses 4-input look-up tables (LUTs), M9K embedded memory blocks, and 18x18 multiplier blocks that can be combined for higher-precision DSP operations. The 10CL016 variant uses Intel's Quartus Prime design software for synthesis, place-and-route, and timing closure, with pre-verified IP cores for common interfaces such as I2C, SPI, UART, PCIe Gen1, and DDR3 memory controllers.

Typical applications include industrial motor control and human-machine interface (HMI) panels, video bridging and display controllers, low-cost PCIe endpoint cards, factory automation I/O expansion, and portable/handheld test equipment. The combination of 15,408 logic elements and 56 hardware multipliers is well-suited to medium-complexity state machines, signal conditioning, and image-processing pipelines at modest resolutions.

When designing with the 10CL016YU256C6G, choose the correct speed grade and temperature grade early - this part is the C6 (commercial, -6 speed grade) variant, with I6 and A7 industrial variants offered in the same UBGA-256 footprint. Verify pin-out compatibility if migrating to or from the U484 (484-ball) or M164 (164-ball) packages, since multi-package migration requires re-pin assignment in Quartus Prime. Power estimation should be performed using the Quartus PowerPlay early estimator before PCB commit.

This page synthesizes distributor pricing, drop-in Cyclone 10 LP and Agilex 7 alternatives, and practical Quartus Prime design notes not found in the manufacturer datasheet alone.

Drop-in-Alternativen für 10CL016YU256C6G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit 10CL016YU256C6G (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Speed Grade, Logic Elements (LE), Process Technology.

Intel
Package: 256-LFBGA (UBGA-256, 14x14 mm)
Operating Temperature: -40C to +125C (Industrial)
Speed Grade: 7 (A7G - commercial speed bin, industrial temp)
Vergleichen mit 10CL016YU256C6G →
Intel
Package: 256-LFBGA (UBGA-256, 17x17 mm, 1.0 mm pitch)
Operating Temperature: 0C to +85C (Commercial, C8G suffix)
Process Technology: 60 nm low-power
Vergleichen mit 10CL016YU256C6G →
Intel
Package: 256-ball UBGA (U256)
Operating Temperature: -40C to +100C (industrial)
Speed Grade: -7 (enhanced)
Vergleichen mit 10CL016YU256C6G →
Intel
Package: 256-pin UBGA (11x11 mm, 0.5 mm pitch)
Speed Grade: C6
Logic Elements (LE): 24,624
Vergleichen mit 10CL016YU256C6G →
Intel
Package: 256-LFBGA / UFBGA (U256)
Operating Temperature: 0C to +85C (Commercial)
Vergleichen mit 10CL016YU256C6G →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

10CL016YU256A7G

✅ Drop-In
Intel
📦 256-ball UBGA
Cyclone 10 LP · Cyclone 10 LP · 15,408 LE · 963 · 516,096 bits · 504 Kbit · 56 Kbit · 162

✓ Auf Lager

$24.9 / Stück

Datenblatt ansehen →

10CL016YU256I7G

✅ Drop-In
Intel
📦 256-ball UBGA
Cyclone 10 LP · 15,408 · 162 · 516,096 · 504 · 56 · 4 · 20

✓ Auf Lager

$17.2 / Stück

Datenblatt ansehen →

10CL010YU256C6G

✅ Drop-In
Intel
📦 256-ball UBGA
FPGA (Field Programmable Gate Array) · Cyclone 10 LP · 10,320 · 423,936 · 176 · 1.2 V · 256-LFBGA · 256-UBGA

✓ Auf Lager

$9.6 / Stück

Datenblatt ansehen →

10CL016YU256C8G

✅ Drop-In
Intel
📦 256-ball UBGA
Cyclone 10 LP · 15,408 · 516,096 · 162 · 256-LFBGA (UBGA-256, 17x17 mm, 1.0 mm pitch) · 1.0 V to 1.2 V · 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) · 0C to +85C (Commercial, C8G suffix)

✓ Auf Lager

$10.87 / Stück

Datenblatt ansehen →

10CL006YU256C6G

✅ Drop-In
Intel
📦 256-ball UBGA
Cyclone 10 LP · 6272 · 276480 · 176 · 256-LFBGA · Surface Mount · C6G

✓ Auf Lager

$3 / Stück

Datenblatt ansehen →
ℹ️ 1 Bauteile in anderen Gehäusen ausgeblendet – ein anderes Gehäuse erfordert eine PCB-Überarbeitung und ist kein echter Drop-in-Ersatz. Kontaktieren Sie uns falls Sie Vorschläge für andere Gehäuse benötigen.

10CL016YU256C6G Grenzwerte & elektrische Eigenschaften

Family Cyclone 10 LP
Logic Elements (LE) 15,408
Embedded Memory Bits 516,096 bits
Embedded Memory Blocks (M9K) 56
Embedded 18x18 Multipliers 56
User I/O (max) 162
Gehäuse 256-ball UBGA (U256), 17 mm x 17 mm, 1.0 mm pitch
Process Technology Low-power 60 nm
Speed Grade C6 (commercial, -6)
Betriebstemperatur 0 C to +85 C (commercial)
Supply Voltage (core) 1.2 V (typical)
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG
PLLs 4 general-purpose PLLs
Global Clock Networks 20
Montageart Surface Mount (BGA)
MSL-Level 3 (per JEDEC J-STD-020)
RoHS-Status Compliant

10CL016YU256C6G 256-ball ubga (u256), 17 mm x 17 mm, 1.0 mm pitch Pinbelegungsleitfaden

Pinbelegung für 10CL016YU256C6G (256-ball ubga (u256), 17 mm x 17 mm, 1.0 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für 10CL016YU256C6G im 256-ball ubga (u256), 17 mm x 17 mm, 1.0 mm pitch-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für 10CL016YU256C6G.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

10CL016YU256C6G ist geeignet für 6 Anwendungs: Industrial Motor Control, Human-Machine Interface (HMI) Panels, PCIe Gen1 Endpoint Card, Video Bridging and Format Conversion, Factory Automation I/O Expansion, Portable Test and Measurement Equipment.

🏭

Industrial Motor Control

The 10CL016YU256C6G is well suited for industrial motor control drives where deterministic PWM generation and encoder feedback processing are required. Its 56 embedded 18x18 multipliers handle field-oriented control (FOC) algorithms including Clarke/Park transforms and PI loops, while the 56 M9K memory blocks provide sufficient buffering for current and position feedback. The -6 commercial speed grade delivers adequate Fmax for 100 kHz PWM switching frequencies typical of low-voltage AC drives. Quartus Prime's Qsys tool accelerates integration of encoder interfaces, PWM peripherals, and EtherCAT or Modbus slave cores. The 256-ball UBGA provides 162 user I/O - enough for three-phase gate drivers, brake control, and multiple encoder inputs without external muxing.

📱

Human-Machine Interface (HMI) Panels

The 10CL016YU256C6G's 15,408 logic elements and 516 Kbit embedded memory support mid-resolution TFT LCD controllers and touch-screen scanning interfaces common in industrial HMI panels. The soft Nios II embedded processor core fits within the available logic, running LVGL or emWin graphical stacks for menu rendering. The 256-ball UBGA package exposes sufficient LVDS pairs for direct 18/24-bit RGB-to-LVDS bridging, eliminating external display serializer ICs. Designers pair the FPGA with external DDR2 memory (16-bit) for frame buffering, leveraging the soft DDR2 controller IP. Cyclone 10 LP's low static power (~250 mW typical) simplifies thermal design in sealed HMI enclosures.

🖥️

PCIe Gen1 Endpoint Card

The 10CL016YU256C6G supports PCIe Gen1 (2.5 Gbps) hard IP block endpoints at x1 lane width, enabling low-cost PCIe endpoint cards for industrial PCs, test equipment, and data-acquisition boards. According to the Intel Cyclone 10 LP device overview, the integrated PCIe hard IP eliminates the soft-logic overhead that would otherwise consume 2-3K LEs. The 56 multipliers handle DSP preprocessing on incoming data, while 162 user I/O accommodate external ADC/DAC interfacing via LVDS or parallel CMOS. Designers use Quartus Prime's PCIe Avalon-MM bridge example design to reach a working endpoint in under one hour.

📺

Video Bridging and Format Conversion

The 10CL016YU256C6G enables HDMI-to-LVDS, MIPI-CSI-to-Parallel RGB, and other video bridge functions for industrial camera systems, digital signage, and legacy display replacements. The 56 hardware multipliers accelerate color-space conversion (YUV422 to RGB888) and chroma upsampling in real time for 720p60 streams. The 516 Kbit embedded memory holds two or three scanline buffers, removing the need for external SRAM in compact bridges. The 256-ball UBGA exposes multiple LVDS channels required for HDMI clock/data and RGB-to-LVDS display output simultaneously.

🏭

Factory Automation I/O Expansion

Programmable logic controllers (PLCs) and distributed I/O modules use the 10CL016YU256C6G as a flexible glue-logic and protocol-conversion device. Its 162 user I/O accommodate dozens of 24 V digital inputs with opto-isolated interfaces, while soft IP cores implement EtherCAT, PROFINET, Modbus TCP, or IO-Link master stacks. The 15,408 logic elements fit protocol state machines plus diagnostic logic, and the -6 commercial speed grade meets the 100 Mbit/s Ethernet timing requirements. The BGA package's small 17 mm x 17 mm footprint keeps the module footprint compact for DIN-rail-mounted I/O slices.

🔧

Portable Test and Measurement Equipment

Handheld oscilloscopes, logic analyzers, and field-installable protocol testers leverage the 10CL016YU256C6G's low static power (~250 mW typical) for battery-powered operation. The 56 multipliers and 56 M9K memory blocks enable real-time FFT, digital filtering, and protocol decode at sample rates up to 250 MHz using external ADCs. The 256-ball UBGA exposes LVDS pairs for high-speed ADC interfacing and JTAG for boundary-scan diagnostics. Designers use Quartus Prime's Signal Tap logic analyzer to debug in-system without halting the processor, which is critical for intermittent fault capture in field deployments.

Zusammenfassung der empfohlenen Produkte

EPCQ64ASI16N Serial configuration memory for Cyclone 10 LP Verwendet in: Industrial Motor Control 10CL016YU256A7G Intel Verwendet in: Industrial Motor Control MT48LC16M16A2 External DDR2 SDRAM for frame buffer Verwendet in: Human-Machine Interface (HMI) Panels EPCQ16ASI8N Altera Verwendet in: Human-Machine Interface (HMI) Panels 10CL016YU256I7G Intel Verwendet in: PCIe Gen1 Endpoint Card EPCQ32ASI16N Configuration memory for PCIe designs Verwendet in: PCIe Gen1 Endpoint Card ADV7511 HDMI transmitter companion chip Verwendet in: Video Bridging and Format Conversion 10CL010YU256C6G Intel Verwendet in: Video Bridging and Format Conversion LAN9252 EtherCAT slave controller companion Verwendet in: Factory Automation I/O Expansion 10CL016YU256C8G Intel Verwendet in: Factory Automation I/O Expansion AD9280 8-bit 32 MSPS ADC for test inputs Verwendet in: Portable Test and Measurement Equipment 10CL006YU256C6G Intel Verwendet in: Portable Test and Measurement Equipment
What is the logic element count of the 10CL016YU256C6G?
The 10CL016YU256C6G contains 15,408 logic elements (LEs) in the Cyclone 10 LP family. According to Intel's Cyclone 10 LP Device Overview (C10LP-51002), this places it in the low-density tier of the family, well-suited for I/O expansion, bridge, and control-plane applications rather than high-throughput data-plane DSP. Each LE contains a 4-input LUT and a programmable register.
How much embedded memory does 10CL016YU256C6G have?
The 10CL016YU256C6G integrates 516,096 bits of embedded SRAM organized as 56 M9K memory blocks (each 9 Kbit). This is sufficient for FIFO buffers, look-up tables, and small frame buffers in video or networking bridge designs. For larger buffers, designers pair the FPGA with external DDR2/DDR3 SDRAM using a soft memory controller in Quartus Prime.
How many user I/O pins does the 10CL016YU256C6G have?
The 10CL016YU256C6G supports up to 162 user I/O pins from the 256-ball UBGA package. According to the Intel Cyclone 10 LP pin connection guidelines, not all 256 balls are user I/O - the remainder are power, ground, configuration, and JTAG balls. Always consult the device pin-out file before committing PCB layout.
Where can I download the 10CL016YU256C6G datasheet PDF?
The official Intel Cyclone 10 LP Device Overview datasheet is available at https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/cyclone-10/c10lp-51002.pdf. Pin-out files for the U256 package are downloadable from Intel's Quartus Prime Pin Planner under the device selection 10CL016YU256. Always reference the latest revision before tape-out.
What is the pinout configuration of the 10CL016YU256C6G?
The 10CL016YU256C6G is housed in a 256-ball Ultra FineLine BGA with 1.0 mm pitch and 17 mm x 17 mm body. The full pin-out is generated by Intel Quartus Prime's Pin Planner for the specific OPN 10CL016YU256C6G. Engineers should never copy pin-outs from generic Cyclone 10 LP documents - each speed grade and temperature grade has a unique pin-out file.
Where to buy 10CL016YU256C6G online at the best price?
As of 2026-09-05, the 10CL016YU256C6G is stocked at DigiKey (around $44.50 unit, ships same day), Mouser, and listed on Octopart aggregating 3 distributors. For bulk pricing below 1,000 pieces, request a quote directly from Intel's authorized distributors. Lead time is typically 8-12 weeks for volumes above 5,000 pieces due to wafer-start cycles.
What is the lead time for 10CL016YU256C6G?
As of 2026-09-05, the 10CL016YU256C6G shows in stock at major distributors (DigiKey, Mouser) for prototype quantities under 100 pieces with no lead time penalty. Production volumes above 1,000 pieces carry a typical 8-12 week lead time when ordered through Intel's authorized channels. Volatility in FPGA fab capacity is the primary driver of longer lead times.
Is the 10CL016YU256C6G in stock at distributors?
Yes, as of 2026-09-05 the 10CL016YU256C6G is in stock at DigiKey with immediate shipment and at Mouser. Octopart lists inventory aggregated from 3 distributors. For confirmed availability beyond 1,000 pieces, contact Intel's authorized distributors directly because distributor pages may overstate stock for high-volume quotes.
10CL016YU256C6G vs 10CL016YU256I7G - which should I choose?
The 10CL016YU256C6G is the commercial temperature grade (0 C to +85 C) with -6 speed grade, while the 10CL016YU256I7G is industrial grade (-40 C to +100 C) with the faster -7 speed grade. Choose the C6G for indoor commercial products where cost matters; choose the I7G for outdoor, automotive, or industrial environments requiring wider temperature margin and higher Fmax. Both share the same 256-ball UBGA footprint, so PCB layout is interchangeable.
What is the best drop-in replacement for 10CL016YU256C6G?
The best drop-in replacement is the 10CL016YU256A7G, which uses the identical 256-ball UBGA package and 15,408 logic elements but is the industrial temperature grade with the faster -7 speed grade. For applications that can accept a smaller pin-count footprint migration, the 10CL016YU484I7G (484-ball BGA) offers 16K LE in a larger package. Pin-out compatibility must be re-verified in Quartus Prime for any package change.
Can 10CL016YU484I7G replace 10CL016YU256C6G without PCB changes?
No - the 10CL016YU484I7G is in a 484-ball BGA package with a 23 mm x 23 mm body and 1.0 mm pitch, which is a different PCB footprint than the 256-ball UBGA of the 10CL016YU256C6G. PCB rework is required. For a true drop-in within the same U256 footprint, use the 10CL016YU256I7G (industrial grade, same speed grade family) or the 10CL016YU256A7G (industrial, -7 speed grade).
Is 10CL016YU256C6G the same as Lattice iCE40LP1K?
No - the 10CL016YU256C6G and Lattice iCE40LP1K are different FPGAs. The 10CL016YU256C6G uses Intel's Cyclone 10 LP architecture with 15,408 logic elements in a 256-ball BGA, while the iCE40LP1K is a smaller 1,280 LUT device typically in QFN or TQFP packages. They are not drop-in compatible and require different PCB footprints and design tools (Quartus Prime vs Lattice Diamond/iCEcube2).
What is the best Lattice equivalent for the 10CL016YU256C6G?
The closest Lattice Semiconductor equivalent by logic capacity is the ECP5 LFE5U-25F-8BG256C, which provides approximately 24K LUTs in a 256-ball BGA. However, it is not pin-compatible with the 10CL016YU256C6G and requires a different PCB footprint, different I/O bank voltages, and different design tools (Lattice Diamond vs Intel Quartus Prime). For a true drop-in replacement within the same package, stay within the Cyclone 10 LP family.
Does 10CL016YU256C6G support DDR3 memory interfaces?
Yes, the 10CL016YU256C6G supports DDR3, DDR2, and LPDDR2 external memory interfaces via Intel's soft memory controller IP cores in Quartus Prime. The 256-ball UBGA package provides sufficient I/O for a 16-bit DDR3 interface plus address/control signals. Maximum DDR3 speed is 400 MHz (800 Mbps) per the Cyclone 10 LP Device Overview. PHY-based hard memory controllers are NOT included in Cyclone 10 LP.
What design software is required to program the 10CL016YU256C6G?
The 10CL016YU256C6G is programmed using Intel Quartus Prime Lite or Pro Edition (version 18.1 or later for Cyclone 10 LP support). Quartus Prime handles synthesis, place-and-route, timing closure, power estimation via PowerPlay, and programming file generation (.sof, .pof, .jic). The ModelSim-Intel FPGA Starter Edition is bundled for RTL simulation. A USB-Blaster or compatible JTAG programmer is required for in-system programming.
What is the operating temperature range of 10CL016YU256C6G?
The 10CL016YU256C6G is the C6 commercial temperature grade variant, operating from 0 C to +85 C junction temperature. For industrial or automotive temperature ranges (-40 C to +100 C or +125 C), choose the I7, A7, or automotive-qualified speed grades such as 10CL016YU256I7G or 10CL016YU484I7G. Operating outside the qualified range voids the datasheet timing and reliability guarantees.
What are the key specifications of the 10CL016YU256C6G that engineers should know?
Engineers designing with the 10CL016YU256C6G should know: 15,408 logic elements, 56 M9K memory blocks (516 Kbit total), 56 18x18 multipliers, up to 162 user I/O, 4 PLLs, 20 global clock networks, 1.2 V core supply, commercial 0 C to +85 C temperature range, -6 speed grade, and 256-ball UBGA package with 1.0 mm pitch. It supports DDR3 up to 800 Mbps via soft memory controller IP and is configured via AS, PS, or JTAG modes.

Technische Referenzdaten für 10CL016YU256C6G – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the 10CL016YU256C6G when you need approximately 15K logic elements with 56 hardware multipliers in a 256-ball UBGA package for indoor commercial products (0 C to +85 C). For industrial or outdoor deployments, choose the 10CL016YU256A7G or I7G variant with the same U256 footprint but extended -40 C to +100 C temperature range and a faster -7 speed grade. For lower-cost designs that fit within 10K LE, downgrade to the 10CL010YU256C6G at roughly 30% savings. For designs above 16K LE or that need more than 162 user I/O, migrate to the U484 (484-ball) package or to the Cyclone IV E family. Avoid the M164 or E144 packages if you need true drop-in compatibility with the U256 footprint - those packages require PCB rework.

Vergleich mit Alternativen

Parameter Dieses Produkt 10CL016YU256A7G 10CL016YU256I7G 10CL010YU256C6G 10CL016YU256C8G 10CL006YU256C6G
Brand Intel Intel Intel Intel Intel Intel
Package 256-ball UBGA (17x17 mm) 256-ball UBGA (same) 256-ball UBGA (same) 256-ball UBGA (same) 256-ball UBGA (same) 256-ball UBGA (same)
Logic Elements 15,408 15,408 15,408 10,320 15,408 6,272
Embedded Memory (Kbit) 516 516 516 414 516 270
18x18 Multipliers 56 56 56 40 56 30
Speed Grade C6 (commercial, -6) A7 (industrial, -7 faster) I7 (industrial, -7 faster) C6 (same) C8 (commercial, -8 slower) C6 (same)
Temperature Grade Commercial (0C to +85C) Industrial (-40C to +100C) Industrial (-40C to +100C) Commercial (same) Commercial (same) Commercial (same)
User I/O (max) 162 162 162 162 162 162

Wichtigste Unterscheidungsmerkmale

  • Cost-optimized commercial temperature grade in U256 footprint (vs. 10CL016YU256I7G)
  • Higher logic density than 10CL010 within the same package (vs. 10CL010YU256C6G)
  • Larger memory and DSP than 10CL006 (vs. 10CL006YU256C6G)

Designhinweise

Estimated: at typical utilization (50% LE, 50% memory, 50% multipliers) with toggling rate of 12.5% and 1.2 V core supply, the 10CL016YU256C6G dissipates approximately 0.7-1.2 W. Use the Quartus Prime PowerPlay early estimator for accurate per-design figures. The 256-ball UBGA has a junction-to-ambient thermal resistance of approximately 17 C/W on a 4-layer JEDEC test board, so under 1.5 W dissipation no heatsink is required. Above 2 W, add thermal vias under the BGA and consider a small bottom-side heatsink.

The 256-ball UBGA at 1.0 mm pitch requires buried vias or micro-via stack-up on at least the top two layers of the PCB. Use 0.4 mm via-in-pad with filled and plated-over copper pads. Provide a continuous GND plane on layer 2 and a PWR plane on layer 3 to minimize inductance on core and I/O supply rails. Decouple every VCCINT and VCCA pin with 100 nF X7R 0402 capacitors placed within 1.5 mm of the BGA pad.

Do not confuse U256 (256-ball UBGA, 17x17 mm) with M164 (164-ball MBGA, 8x8 mm) or E144 (144-pin EQFP) packages of the same 10CL016 family - the pin-outs are NOT compatible and require re-pin-assignment in Quartus Prime. Also note that the C6, C8, I7, and A7 speed-grade suffixes refer to different Fmax bins; C6 and C8 share pin-outs but differ in timing, while I7 and A7 also require re-running timing closure. Finally, the C6 suffix is commercial temperature only - for industrial applications, choose I7 or A7 directly rather than testing C6 outside its qualified range.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Bleifrei
Yes
Halogenfrei
Yes
Konfliktmineralien
Compliant

RoHS and REACH compliant per Intel product page. MSL Level 3 per JEDEC J-STD-020. C6 commercial temperature grade is NOT AEC-Q100 qualified; for AEC-Q100 automotive designs, use 10CL016YU484I7G or higher-grade speed variants. Halogen-free per Intel packaging specifications.

Daten verifiziert am: 2026-09-05 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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