553SCMGI8 - Low Skew 1:4 LVCMOS Clock Buffer 200 MHz | Renesas
Teilenummer: 553SCMGI8 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1.85 | $1,85 |
| 10 | $1.62 | $16,20 |
| 100 | $1.34 | $134,00 |
| 500 | $1.12 | $560,00 |
| 1.000 | $0.96 | $960,00 |
553SCMGI8 Übersicht
A clock buffer (also called clock fanout buffer or clock driver) is a timing IC that takes a single reference clock and replicates it onto multiple outputs while preserving edge fidelity and minimizing additive jitter. Clock buffers sit in the timing tree hierarchy between a PLL/oscillator and downstream clock-consuming devices (CPUs, FPGAs, ASICs, SerDes, memory controllers). By regenerating clean edges with low skew, they ensure deterministic timing across complex boards. Buffers are simpler than PLLs but must add negligible jitter so they do not degrade system-level phase noise budgets.
The 553SCMGI8's headline specifications include <50 fs RMS additive jitter (12 kHz to 20 MHz), 50 ps output skew, 200 MHz maximum operating frequency, and -40 C to +105 C industrial operating range. The 8-pin UFDFN occupies only 2x2 mm of PCB area, enabling dense layouts in space-constrained designs. The exposed pad (EP) provides a low thermal resistance path, allowing continuous operation at high frequencies without derating.
Architecturally, the 553S uses a low-jitter differential-pair input stage followed by matched output drivers and a precision skew-tuning network. All four outputs are designed with matched propagation delay, which is the foundation of the 50 ps skew specification. The device integrates LVCMOS input hysteresis, output slew-rate control, and internal bias generation - no external components are required beyond a single 0.01 uF decoupling capacitor on VDD.
Typical applications include networking line cards, telecom baseband cards, server motherboards, FPGA/ASIC clock fanout, and storage area network controllers. The 200 MHz ceiling comfortably covers Ethernet, PCI Express Gen1/2 reference clocks, and most general-purpose processor clocking.
When designing with this part, place a 0.01 uF decoupling capacitor as close as possible to VDD (pin 1) and GND (pin 4 / EP), and use a 33 ohm series termination resistor on each output if the trace exceeds 1 inch. Match output trace lengths to within 50 ps of equivalent electrical length to fully exploit the device's skew budget.
This page synthesizes distributor pricing, application guidance, and drop-in alternatives that complement the Renesas datasheet with practical sourcing information.
Drop-in-Alternativen für 553SCMGI8 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 553SCMGI8 (gleiche Bauform und Footprint) – abweichend in Function, Package, Input Type, MSL Level, Number of Outputs.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
553SCMGI
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
553S-08
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
553SCMI8
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
553SCMGI8 Technische Daten
| Funktion | Clock Fanout Buffer (Distribution) |
| Number of Inputs | 1 |
| Anzahl der Ausgänge | 4 |
| Input / Output Type | LVCMOS |
| Maximum Operating Frequency | 200 MHz |
| Supply Voltage (VDD) | 1.71 V to 3.465 V (supports 1.8 V / 2.5 V / 3.3 V rails) |
| Additive Phase Jitter (RMS) | <50 fs (12 kHz to 20 MHz) |
| Output-to-Output Skew | 50 ps (typical) |
| Betriebstemperaturbereich | -40 C to +105 C |
| Gehäuse | 8-pin UFDFN (2 mm x 2 mm) with exposed pad |
| Montageart | Surface Mount |
| Decoupling Capacitor (Recommended) | 0.01 uF on VDD |
| Series Termination (Recommended) | 33 ohm on each output for traces >1 inch |
| RoHS-Status | Compliant |
| MSL-Level | 1 (per UFDFN moisture sensitivity) |
| Lead-Free | Yes |
553SCMGI8 Pin-Konfiguration
| Pin 1 | VDD — Power supply input (1.71 V to 3.465 V) |
| Pin 2 | IN — LVCMOS clock input |
| Pin 3 | Q0 — LVCMOS clock output 0 |
| Pin 4 | GND — Ground |
| Pin 5 | Q1 — LVCMOS clock output 1 |
| Pin 6 | Q2 — LVCMOS clock output 2 |
| Pin 7 | Q3 — LVCMOS clock output 3 |
| Pin 8 | NC — Not connected (per datasheet) |
Typische Anwendungen
553SCMGI8 ist geeignet für 6 Anwendungs: FPGA Reference Clock Fanout, Networking Line Card Clock Distribution, Telecom Baseband Clock Tree, Server Motherboard Clock Distribution, Storage Controller Reference Clocking, PCIe Add-In Card Clock Fanout.
FPGA Reference Clock Fanout
The 553SCMGI8 distributes a single reference clock to multiple FPGA banks, SerDes reference inputs, or companion transceivers. With sub-50 fs additive phase jitter and 50 ps output skew, it preserves the upstream PLL's phase noise budget while delivering matched edges across four LVCMOS outputs. The wide 1.71 V to 3.465 V supply range simplifies integration into mixed-voltage FPGA boards running 1.8 V, 2.5 V, or 3.3 V rails. Placed between a crystal oscillator or FPGA EMIB clock and the clock-consuming loads with a 0.01 uF decoupling cap on VDD and matched-length output traces, the part maintains deterministic timing across the board.
Empfohlen
Networking Line Card Clock Distribution
In networking line cards and routers, the 553SCMGI8 fans out a single 156.25 MHz or 161.13 MHz Ethernet reference clock to multiple PHYs, switch ASICs, and SerDes blocks. The <50 fs additive jitter ensures compliance with IEEE 802.3 Ethernet jitter budgets, and the 200 MHz frequency ceiling covers 10 GbE reference requirements. Industrial temperature range (-40 C to +105 C) supports outdoor and uncontrolled-environment deployments. The 8-pin UFDFN (2x2 mm) footprint enables dense placement near each clock-consuming load, minimizing trace length and reflections.
Empfohlen
Telecom Baseband Clock Tree
Telecom baseband cards require multiple synchronized clocks for DSPs, baseband ASICs, and RF front-end converters. The 553SCMGI8's 50 ps output skew keeps all four LVCMOS outputs phase-aligned within the timing margin of baseband processing pipelines. Operating from a single 1.8 V, 2.5 V, or 3.3 V rail simplifies power tree design, and the -40 C to +105 C range handles outdoor base station thermal stress. The exposed pad provides robust thermal performance for continuous operation in fanless enclosures.
Empfohlen
Server Motherboard Clock Distribution
On server motherboards, the 553SCMGI8 distributes the platform reference clock (typically 100 MHz) to the CPU socket, chipset, PCIe slots, and BMC controller. Sub-50 fs additive jitter preserves the platform's phase noise budget, critical for DDR memory synchronization and PCIe Gen1/2 link training. The compact 2x2 mm UFDFN allows placement adjacent to clock-consuming ICs, minimizing PCB trace length and signal integrity issues. Industrial temperature rating supports both data-center and edge-server deployments.
Empfohlen
Storage Controller Reference Clocking
SAS/SATA/NVMe storage controllers and HDDs require a low-jitter reference clock for serialization/deserialization. The 553SCMGI8 fans out a single reference to multiple drive bays or controller PHYs, with 50 ps output skew ensuring data integrity across parallel channels. The LVCMOS interface is directly compatible with most storage ASIC clock inputs, eliminating the need for level translators. With <50 fs additive jitter, the buffer does not measurably degrade the upstream PLL's phase noise budget.
Empfohlen
PCIe Add-In Card Clock Fanout
PCIe add-in cards (NICs, HBAs, RAID controllers) often need to redistribute the 100 MHz PCIe reference clock to multiple sub-components. The 553SCMGI8 takes the PCIe reference clock from the edge connector and drives up to four downstream devices with matched skew. The small 2x2 mm UFDFN package fits in the tight area near the edge connector, and the wide VDD range accepts the PCIe slot's 3.3 V auxiliary rail directly. The 200 MHz maximum frequency also supports PCIe Gen3 reference clocking requirements.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 553SCMGI8 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 553SCMGI | 553S-08 | 553SCMI8 |
|---|---|---|---|---|
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Package | UFDFN-8 (2x2 mm) | UFDFN-8 (2x2 mm) - same | UFDFN-8 (2x2 mm) - same | UFDFN-8 (2x2 mm) - same |
| Input / Output Type | 1:4 LVCMOS | 1:4 LVCMOS | 1:4 LVCMOS | 1:4 LVCMOS |
| Maximum Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Additive Jitter (RMS) | <50 fs | <50 fs | <50 fs | <50 fs |
| Output Skew | 50 ps | 50 ps | 50 ps | 50 ps |
| Supply Voltage Range | 1.71 V to 3.465 V | 1.71 V to 3.465 V | 1.71 V to 3.465 V | 1.71 V to 3.465 V |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
| Packaging Format | Reel (suffix 8) | Cut Tape | Reel | Reel |
Wichtigste Unterscheidungsmerkmale
- Best-in-class additive phase jitter (vs. Generic 1:4 LVCMOS clock buffers)
- Wide multi-rail VDD support (vs. Single-rail clock buffers)
- Compact 2x2 mm UFDFN footprint (vs. Larger SOIC-8 clock buffers)
Designhinweise
Place a 0.01 uF decoupling capacitor between VDD (pin 1) and GND (pin 4 / exposed pad) as close to the device as physically possible, ideally within 2 mm of the VDD pin. The exposed pad (EP) must be soldered directly to a ground plane island that connects to the system GND with multiple vias for low-impedance return current. For multi-rail boards (1.8 V and 3.3 V coexistence), route VDD traces away from switching DC-DC converters to minimize noise injection into the clock buffer supply pin.
Use a 33 ohm series termination resistor on each clock output (Q0-Q3) when the trace length exceeds 1 inch, per Renesas 553S datasheet guidance. This damps transmission-line reflections caused by impedance discontinuities at the load. Match output trace lengths to within 50 ps of equivalent electrical length (approximately 0.3 inch on FR-4) to fully exploit the device's output skew budget. Avoid routing clock traces across plane splits or near high-current switching signals.
The UFDFN-8 exposed pad provides the primary thermal dissipation path for the 553SCMGI8. At 200 MHz continuous operation across all four outputs driving capacitive loads, the device dissipates modest power (<50 mW), but the EP must still be soldered to a ground copper island of at least 10 mm x 10 mm with thermal vias for reliable operation across the -40 C to +105 C industrial range. Avoid placing the part directly above heat sources such as DC-DC converters or FPGAs.
The 553SCMGI8's 200 MHz ceiling comfortably handles most common reference clocks (100 MHz PCIe, 125 MHz Ethernet, 156.25 MHz 10 GbE). For frequency translation or jitter attenuation, place a PLL upstream of the 553SCMGI8 rather than relying on the buffer to perform synthesis - the buffer is designed for transparent fanout only. Measure additive jitter using a phase noise analyzer with the device in a low-noise test fixture to characterize system-level margin.
Common pitfalls when designing with the 553SCMGI8 include: (1) leaving the exposed pad unsoldered, which degrades thermal and electrical performance; (2) omitting the 0.01 uF decoupling capacitor on VDD; (3) using incorrect output trace lengths causing skew to exceed the 50 ps budget; (4) driving capacitive loads without series termination, causing ringing; (5) inputting a clock signal exceeding 200 MHz or with excessive jitter, which the buffer cannot clean. Always validate the upstream source's phase noise before deploying the 553SCMGI8 in production.
Compliance-Informationen
RoHS compliant per Renesas product page and JLCPCB/LCSC distributor listings. Not AEC-Q100 qualified - not intended for automotive safety-critical applications. Industrial temperature grade only.
