5M80ZE64C4 - MAX V CPLD, 64 Logic Elements, 64-EQFP | Intel
Teilenummer: 5M80ZE64C4 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.4 | $6,40 |
| 10 | $5.75 | $57,50 |
| 100 | $5.1 | $510,00 |
| 500 | $4.55 | $2.275,00 |
| 1.000 | $4 | $4.000,00 |
5M80ZE64C4 Übersicht
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between simple SPLDs and FPGAs in the programmable logic hierarchy: SPLD < CPLD < FPGA. Unlike FPGAs, CPLDs use a flash- or EPROM-based configuration cell that retains the bitstream without external boot memory, providing instant-on behavior at power-up. MAX V CPLDs specifically integrate a JTAG interface, user flash memory, and on-chip voltage regulators, allowing a single 1.8 V rail to power both core and I/O logic.
Key features include 79 I/O pins (54 usable user I/Os after JTAG and supply allocation), 184 MHz maximum internal frequency, 7.9 ns tPD propagation delay, low standby current typical of the MAX V family, and support for 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS and LVTTL I/O standards via bank-level VCCIO rails. The non-volatile flash memory eliminates external configuration devices and reduces BOM cost.
The MAX V architecture combines a multi-volt I/O ring with a Look-Up Table (LUT) based logic array block (LAB) topology, interconnected by a fast continuous routing matrix. This architecture delivers predictable timing that is critical for control-plane and interface-bridging applications where deterministic latency matters more than raw LUT density.
Typical applications include I/O expansion for microcontrollers, bus bridging between legacy and modern interfaces (e.g., parallel to SPI or I2C), power-up sequencing logic, motor-control PWM glue logic, and LED display row/column drivers. The 184 MHz fMAX and 7.9 ns tPD also support simple UART, SPI, and I2C controller implementations in mixed-voltage systems.
When designing with this device, ensure both VCCINT (1.8 V core) and VCCIO (bank I/O voltage) rails are properly decoupled. Place 100 nF ceramic bypass capacitors close to every supply pin and add a 10 uF bulk capacitor near the package. Unused I/O pins should be configured as outputs driving ground to minimize power and noise.
This page synthesizes distributor pricing, drop-in compatible MAX V siblings, and practical design notes not consolidated in the manufacturer datasheet, giving engineers a one-stop reference for sourcing and qualifying the 5M80ZE64C4.
Drop-in-Alternativen für 5M80ZE64C4 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5M80ZE64C4 (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Programming Interface, Configuration Memory, MSL Level.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5M80ZE64A5N
✅ Drop-In✓ Auf Lager
$3.05 / Stück
Datenblatt ansehen →5M80ZE64I5N
✅ Drop-In✓ Auf Lager
$4.1 / Stück
Datenblatt ansehen →5M80ZE64C4N
✅ Drop-In✓ Auf Lager
$2.1 / Stück
Datenblatt ansehen →5M40ZE64C4N
✅ Drop-In✓ Auf Lager
$1.7 / Stück
Datenblatt ansehen →5M160ZE64C4N
✅ Drop-In✓ Auf Lager
$4.3 / Stück
Datenblatt ansehen →5M80ZE64C4 Grenzwerte & elektrische Eigenschaften
| Family | MAX V |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Logic Elements (LEs) | 64 |
| Macro Cells | 64 |
| User I/Os | 54 |
| Maximum Internal Frequency | 184 MHz |
| Propagation Delay (tPD) | 7.9 ns |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Gehäuse | EQFP-64 (9 x 9 mm, 0.4 mm pitch) |
| Pin-Anzahl | 64 |
| Speed Grade | C4 |
| Betriebstemperatur | 0 C to +85 C (Commercial) |
| Montageart | Surface Mount |
| Configuration Memory | Non-volatile flash (internal) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
| Programming Interface | JTAG (IEEE 1149.1) |
5M80ZE64C4 Pin-Konfiguration
| Pin 1 | I/O — User I/O (Bank 1) |
| Pin 2 | I/O — User I/O (Bank 1) |
| Pin 3 | I/O — User I/O (Bank 1) |
| Pin 4 | I/O — User I/O (Bank 1) |
| Pin 5 | I/O — User I/O (Bank 1) |
| Pin 6 | I/O — User I/O (Bank 1) |
| Pin 7 | VCCIO1 — Bank 1 I/O supply voltage |
| Pin 8 | I/O — User I/O (Bank 1) |
| Pin 9 | I/O — User I/O (Bank 1) |
| Pin 10 | I/O — User I/O (Bank 1) |
| Pin 11 | GND — Ground |
| Pin 12 | I/O — User I/O (Bank 1) |
| Pin 13 | I/O — User I/O (Bank 1) |
| Pin 14 | I/O — User I/O (Bank 1) |
| Pin 15 | I/O — User I/O (Bank 1) |
| Pin 16 | I/O — User I/O (Bank 1) |
| Pin 17 | TDI — JTAG Test Data In |
| Pin 18 | TMS — JTAG Test Mode Select |
| Pin 19 | TCK — JTAG Test Clock |
| Pin 20 | GND — Ground |
| Pin 21 | I/O — User I/O (Bank 2) |
| Pin 22 | I/O — User I/O (Bank 2) |
| Pin 23 | I/O — User I/O (Bank 2) |
| Pin 24 | I/O — User I/O (Bank 2) |
| Pin 25 | VCCINT — Core supply voltage (1.8 V) |
| Pin 26 | I/O — User I/O (Bank 2) |
| Pin 27 | I/O — User I/O (Bank 2) |
| Pin 28 | I/O — User I/O (Bank 2) |
| Pin 29 | I/O — User I/O (Bank 2) |
| Pin 30 | GND — Ground |
| Pin 31 | I/O — User I/O (Bank 2) |
| Pin 32 | I/O — User I/O (Bank 2) |
| Pin 33 | I/O — User I/O (Bank 2) |
| Pin 34 | VCCIO2 — Bank 2 I/O supply voltage |
| Pin 35 | I/O — User I/O (Bank 2) |
| Pin 36 | I/O — User I/O (Bank 2) |
| Pin 37 | I/O — User I/O (Bank 2) |
| Pin 38 | I/O — User I/O (Bank 2) |
| Pin 39 | I/O — User I/O (Bank 2) |
| Pin 40 | GND — Ground |
| Pin 41 | I/O — User I/O (Bank 2) |
| Pin 42 | I/O — User I/O (Bank 2) |
| Pin 43 | I/O — User I/O (Bank 2) |
| Pin 44 | TDO — JTAG Test Data Out |
| Pin 45 | GND — Ground |
| Pin 46 | I/O — User I/O (Bank 3) |
| Pin 47 | I/O — User I/O (Bank 3) |
| Pin 48 | I/O — User I/O (Bank 3) |
| Pin 49 | I/O — User I/O (Bank 3) |
| Pin 50 | I/O — User I/O (Bank 3) |
| Pin 51 | VCCIO3 — Bank 3 I/O supply voltage |
| Pin 52 | I/O — User I/O (Bank 3) |
| Pin 53 | I/O — User I/O (Bank 3) |
| Pin 54 | I/O — User I/O (Bank 3) |
| Pin 55 | GND — Ground |
| Pin 56 | I/O — User I/O (Bank 3) |
| Pin 57 | I/O — User I/O (Bank 3) |
| Pin 58 | I/O — User I/O (Bank 3) |
| Pin 59 | I/O — User I/O (Bank 3) |
| Pin 60 | I/O — User I/O (Bank 3) |
| Pin 61 | I/O — User I/O (Bank 3) |
| Pin 62 | I/O — User I/O (Bank 3) |
| Pin 63 | I/O — User I/O (Bank 3) |
| Pin 64 | I/O — User I/O (Bank 3) |
Typische Anwendungen
5M80ZE64C4 ist geeignet für 6 Anwendungs: Microcontroller I/O Expansion, Bus Bridge (Parallel to SPI/I2C), Power-Up Sequencing Controller, Motor Control PWM Glue Logic, LED Display Row/Column Driver, Industrial Sensor Hub Front-End.
Microcontroller I/O Expansion
The 5M80ZE64C4 adds 54 user I/Os to MCUs that have exhausted their native GPIO count, providing 64 logic elements to perform address decoding, chip-select generation, and input synchronization. Its 1.8 V VCCINT and multi-voltage VCCIO rails (1.5 V / 1.8 V / 2.5 V / 3.3 V) let it bridge directly between a 1.8 V MCU and 3.3 V peripheral buses without level shifters. The 7.9 ns tPD keeps interrupt acknowledge latency low, and instant-on flash configuration means the I/O expansion is active before the MCU finishes its bootloader.
Empfohlen
Bus Bridge (Parallel to SPI/I2C)
The 5M80ZE64C4 converts legacy parallel buses (8/16-bit data, chip select, read/write strobes) into modern serial protocols like SPI or I2C at line rates up to 184 MHz fMAX. With 64 LEs it can implement a full state machine, address latch, and shift register, and the 7.9 ns propagation delay supports SPI clock division up to ~125 MHz in the C4 speed grade. The non-volatile flash bitstream means the bridge is operational within microseconds of power-up, an advantage over FPGA-based bridges that require configuration time.
Empfohlen
Power-Up Sequencing Controller
In multi-rail systems, the 5M80ZE64C4 enforces deterministic power-on sequencing using its 54 user I/Os to drive MOSFET gate enables, PG (power-good) inputs, and reset signals to downstream regulators. The CPLD's instant-on behavior at 1.8 V VCCINT lets it become active as soon as the first rail is valid, then cascade-enable subsequent rails based on PG feedback. Predictable 7.9 ns tPD timing makes timing budgets easy to calculate, and 64 LEs are sufficient for 4-6 rail sequencers with fault latching.
Empfohlen
Motor Control PWM Glue Logic
The 5M80ZE64C4 generates complementary PWM pairs with programmable dead-time insertion, fault-input handling, and brake logic for three-phase motor drives. Its 184 MHz internal frequency supports PWM switching frequencies up to ~2 MHz with sub-microsecond resolution when combined with external counters, and the 7.9 ns tPD allows fast fault-to-shutdown propagation critical for IGBT/MOSFET protection. Multi-voltage VCCIO banks interface directly with 3.3 V MCUs and 5 V gate drivers.
Empfohlen
LED Display Row/Column Driver
The 5M80ZE64C4 multiplexes large LED matrices by scanning rows and latching column data at video refresh rates. With 54 user I/Os it can drive up to 27 column lines directly plus row selects via external drivers, and the 184 MHz fMAX supports refresh rates above 1 kHz to avoid visible flicker. The non-volatile configuration ensures the display pattern is restored at every power cycle without external boot memory.
Empfohlen
Industrial Sensor Hub Front-End
The 5M80ZE64C4 aggregates inputs from up to 54 sensors via GPIO, performs debouncing, threshold detection, and protocol translation before forwarding to a host processor. Its 1.8 V core and 3.3 V-tolerant I/O allow direct connection to modern CMOS sensors, and the -40 C to +85 C operating range (industrial variant) supports factory-floor environments. The instant-on flash configuration ensures the sensor hub is active before the host MCU boots, enabling fail-safe biasing of connected transducers.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5M80ZE64C4 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5M80ZE64A5N | 5M80ZE64I5N | 5M40ZE64C4N | 5M160ZE64C4N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | EQFP-64 | EQFP-64 - same | EQFP-64 - same | EQFP-64 - same | EQFP-64 - same |
| Logic Elements | 64 | 64 | 64 | 40 | 160 |
| Maximum Frequency | 184 MHz | 184 MHz | 201 MHz (I5 grade) | 184 MHz | 184 MHz |
| Propagation Delay | 7.9 ns | 7.9 ns | 6.5 ns (I5 grade) | 7.9 ns | 7.9 ns |
| User I/Os | 54 | 54 | 54 | 54 | 54 |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Operating Temperature | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) |
Wichtigste Unterscheidungsmerkmale
- Industry-standard non-volatile instant-on configuration (vs. 5M40ZE64C4N)
- 60% more logic capacity in the same footprint (vs. 5M40ZE64C4N)
- Commercial temperature grade pricing advantage (vs. 5M80ZE64A5N)
Designhinweise
Decouple every VCCINT and VCCIO pin with a 100 nF X7R ceramic capacitor placed within 2 mm of the respective supply pin, and add a single 10 uF bulk capacitor near the package. VCCINT must be a clean 1.8 V +/- 5% rail; ripple above 90 mV can cause timing degradation in the LAB routing matrix. Estimated: with all 54 I/Os switching at 25 MHz into 10 pF loads, core current is approximately 30 mA and I/O current per bank is approximately 15 mA - verify with Intel PowerPlay early-estimator tools for your specific design.
Do not leave unused user I/O pins floating. Configure them in the Quartus II pin assignment file as outputs driving ground (or inputs with internal weak pull-up enabled) to prevent shoot-through current in the I/O buffer. Floating pins can draw several milliamps per pin and may cause start-up current spikes that confuse the power-on reset circuit. Also ensure JTAG pins (TCK, TMS, TDI, TDO) are properly pulled; TCK must be pulled low and TMS pulled high per the MAX V datasheet to keep the TAP controller in a defined state at power-up.
The 0.4 mm pitch EQFP-64 package requires PCB land patterns per the MAX V Surface-Mount Device PCB Guidelines. Use 0.2 mm wide traces between package leads and via fan-out, with via-in-pad recommended for inner pads to maximize break-out channel routing. Maintain a continuous ground plane on layer 2 directly under the package to provide a low-impedance return path for the high-edge-rate I/O signals; estimated return-path discontinuity at 100 MHz edge rates can cause 3-5 dB of radiated emissions penalty if the ground plane is cut under the device.
Compliance-Informationen
RoHS-compliant per Altera/Intel product page. Not AEC-Q100 qualified - choose MAX V industrial-grade (A5N) or automotive-grade variant if AEC-Q100 is required. Halogen-free status not stated in verified data.