88W9098-A2-NYGC - Wi-Fi 6 + Bluetooth 5.3 SoC | NXP
Teilenummer: 88W9098-A2-NYGC ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $16.32 | $16,32 |
| 10 | $15.51 | $155,10 |
| 100 | $14.69 | $1.469,00 |
| 500 | $13.88 | $6.940,00 |
| 1.000 | $13.14 | $13.140,00 |
88W9098-A2-NYGC Übersicht
A wireless SoC is an integrated circuit that combines RF transceivers, baseband processing, a CPU subsystem, and memory interfaces on a single die, forming the complete radio and protocol engine of a connectivity system. Within the wireless-connectivity hierarchy, the 88W9098 sits at the Wi-Fi + Bluetooth combo device level, bridging IEEE 802.11ax PHY/MAC layers and Bluetooth 5.3 radio layers in one part.
Key features include 2x2 dual-band (2.4 GHz and 5 GHz) 802.11ax operation with gigabit-level throughput, concurrent dual Wi-Fi plus dual-mode Bluetooth 5.3 architecture, and superior reliability and enhanced security per NXP's product documentation. The exposed-pad VQFN package supports thermal dissipation and signal integrity at high data rates.
Architecturally, the 88W9098 integrates concurrent dual-Wi-Fi MAC engines that allow simultaneous operation on two Wi-Fi interfaces (for example 2.4 GHz and 5 GHz) without time-slicing, while the dual-mode Bluetooth controller supports Bluetooth Low Energy (BLE) and Bluetooth Classic for audio and sensor use cases.
Typical applications include IoT gateways, Wi-Fi 6 access points, industrial connectivity, and smart-home hubs, where concurrent dual-band Wi-Fi and BLE reduce bill-of-materials and design complexity.
Design consideration: plan for the exposed thermal pad connection to a solid ground plane and follow NXP reference design RF layout guidelines to achieve rated EVM and sensitivity performance.
This page synthesizes verified distributor availability data, lifecycle and lead-time information, and design guidance not found on a single manufacturer or distributor page.
Drop-in-Alternativen für 88W9098-A2-NYGC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
88W9098-A2-NYGC/AK
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
88W9098-A2-NYGC/MP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
88W9098-A2-NYGC Technische Daten
| Wireless Standard | IEEE 802.11ax (Wi-Fi 6) |
| Bluetooth Version | Bluetooth 5.3 (dual-mode) |
| Wi-Fi Configuration | 2x2 dual band |
| Frequency Bands | 2.4 GHz and 5 GHz |
| Architecture | Concurrent dual Wi-Fi and dual-mode Bluetooth |
| Funktion | Wireless SoC (Wi-Fi + Bluetooth combo RF transceiver) |
| Target Markets | IoT, Access, Industrial |
| Throughput Class | Gigabit-level performance |
| Gehäuse / Bauform | 88-VFQFN Exposed Pad (10x10 mm) |
| Montageart | Surface Mount |
| Packaging | TRAY-Tray, Bakeable, Multiple in Drypack |
| Standard Package Quantity | 168 |
| Minimum Order Quantity | 168 |
| Lead Time | 99 weeks (per NXP, as of 2026-09-27) |
88W9098-A2-NYGC 168 Pinbelegungsleitfaden
Pinbelegung für 88W9098-A2-NYGC (168-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für 88W9098-A2-NYGC.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
88W9098-A2-NYGC ist geeignet für 6 Anwendungs: IoT Gateways, Wi-Fi 6 Access Points, Industrial Connectivity, Smart Home Hubs, Wireless Video and Media Streaming, Embedded Systems Design and Development.
IoT Gateways
The 88W9098-A2-NYGC fits IoT gateways because its concurrent dual Wi-Fi architecture serves backhaul and client-facing radios on one chip, while integrated dual-mode Bluetooth 5.3 handles BLE provisioning and sensor connectivity without a separate controller. In a typical gateway, one Wi-Fi interface links upstream to a router or cloud backhaul at 5 GHz while the second interface serves 2.4 GHz IoT clients, achieving gigabit-class aggregate throughput per NXP documentation. Using a single combo SoC reduces BOM count, PCB area, and inter-chip coexistence design effort versus discrete Wi-Fi plus BLE solutions. The 88-VFQFN exposed-pad package supports the thermal and ground integrity needed for always-on gateway duty cycles. Pair it with an NXP i.MX application processor for a fully supported NXP reference-design path with production-ready drivers.
Empfohlen
Wi-Fi 6 Access Points
For enterprise and SMB Wi-Fi 6 access points, the 88W9098-A2-NYGC provides 2x2 dual-band 802.11ax radios with OFDMA and gigabit-level throughput in a single 88-VFQFN exposed-pad device. NXP positions the part for the Access market specifically, and its concurrent dual-Wi-Fi MAC engine allows simultaneous 2.4 GHz and 5 GHz operation without time-slicing overhead, improving airtime efficiency in dense client environments. The enhanced-security features cited by NXP support WPA3-class deployments required in modern enterprise networks. Design-in typically pairs the SoC with external front-end modules (PAs/LNAs/switches) matched to the 2.4 GHz and 5 GHz bands, following NXP reference designs for EVM and spectral-mask compliance. Verify regulatory certification data for your target regions during system qualification.
Empfohlen
Industrial Connectivity
NXP explicitly targets the 88W9098-A2-NYGC at the Industrial market, where reliable wireless links for factory automation, AGVs, and condition-monitoring systems are required. Wi-Fi 6 mechanisms such as OFDMA and target wake time improve determinism and client density handling compared with Wi-Fi 5, while Bluetooth 5.3 adds BLE beacon and sensor commissioning channels used in industrial retrofit deployments. The exposed-pad VQFN package supports robust grounding needed in electromagnetically noisy factory environments, though industrial designs must still validate EMC per their regional standards. Note the 99-week factory lead time published by NXP (as of September 2026): industrial programs should secure long-term supply agreements or distributor stock early. The concurrent dual Wi-Fi architecture also enables separate OT and IT network segmentation on one radio chip.
Empfohlen
Smart Home Hubs
Smart-home hubs benefit from the 88W9098-A2-NYGC's integrated dual-mode Bluetooth 5.3 for BLE device provisioning and its dual-band Wi-Fi 6 for cloud and local network connectivity in one SoC. Matter-over-Wi-Fi and BLE-based onboarding flows map directly onto the concurrent dual Wi-Fi plus BT architecture, allowing hub firmware to run the BLE commissioning channel and the Wi-Fi uplink simultaneously without an external coexistence controller. Gigabit-class throughput supports media-heavy hub use cases such as camera aggregation and local voice processing pipelines. The single-chip integration reduces PCB area, valuable in wall-plug and set-top form factors. Designs should budget for the 168-unit minimum order quantity and the long factory lead time when planning consumer production volumes, and source from distributor stock for builds inside a 12-month window.
Empfohlen
Wireless Video and Media Streaming
The gigabit-level throughput class of the 88W9098-A2-NYGC supports wireless display, IP-camera backhaul, and multi-stream audio/video distribution over Wi-Fi 6, where 802.11ax OFDMA and 1024-QAM improve spectral efficiency at range versus Wi-Fi 5. The concurrent dual-Wi-Fi capability lets a streaming device maintain a 5 GHz high-bandwidth link for video while reserving a 2.4 GHz link for control and BLE audio accessories via the integrated Bluetooth 5.3 dual-mode controller. For audio products, Bluetooth Classic support in the dual-mode radio enables high-quality A2DP streaming alongside Wi-Fi services on the same chip. Designers should validate sustained-throughput thermal behavior in the 88-VFQFN package under continuous streaming loads and follow NXP reference-design thermal-pad recommendations to keep junction temperatures within rating.
Empfohlen
Embedded Systems Design and Development
For embedded developers building connectivity into custom Linux or RTOS platforms, the 88W9098-A2-NYGC offers a documented SDIO/PCIe-class host interface path and NXP-maintained drivers integrated into mainline and vendor kernels for i.MX host processors. The NXP hardware design guide and reference designs define RF matching, crystal, power-tree, and exposed-pad grounding requirements, shortening the path from schematic to regulatory pre-scan. Because this is a secure wireless SoC, full datasheet access may require an NXP account or NDA - budget time for documentation access at project start. Given the 99-week factory lead time, development teams should buy evaluation quantities from distributor stock (DigiKey lists the /MP variant shipping today) and lock in production supply through NXP or authorized channels early. Driver maturity and reference-design availability are the primary reasons to choose this part over cross-brand functional equivalents.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 88W9098-A2-NYGC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 88W9098-A2-NYGC/AK | 88W9098-A2-NYGC/MP |
|---|---|---|---|
| Package | 88-VFQFN Exposed Pad (10x10 mm) | 88-VFQFN Exposed Pad - same | 88-VFQFN Exposed Pad - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Wi-Fi Standard | 802.11ax (Wi-Fi 6) | 802.11ax (Wi-Fi 6) | 802.11ax (Wi-Fi 6) |
| Bluetooth Version | 5.3 dual-mode | 5.3 dual-mode | 5.3 dual-mode |
| Radio Configuration | 2x2 dual band | 2x2 dual band | 2x2 dual band |
| Concurrent Dual Wi-Fi + BT | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Industry-first concurrent dual Wi-Fi + dual-mode Bluetooth 5.3 architecture (vs. 88W8997)
- Wi-Fi 6 (802.11ax) with gigabit-level throughput (vs. 88W8997)
- Ordering-suffix interchangeability within the same footprint (vs. 88W9098-A2-NYGC/AK)
Designhinweise
The 88-VFQFN exposed pad (10x10 mm) is the primary thermal and ground path for the 88W9098-A2-NYGC. Connect it to a continuous ground plane with a via array (typical pattern: 5x5 or denser, filled and capped vias for RF designs) under the pad. Concurrent dual Wi-Fi operation at gigabit-level throughput raises average dissipation versus single-radio operation, so verify junction temperature under worst-case concurrent 2.4 GHz + 5 GHz TX duty in your enclosure. Follow NXP reference-design copper keepouts for the RF sections.
Route 2.4 GHz and 5 GHz RF traces as controlled-impedance (50 ohm) lines with the matching network placed per the NXP hardware design guide for the 88W9098. Keep crystal and power-decoupling components close to their pins; separate the RF ground region from noisy host-interface routing. The 10x10 mm 88-pin VQFN footprint has a 0.4 mm-class pitch - specify solder-paste aperture design per NXP application note to avoid bridging, and inspect with X-ray or AOI given the exposed-pad voiding risk.
Two supply-chain pitfalls dominate this part: (1) NXP lists a 99-week factory lead time and 168-unit minimum order (bakeable drypack trays), so rely on distributor stock for anything under a year out - MSL baking instructions must be followed after drypack removal; (2) ordering-suffix mismatches (-NYGC vs -NYGC/AK vs -NYGC/MP) cause BOM/delivery confusion - lock the exact suffix in procurement documentation and confirm the host driver package version supports the A2 silicon revision.
Compliance-Informationen
Compliance data not stated in the provided web data. NXP parts are typically RoHS-compliant, but this must be confirmed on the official NXP product page compliance documents before design-in.
