88W9098-A2-NYGC - Wi-Fi 6 + Bluetooth 5.3 SoC | NXP
부품 번호: 88W9098-A2-NYGC ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $16.32 | $16.32 |
| 10 | $15.51 | $155.10 |
| 100 | $14.69 | $1,469.00 |
| 500 | $13.88 | $6,940.00 |
| 1,000 | $13.14 | $13,140.00 |
88W9098-A2-NYGC 개요
A wireless SoC is an integrated circuit that combines RF transceivers, baseband processing, a CPU subsystem, and memory interfaces on a single die, forming the complete radio and protocol engine of a connectivity system. Within the wireless-connectivity hierarchy, the 88W9098 sits at the Wi-Fi + Bluetooth combo device level, bridging IEEE 802.11ax PHY/MAC layers and Bluetooth 5.3 radio layers in one part.
Key features include 2x2 dual-band (2.4 GHz and 5 GHz) 802.11ax operation with gigabit-level throughput, concurrent dual Wi-Fi plus dual-mode Bluetooth 5.3 architecture, and superior reliability and enhanced security per NXP's product documentation. The exposed-pad VQFN package supports thermal dissipation and signal integrity at high data rates.
Architecturally, the 88W9098 integrates concurrent dual-Wi-Fi MAC engines that allow simultaneous operation on two Wi-Fi interfaces (for example 2.4 GHz and 5 GHz) without time-slicing, while the dual-mode Bluetooth controller supports Bluetooth Low Energy (BLE) and Bluetooth Classic for audio and sensor use cases.
Typical applications include IoT gateways, Wi-Fi 6 access points, industrial connectivity, and smart-home hubs, where concurrent dual-band Wi-Fi and BLE reduce bill-of-materials and design complexity.
Design consideration: plan for the exposed thermal pad connection to a solid ground plane and follow NXP reference design RF layout guidelines to achieve rated EVM and sensitivity performance.
This page synthesizes verified distributor availability data, lifecycle and lead-time information, and design guidance not found on a single manufacturer or distributor page.
드롭인 대체품: 88W9098-A2-NYGC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
88W9098-A2-NYGC/AK
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
88W9098-A2-NYGC/MP
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
88W9098-A2-NYGC 사양
| Wireless Standard | IEEE 802.11ax (Wi-Fi 6) |
| Bluetooth Version | Bluetooth 5.3 (dual-mode) |
| Wi-Fi Configuration | 2x2 dual band |
| Frequency Bands | 2.4 GHz and 5 GHz |
| Architecture | Concurrent dual Wi-Fi and dual-mode Bluetooth |
| 기능 | Wireless SoC (Wi-Fi + Bluetooth combo RF transceiver) |
| Target Markets | IoT, Access, Industrial |
| Throughput Class | Gigabit-level performance |
| 패키지 / 케이스 | 88-VFQFN Exposed Pad (10x10 mm) |
| 실장 유형 | Surface Mount |
| Packaging | TRAY-Tray, Bakeable, Multiple in Drypack |
| Standard Package Quantity | 168 |
| Minimum Order Quantity | 168 |
| Lead Time | 99 weeks (per NXP, as of 2026-09-27) |
88W9098-A2-NYGC 168 핀 구성 가이드
88W9098-A2-NYGC(168 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: 88W9098-A2-NYGC.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
88W9098-A2-NYGC 적합 용도: 6 애플리케이션s: IoT Gateways, Wi-Fi 6 Access Points, Industrial Connectivity, Smart Home Hubs, Wireless Video and Media Streaming, Embedded Systems Design and Development.
IoT Gateways
The 88W9098-A2-NYGC fits IoT gateways because its concurrent dual Wi-Fi architecture serves backhaul and client-facing radios on one chip, while integrated dual-mode Bluetooth 5.3 handles BLE provisioning and sensor connectivity without a separate controller. In a typical gateway, one Wi-Fi interface links upstream to a router or cloud backhaul at 5 GHz while the second interface serves 2.4 GHz IoT clients, achieving gigabit-class aggregate throughput per NXP documentation. Using a single combo SoC reduces BOM count, PCB area, and inter-chip coexistence design effort versus discrete Wi-Fi plus BLE solutions. The 88-VFQFN exposed-pad package supports the thermal and ground integrity needed for always-on gateway duty cycles. Pair it with an NXP i.MX application processor for a fully supported NXP reference-design path with production-ready drivers.
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Wi-Fi 6 Access Points
For enterprise and SMB Wi-Fi 6 access points, the 88W9098-A2-NYGC provides 2x2 dual-band 802.11ax radios with OFDMA and gigabit-level throughput in a single 88-VFQFN exposed-pad device. NXP positions the part for the Access market specifically, and its concurrent dual-Wi-Fi MAC engine allows simultaneous 2.4 GHz and 5 GHz operation without time-slicing overhead, improving airtime efficiency in dense client environments. The enhanced-security features cited by NXP support WPA3-class deployments required in modern enterprise networks. Design-in typically pairs the SoC with external front-end modules (PAs/LNAs/switches) matched to the 2.4 GHz and 5 GHz bands, following NXP reference designs for EVM and spectral-mask compliance. Verify regulatory certification data for your target regions during system qualification.
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Industrial Connectivity
NXP explicitly targets the 88W9098-A2-NYGC at the Industrial market, where reliable wireless links for factory automation, AGVs, and condition-monitoring systems are required. Wi-Fi 6 mechanisms such as OFDMA and target wake time improve determinism and client density handling compared with Wi-Fi 5, while Bluetooth 5.3 adds BLE beacon and sensor commissioning channels used in industrial retrofit deployments. The exposed-pad VQFN package supports robust grounding needed in electromagnetically noisy factory environments, though industrial designs must still validate EMC per their regional standards. Note the 99-week factory lead time published by NXP (as of September 2026): industrial programs should secure long-term supply agreements or distributor stock early. The concurrent dual Wi-Fi architecture also enables separate OT and IT network segmentation on one radio chip.
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Smart Home Hubs
Smart-home hubs benefit from the 88W9098-A2-NYGC's integrated dual-mode Bluetooth 5.3 for BLE device provisioning and its dual-band Wi-Fi 6 for cloud and local network connectivity in one SoC. Matter-over-Wi-Fi and BLE-based onboarding flows map directly onto the concurrent dual Wi-Fi plus BT architecture, allowing hub firmware to run the BLE commissioning channel and the Wi-Fi uplink simultaneously without an external coexistence controller. Gigabit-class throughput supports media-heavy hub use cases such as camera aggregation and local voice processing pipelines. The single-chip integration reduces PCB area, valuable in wall-plug and set-top form factors. Designs should budget for the 168-unit minimum order quantity and the long factory lead time when planning consumer production volumes, and source from distributor stock for builds inside a 12-month window.
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Wireless Video and Media Streaming
The gigabit-level throughput class of the 88W9098-A2-NYGC supports wireless display, IP-camera backhaul, and multi-stream audio/video distribution over Wi-Fi 6, where 802.11ax OFDMA and 1024-QAM improve spectral efficiency at range versus Wi-Fi 5. The concurrent dual-Wi-Fi capability lets a streaming device maintain a 5 GHz high-bandwidth link for video while reserving a 2.4 GHz link for control and BLE audio accessories via the integrated Bluetooth 5.3 dual-mode controller. For audio products, Bluetooth Classic support in the dual-mode radio enables high-quality A2DP streaming alongside Wi-Fi services on the same chip. Designers should validate sustained-throughput thermal behavior in the 88-VFQFN package under continuous streaming loads and follow NXP reference-design thermal-pad recommendations to keep junction temperatures within rating.
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Embedded Systems Design and Development
For embedded developers building connectivity into custom Linux or RTOS platforms, the 88W9098-A2-NYGC offers a documented SDIO/PCIe-class host interface path and NXP-maintained drivers integrated into mainline and vendor kernels for i.MX host processors. The NXP hardware design guide and reference designs define RF matching, crystal, power-tree, and exposed-pad grounding requirements, shortening the path from schematic to regulatory pre-scan. Because this is a secure wireless SoC, full datasheet access may require an NXP account or NDA - budget time for documentation access at project start. Given the 99-week factory lead time, development teams should buy evaluation quantities from distributor stock (DigiKey lists the /MP variant shipping today) and lock in production supply through NXP or authorized channels early. Driver maturity and reference-design availability are the primary reasons to choose this part over cross-brand functional equivalents.
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추천 제품 요약
엔지니어링 참조 데이터: 88W9098-A2-NYGC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 88W9098-A2-NYGC/AK | 88W9098-A2-NYGC/MP |
|---|---|---|---|
| Package | 88-VFQFN Exposed Pad (10x10 mm) | 88-VFQFN Exposed Pad - same | 88-VFQFN Exposed Pad - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Wi-Fi Standard | 802.11ax (Wi-Fi 6) | 802.11ax (Wi-Fi 6) | 802.11ax (Wi-Fi 6) |
| Bluetooth Version | 5.3 dual-mode | 5.3 dual-mode | 5.3 dual-mode |
| Radio Configuration | 2x2 dual band | 2x2 dual band | 2x2 dual band |
| Concurrent Dual Wi-Fi + BT | Yes | Yes | Yes |
주요 차별점
- Industry-first concurrent dual Wi-Fi + dual-mode Bluetooth 5.3 architecture (vs 88W8997)
- Wi-Fi 6 (802.11ax) with gigabit-level throughput (vs 88W8997)
- Ordering-suffix interchangeability within the same footprint (vs 88W9098-A2-NYGC/AK)
설계 노트
The 88-VFQFN exposed pad (10x10 mm) is the primary thermal and ground path for the 88W9098-A2-NYGC. Connect it to a continuous ground plane with a via array (typical pattern: 5x5 or denser, filled and capped vias for RF designs) under the pad. Concurrent dual Wi-Fi operation at gigabit-level throughput raises average dissipation versus single-radio operation, so verify junction temperature under worst-case concurrent 2.4 GHz + 5 GHz TX duty in your enclosure. Follow NXP reference-design copper keepouts for the RF sections.
Route 2.4 GHz and 5 GHz RF traces as controlled-impedance (50 ohm) lines with the matching network placed per the NXP hardware design guide for the 88W9098. Keep crystal and power-decoupling components close to their pins; separate the RF ground region from noisy host-interface routing. The 10x10 mm 88-pin VQFN footprint has a 0.4 mm-class pitch - specify solder-paste aperture design per NXP application note to avoid bridging, and inspect with X-ray or AOI given the exposed-pad voiding risk.
Two supply-chain pitfalls dominate this part: (1) NXP lists a 99-week factory lead time and 168-unit minimum order (bakeable drypack trays), so rely on distributor stock for anything under a year out - MSL baking instructions must be followed after drypack removal; (2) ordering-suffix mismatches (-NYGC vs -NYGC/AK vs -NYGC/MP) cause BOM/delivery confusion - lock the exact suffix in procurement documentation and confirm the host driver package version supports the A2 silicon revision.
규정 준수 정보
Compliance data not stated in the provided web data. NXP parts are typically RoHS-compliant, but this must be confirmed on the official NXP product page compliance documents before design-in.
