89H24NT24G2ZCHLGI - 24-Lane/24-Port PCIe Gen2 Switch | Renesas
Teilenummer: 89H24NT24G2ZCHLGI ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $172.5 | $1.725,00 |
| 50 | $162 | $8.100,00 |
| 100 | $151 | $15.100,00 |
| 500 | $138 | $69.000,00 |
89H24NT24G2ZCHLGI Übersicht
A PCIe Gen2 system interconnect switch is a semiconductor device that expands the number of PCIe endpoints a root complex can service by routing Transaction Layer Packets (TLPs) between upstream ports and multiple downstream ports. Switches sit hierarchically below root complexes and endpoints in the PCIe topology and are essential for fan-out in dense compute and storage systems. Each Gen2 lane runs at 5 GT/s, doubling the bandwidth of Gen1 (2.5 GT/s) and enabling higher per-port throughput while preserving backward compatibility with Gen1 endpoints.
Key features of the 89H24NT24G2ZCHLGI include support for PCI Express Gen2 (5.0 GT/s) on all 24 lanes, 24 configurable ports, non-blocking cut-through architecture, and integrated clocking with spread-spectrum support. The device supports maximum payload sizes up to 4096 bytes (MPS), Extended Configuration Space access, and provides per-port flow control. Power management is implemented through PCI-PM 1.2 compliant link states and proprietary low-power modes that gate unused ports, reducing idle consumption in dense designs.
The switch fabric uses a multi-stage shared-memory architecture that preserves packet ordering and supports peer-to-peer routing between any two downstream ports without host intervention. This enables direct memory transfers in heterogeneous compute topologies (e.g., GPU-to-storage, NVMe-to-CPU) and minimizes root-port bottlenecking. The on-chip SerDes supports Gen2 electrical signaling with adaptive equalization and de-emphasis for compliance with PCI-SIG CEM specifications across standard channel reaches up to approximately 12 inches of FR4.
Typical applications include NVMe storage fabrics in hyperscale servers, multi-host disaggregated storage platforms, GPU expansion chassis, embedded industrial backplanes, and PCIe-over-cable fan-out systems. The 324-FCBGA package supports high-density PCB designs with controlled-impedance routing for the 24 SerDes lanes. End-of-life (Obsolete) status affects long-term availability but the part remains supported by Renesas for embedded and legacy server customers.
Design considerations: maintain 85-ohm differential impedance on all 24 SerDes lanes, provide matched-length routing within 5 mils to preserve Gen2 eye margins, and ensure robust reference clock distribution with the on-chip PLL bypass option. The device requires multiple voltage rails (core, SerDes, I/O); refer to the manufacturer datasheet for decoupling topology.
This page synthesizes distributor pricing, drop-in alternatives, and engineering design notes beyond the manufacturer datasheet.
Drop-in-Alternativen für 89H24NT24G2ZCHLGI – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
89H24NT24G2ZCHLGI8
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
89H24NT24G2ZAHL
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
89H24NT24G2ZAHLG8
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
89H24NT24G2ZBHL8
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
89H24NT24G2ZBHL
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PEX8724-CA80BC G
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PM8532B-FEI
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
89H24NT24G2ZCHLGI Grenzwerte & elektrische Eigenschaften
| Funktion | PCI Express Gen2 System Interconnect Switch |
| PCIe Generation | Gen2 (5.0 GT/s) |
| Number of Lanes | 24 |
| Number of Ports | 24 |
| Throughput | Full line rate, non-blocking per port |
| Architecture | Cut-through, shared-memory switching fabric |
| Power Management | PCI-PM 1.2 compliant link states |
| Spread-Spectrum Clocking | Supported |
| Gehäuse | 324-FCBGA (19x19 mm) |
| Montageart | Surface Mount |
| Series | 89HPES24NT24G2 |
| Lebenszyklusstatus | Obsolete (per Renesas product page) |
| Original Manufacturer | IDT (Integrated Device Technology), now Renesas |
89H24NT24G2ZCHLGI 324-fcbga (19x19 mm) Pinbelegungsleitfaden
Pinbelegung für 89H24NT24G2ZCHLGI (324-fcbga (19x19 mm)-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für 89H24NT24G2ZCHLGI.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
89H24NT24G2ZCHLGI ist geeignet für 6 Anwendungs: Hyperscale NVMe Storage Fabric, Multi-Host Disaggregated Storage, GPU Expansion Chassis, Embedded Industrial Backplane, PCIe-over-Cable Fan-Out Systems, Legacy Server Refresh and Maintenance.
Hyperscale NVMe Storage Fabric
The 89H24NT24G2ZCHLGI aggregates up to 24 NVMe SSDs behind a single PCIe Gen2 root complex, providing 16 GB/s of full-duplex fabric bandwidth in dense server and storage platforms. Its 5 GT/s per-lane rate and 4096-byte MPS support typical hyperscale read/write workloads with predictable latency. The non-blocking architecture ensures no port is starved under saturation, while PCI-PM 1.2 compliance enables power gating of unused ports. Designed for cold-storage to warm-tier storage tiers, the device remains relevant for legacy NVMe deployments and refurbishment workflows.
Empfohlen
Multi-Host Disaggregated Storage
In disaggregated storage architectures, the 89H24NT24G2ZCHLGI routes PCIe traffic between multiple hosts and shared storage devices, supporting peer-to-peer transfers without root complex involvement. This dual-host fan-out capability enables dual-controller storage systems where each host can access all 24 downstream NVMe or SAS targets. The cut-through architecture preserves TLP ordering, critical for storage protocols that depend on strict write ordering. Compatible with Gen1 endpoints for legacy device integration, the switch remains a workhorse for hyperconverged and composable infrastructure.
Empfohlen
GPU Expansion Chassis
GPU expansion chassis use the 89H24NT24G2ZCHLGI to extend PCIe reach over cable or backplane to external GPU enclosures, supporting compute-dense workstations and small AI training rigs. Each GPU receives full Gen2 line-rate bandwidth for inter-GPU fabric traffic. Cut-through retention ensures peer-to-peer GPU communication, while the spread-spectrum capability minimizes system compliance. Designed for cold-storage compute tiers, the device delivers predictable latency for graphics workflows.
Empfohlen
Embedded Industrial Backplane
Industrial backplanes leverage the 89H24NT24G2ZCHLGI to provide deterministic PCIe connectivity between embedded compute modules, I/O cards, and storage peripherals in factory automation and test equipment. Its non-blocking switch fabric ensures deterministic data acquisition and control, while peer-to-peer routing enables direct card-to-card transfers. Compatibility with Gen1 endpoints and spread-spectrum support simplify backplane compliance. The 324-FCBGA package is well-suited to ruggedized embedded designs.
Empfohlen
PCIe-over-Cable Fan-Out Systems
PCIe-over-cable systems use the 89H24NT24G2ZCHLGI to bridge host systems with detached I/O or storage cabinets, supporting cable reaches up to several meters. The switch fabric aggregates multiple downstream devices into a single upstream port, enabling compact host machines with extended I/O. With PCI-PM 1.2 compliance, unused ports can be powered down, reducing cable-active power consumption. The 24-port density provides cost-effective fan-out for distributed test, medical imaging, and broadcast video systems.
Empfohlen
Legacy Server Refresh and Maintenance
Datacenters operating legacy servers that depend on PCIe Gen2 connectivity use the 89H24NT24G2ZCHLGI for board-repair and mid-life hardware refresh. The component's mature silicon and broad distributor stock make it suitable for extending operational life of installed server bases. The non-blocking architecture preserves original performance specifications during maintenance cycles, while the FCBGA package is footprint-compatible with existing board layouts. Long-lifecycle embedded platforms benefit from continued authorized stocking support.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 89H24NT24G2ZCHLGI – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 89H24NT24G2ZCHLGI8 | 89H24NT24G2ZAHL | 89H24NT24G2ZAHLG8 | 89H24NT24G2ZBHL8 | PEX8724-CA80BC G | PM8532B-FEI |
|---|---|---|---|---|---|---|---|
| Package | 324-FCBGA (19x19 mm) | 324-FCBGA (19x19 mm) - same | 324-FCBGA (19x19 mm) - same | 324-FCBGA (19x19 mm) - same | 324-FCBGA (19x19 mm) - same | FCBGA (24-port Gen2 class) | FCBGA (24-port Gen2 class) |
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Broadcom | Microchip Technology |
| PCIe Generation | Gen2 (5.0 GT/s) | Gen2 (5.0 GT/s) | Gen2 (5.0 GT/s) | Gen2 (5.0 GT/s) | Gen2 (5.0 GT/s) | Gen2 (5.0 GT/s) | Gen2 (5.0 GT/s) |
| Number of Lanes | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Number of Ports | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Architecture | Cut-through, non-blocking | Cut-through, non-blocking | Cut-through, non-blocking | Cut-through, non-blocking | Cut-through, non-blocking | Cut-through, non-blocking | Cut-through, non-blocking |
| Power Management | PCI-PM 1.2 | PCI-PM 1.2 | PCI-PM 1.2 | PCI-PM 1.2 | PCI-PM 1.2 | PCI-PM 1.2 | PCI-PM 1.2 |
Wichtigste Unterscheidungsmerkmale
- Highest lane and port count in PCIe Gen2 class with full non-blocking throughput (vs. PEX8724-CA80BC G)
- Mature Renesas/IDT ecosystem with broad embedded traction (vs. PM8532B-FEI)
- Family-internal drop-in compatibility across suffix options (vs. 89H24NT24G2ZCHLGI8)
Designhinweise
Maintain 85-ohm differential impedance on all 24 SerDes lanes, with intra-pair length matching tighter than 5 mils and inter-pair matching within 25 mils. Use a 4-layer stack-up minimum (top signal/dedicated ground/dedicated power/bottom signal), and place decoupling capacitors directly beneath the BGA on the opposite side. Provide multiple GND via arrays around the FCBGA perimeter to minimize inductance on high-current return paths.
The 89H24NT24G2ZCHLGI requires multiple voltage rails (typically 1.0V core, 1.8V SerDes, 3.3V I/O); refer to the manufacturer datasheet for exact rail count and tolerance. Place 0.1uF X7R ceramic capacitors every 5 SerDes balls and bulk decoupling within 25 mm of the BGA. Power sequencing requirements may apply between core and SerDes rails to prevent latch-up during hot-plug events.
Gen2 signaling at 5 GT/s requires adaptive equalization and de-emphasis configuration. Use the manufacturer reference clock propagation training for IEC channel reaches up to approximately 12 inches. For longer channels, consider redrivers or retimers between root system and switch. Ensure reference clock jitter is below 3 ps RMS to avoid eye-marginalization at the receivers.
Do not assume cross-brand drop-in compatibility at the BGA level: even within the same FCBGA pin-count class, ball maps differ between manufacturers (Broadcom PEX, Microchip Switchtec). Always verify the exact ball map against the PCB layout before substituting. Also verify JTAG, SMBus, and strap pin assignments, which often differ between PCIe switch vendors even when port counts match.
Compliance-Informationen
Compliance status not explicitly stated in the verified web data for 89H24NT24G2ZCHLGI. Refer to manufacturer datasheet for definitive RoHS, REACH, and lead-free status. AEC-Q100 is not applicable as this is a commercial/industrial-grade server interconnect switch, not an automotive-qualified IC.
