A3P600-1PQG208 - ProASIC3 FPGA 600K 208-QFP | Microchip
Teilenummer: A3P600-1PQG208 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $62.43 | $62,43 |
| 10 | $59.31 | $593,10 |
| 100 | $55.57 | $5.557,00 |
| 500 | $52.06 | $26.030,00 |
| 1.000 | $49.94 | $49.940,00 |
A3P600-1PQG208 Übersicht
A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration device or volatile SRAM. This places the ProASIC3 within the broader hierarchy of programmable logic: FPGA -> flash-based FPGA -> programmable logic device -> semiconductor. Because configuration is nonvolatile, ProASIC3 devices are Instant On and single-chip, needing no boot PROM and offering inherent design security against configuration readback.
Key features of the A3P600 include 600K system gates in 130nm flash technology, low total cost of ownership (TOC), and reprogrammability for design iterations. The 154 user I/Os support banked I/O voltages, and the flash cell architecture eliminates the external configuration memory required by SRAM FPGAs, reducing BOM cost and board area.
Architecturally, ProASIC3 is the third generation of Microchip's (formerly Actel/Microsemi) flash FPGA family, superseding ProASICPLUS. Four I/O banks are provided on the A3P600, each with dedicated VCCIBx supplies so only compatible I/O standards share a bank. The 130nm process balances density, cost, and power for mid-range designs.
Typical applications include industrial control, communications interface bridging, secure single-chip logic, aerospace-adjacent control logic, and glueless ASIC prototyping where a secure, single-chip, instantly-configured FPGA is preferred over SRAM alternatives.
For design, respect the I/O bank voltage rules documented in the ProASIC3 migration application notes, and verify speed-grade timing (-1 commercial, 0C to +70C) against your system clock requirements.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für A3P600-1PQG208 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3P600-1PQG208 (gleiche Bauform und Footprint) – abweichend in Package, System Gates, Configuration Memory, Operating Temperature, Speed Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3P600L-1PQG208I
✅ Drop-In✓ Auf Lager
$29 / Stück
Datenblatt ansehen →A3P600-2PQG208I
✅ Drop-In✓ Auf Lager
$71.3 / Stück
Datenblatt ansehen →A3P1000-2PQG208
✅ Drop-In✓ Auf Lager
$65.67 / Stück
Datenblatt ansehen →A3P1000L-1PQG208I
✅ Drop-In✓ Auf Lager
$28.9 / Stück
Datenblatt ansehen →A3P600-1PQG208I
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$68 / Stück
Datenblatt ansehen →A3P600-1PQG208 Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3 |
| System Gates | 600K |
| Logic Elements | 7KLEs |
| User I/Os | 154 |
| Configuration Memory | 110592 bits (flash, nonvolatile) |
| Maximum System Frequency | 272 MHz |
| Process Technology | 130 nm flash |
| Core Supply Voltage | 1.5 V |
| Speed Grade | -1 (commercial) |
| Betriebstemperatur | 0C to +70C |
| Gehäuse | 208-BFQFP (PQG208) |
| Montagestil | SMD/SMT |
| Terminal Form | Gull wing |
| Packaging | Tray |
| Configuration Type | SRAM-logic / Flash (Instant On, single chip) |
| I/O Banks | 4 |
A3P600-1PQG208 208-bfqfp (pqg208) Pinbelegungsleitfaden
Pinbelegung für A3P600-1PQG208 (208-bfqfp (pqg208)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3P600-1PQG208.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3P600-1PQG208 ist geeignet für 6 Anwendungs: Industrial Control and Automation, Secure Single-Chip Logic, Communications Interface Bridging, ASIC Prototyping and Emulation, Aerospace-Adjacent Control Logic, Medical Instrumentation Control.
Industrial Control and Automation
In controlled-environment industrial controllers, the A3P600-1PQG208 serves as single-chip glueless logic interfacing PLC modules, sensor banks, and backplanes. Its 600K gates and 154 user I/Os across four voltage banks let one device absorb dozens of discrete glue-logic ICs, cutting BOM count and board area. The flash fabric is Instant On - logic is active within microseconds of power application, important for systems that must assert safe I/O states immediately at power-up without waiting for configuration. The 0C to +70C rating suits enclosure-mounted controllers in conditioned cabinets; for harsher floors, use the drop-in A3P600L-1PQG208I. Nonvolatile configuration also removes the external config PROM, a common failure point in vibrating industrial panels.
Empfohlen
Secure Single-Chip Logic
Flash-based FPGAs like the A3P600-1PQG208 are preferred wherever the design bitstream must be protected. Because configuration resides in on-chip flash rather than an external SRAM configuration device, the bitstream never appears on a visible bus during power-up, blocking casual cloning and readback attacks common against SRAM FPGAs. The 600K-gate fabric accommodates encryption engines, authentication state machines, and secure boot bridges for embedded processors. The single-chip Instant On property means security logic is enforcing policy before the host CPU completes reset - a critical window in anti-tamper architectures. Design teams implement these features in Microchip Libero SoC and lock programming with flash lock mechanisms supported by the ProASIC3 family datasheet.
Empfohlen
Communications Interface Bridging
The A3P600-1PQG208 bridges protocol interfaces - UART, SPI, I2C, parallel buses, and simple line-coded links - between processors, ASICs, and backplanes. With 154 user I/Os banked into four independently supplied VCCIBx domains, mixed-voltage interfaces (for example 3.3V host and 2.5V or 1.8V peripheral) terminate on one package without level shifters, provided only voltage-compatible standards share each bank per the ProASIC3 I/O rules. The 272 MHz maximum system performance supports multi-channel UART aggregation and parallel-to-serial adaptation comfortably. Nonvolatile configuration gives deterministic link bring-up at power-on, simplifying hot-swappable line cards where configuration latency would otherwise stall the host bus.
Empfohlen
ASIC Prototyping and Emulation
Design teams use the A3P600-1PQG208 to prototype mid-size ASIC blocks before tape-out. The 600K-gate fabric fits moderate RTL blocks, and full reprogrammability supports iterative RTL debug without new silicon. The flash architecture's deterministic Instant On behavior makes power-up sequencing experiments reproducible - unlike SRAM FPGAs whose boot-time behavior varies with configuration device placement. Because the PQG208 footprint is shared across the ProASIC3 density ladder (A3P600 to A3P1000), a prototype PCB can accept either density, letting teams flow the same board from feasibility into a larger emulation target. Libero SoC timing reports at the -1 speed grade provide realistic early estimates of achievable ASIC clock domains.
Empfohlen
Aerospace-Adjacent Control Logic
While this commercial-grade (0C to +70C) part is not qualified for flight, its flash-FPGA architecture - single-chip, nonvolatile, and immune to configuration-readout - is widely used in ground support equipment, test rigs, and radiation-tolerant program heritage designs descended from Actel/Microsemi flash FPGA lines. The 600K gates implement telemetry framing, sequencer logic, and instrument interface bridges for satellite AIT (assembly, integration, test) stations. Instant On configuration is valuable in test equipment that must assert deterministic states at power application. For designs migrating toward flight hardware, the same ProASIC3 RTL and Libero SoC toolchain carry over to Microchip's radiation-tolerant RT ProASIC3 family, protecting verification investment.
Empfohlen
Medical Instrumentation Control
Benchtop medical instruments - analyzers, detectors, and imaging support hardware - use the A3P600-1PQG208 for deterministic sequencing, sensor front-end timing, and host interface logic. The single-chip flash configuration ensures the instrument powers up into a known, verified logic state every cycle, which simplifies IEC 60601-style power-on self-test documentation: there is no external configuration device whose failure mode must be analyzed separately. The 154 I/Os in four voltage banks interface directly with mixed-voltage sensor arrays and 3.3V/5V-tolerant peripheral buses. Benchtop environments stay within the 0C to +70C commercial rating. Design security protects proprietary timing and calibration algorithms stored in the fabric from competitive cloning.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3P600-1PQG208 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3P600L-1PQG208I | A3P600-2PQG208I | A3P1000-2PQG208 | A3P1000L-1PQG208I |
|---|---|---|---|---|---|
| Package | 208-BFQFP (PQG208) | 208-BFQFP (PQG208) - same | 208-BFQFP (PQG208) - same | 208-BFQFP (PQG208) - same | 208-BFQFP (PQG208) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 1M | 1M |
| Speed Grade | -1 | -1 | -2 (faster) | -2 (faster) | -1 |
| Core Option | Standard | Low-power (L) | Standard | Standard | Low-power (L) |
Wichtigste Unterscheidungsmerkmale
- Lowest-cost commercial speed grade (vs. A3P600-2PQG208I)
- Standard core power option (vs. A3P600L-1PQG208I)
- Commercial temperature optimization (vs. A3P600L-1PQG208I)
- Density matched to design (vs. A3P1000-2PQG208)
Designhinweise
The A3P600 requires a 1.5V core supply (VCC) plus four independent I/O bank supplies (VCCIB0-VCCIB3). Estimated: flash-FPGA core current is dominated by activity - budget 50-150 mA for the core at moderate toggle rates and size the 1.5V rail accordingly, decoupling with at least 10 uF bulk plus 0.1 uF ceramics per supply pin group. Because PQG208 VCCIBx pins route to their respective banks per Microchip migration notes, never tie different bank supplies together if the banks carry incompatible I/O standards.
The 208-pin BFQFP has 0.5 mm-pitch gull-wing leads - specify a footprint per the Microchip ProASIC3 datasheet package drawing and use solder-mask-defined or NSMD pads per your assembler's capability. Place 0.1 uF decoupling capacitors within 2-3 mm of each VCC/VCCIB pin pair. Exposed thermal behavior of a 208-QFP is modest; forced-air or natural convection at 0.5-1 W dissipation (Estimated) is generally adequate but verify against your activity profile.
Three recurring mistakes: (1) assuming pin compatibility from legacy Actel documents - Microchip PCN 0708 changed PQ208/PQG208 A3P600 pinouts for family pin compatibility, so only the current DS50003269 datasheet pinout is valid; (2) exceeding the 0C to +70C commercial range in sealed enclosures - migrate to an -I variant instead; (3) treating -1 as equivalent to -2 timing - at 272 MHz class designs, re-run timing closure in Libero SoC when swapping speed grades even on the same footprint.
Group I/O assignments by voltage bank and by switching activity. Fast-switching outputs sharing a VCCIB return path with sensitive inputs cause ground-bounce on the 0.5 mm-pitch QFP where adjacent supply pins are scarce. Keep edge rates at the minimum needed (use Libero slew controls), reserve bank corners for quiet inputs, and route bank VCCIB traces as short, wide pours. Series 22-33 ohm resistors on long off-board lines damp reflections and cut EMI.
Compliance-Informationen
Compliance data was not present in the verified web data for this MPN; Microchip product page should be consulted for RoHS/REACH declarations. Commercial-grade part (0C to +70C), so AEC-Q100 is not applicable.