A54SX32A-2FGG256 - 48K-Gate FPGA 256-FBGA | Microchip
Teilenummer: A54SX32A-2FGG256 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $68.5 | $68,50 |
| 10 | $63.2 | $632,00 |
| 100 | $57.8 | $5.780,00 |
| 500 | $52.4 | $26.200,00 |
| 1.000 | $47.95 | $47.950,00 |
A54SX32A-2FGG256 Übersicht
An antifuse FPGA is a type of field-programmable gate array whose interconnects are permanently programmed at power-up of the configuration step rather than stored in SRAM. Unlike SRAM-based FPGAs, antifuse devices are non-volatile, require no external configuration ROM, and are inherently resistant to configuration upset, making them a member of the broader programmable logic and power/cost-sensitive ASIC- replacement hierarchy. The SX-A family targets designers who need one-time-programmable logic integration at ASIC-like unit cost.
Key features of the A54SX32A-2FGG256 include 48K system gates (approximately 1,800 logic cells on a 0.25 um antifuse process per FindIC data), 203 available user I/Os in the 256-FBGA package, a -2 speed grade for mid-to-high-speed glueless integration, and RoHS3-compliant surface-mount assembly. Distributed routing and dedicated clock resources support synchronous designs without external glue logic.
Technically, the SX-A architecture uses a sea-of-modules fabric with combinational and sequential modules connected by a program-once antifuse interconnect matrix. Because configuration is hard-wired, there is no configuration readback path, which supports designs where bitstream security matters. The 0.25 um process yields predictable timing, and the -2 grade represents the standard commercial speed bin for this family.
Typical applications include industrial control and automation glue logic, telecommunications line-card interface bridging, defense and avionics legacy-design sustainment, and ASIC prototype or low-volume production integration where a single-chip solution replaces multiple discrete logic devices.
Design consideration: as a one-time-programmable device, functional changes require new silicon, so lock down the design and verify timing with Microchip Libero/Designer software before committing to programming; the commercial 0C to +70C rating also excludes most automotive and extended-temperature industrial deployments.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving buyers and engineers a single verified reference point.
Drop-in-Alternativen für A54SX32A-2FGG256 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A54SX32A-2FGG256 (gleiche Bauform und Footprint) – abweichend in Package, System Gates, Operating Temperature, RoHS Status, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A54SX32A-2FGG256I
✅ Drop-In✓ Auf Lager
$368.59 / Stück
Datenblatt ansehen →A54SX32A-1FGG256M
✅ Drop-In✓ Auf Lager
$62.5 / Stück
Datenblatt ansehen →A54SX32A-1FGG256
✅ Drop-In✓ Auf Lager
$1 / Stück
Datenblatt ansehen →A54SX32A-1FGG256I
✅ Drop-In✓ Auf Lager
$316.27 / Stück
Datenblatt ansehen →A54SX32A-FGG256A
✅ Drop-In✓ Auf Lager
$295.2 / Stück
Datenblatt ansehen →A54SX32A-2FGG256 Grenzwerte & elektrische Eigenschaften
| Family | SX-A (antifuse FPGA) |
| System Gates | 48000 |
| Logic Cells | 1800 |
| User I/O | 203 |
| Speed Grade | -2 |
| Maximum Toggle Rate | 238 MHz |
| Process Technology | 0.25 um |
| Versorgungsspannung | 2.25 V to 5.25 V |
| Betriebstemperatur | 0C to +70C (TA) |
| Gehäuse | 256-FBGA (17x17 mm) |
| Montageart | Surface Mount |
| Programmability | One-Time Programmable (antifuse) |
| Packaging | Tray |
| RoHS-Status | ROHS3 Compliant |
| Manufacturer Lead Time | 10 weeks |
| Product Status | Active |
A54SX32A-2FGG256 256-fbga (17x17 mm) Pinbelegungsleitfaden
Pinbelegung für A54SX32A-2FGG256 (256-fbga (17x17 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A54SX32A-2FGG256.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A54SX32A-2FGG256 ist geeignet für 6 Anwendungs: Industrial Control and Automation Glue Logic, Telecommunications Line-Card Interface Bridging, Defense and Avionics Legacy Design Sustainment, ASIC Prototyping and Low-Volume Integration, Test and Measurement Instrument Logic, Secure Single-Chip System Integration.
Industrial Control and Automation Glue Logic
The A54SX32A-2FGG256 consolidates address decoding, bus interfacing, state machines, and I/O expansion that would otherwise occupy multiple 74-series devices, using its 48,000 system gates and 203 user I/Os in a single 17x17 mm 256-FBGA. Its instant-on antifuse configuration means factory equipment starts with deterministic logic state at power application, with no configuration delay - a meaningful advantage for safety interlocks and machine sequencing. The 2.25V to 5.25V supply span eases interfacing with legacy 5V and 3.3V industrial I/O standards. Because the design is one-time-programmable, engineers should complete static timing closure at the -2 grade in Microchip Designer before releasing production fusemaps, then standardize on a single qualified programming source to guarantee device-to-device consistency across the installed base.
Empfohlen
Telecommunications Line-Card Interface Bridging
In telecom line cards, the A54SX32A-2FGG256 bridges backplane interfaces, handles framing logic, and manages board-level control signals. The -2 speed grade supports toggle rates up to approximately 238 MHz, sufficient for T1/E1-class framing and backplane glue functions, while the 256-FBGA's 203 user I/Os accommodate wide parallel data paths to PHY and framer devices. Its antifuse fabric introduces no configuration-readback path, supporting carrier equipment security requirements, and the non-volatile fabric means cards resume operation immediately on hot-swap or reboot. Designers should budget board area for the 17x17 mm BGA land pattern with standard via-in-pad or dog-bone escape routing, and verify I/O bank voltage compatibility (2.25V to 5.25V per distributor data) against neighboring transceiver devices to avoid level-shifting circuits.
Empfohlen
Defense and Avionics Legacy Design Sustainment
The SX-A antifuse family is a staple of defense and avionics obsolescence-management programs, and the A54SX32A-2FGG256 sustains platforms originally designed around Actel/Microsemi SX-A silicon. Antifuse one-time programming resists configuration upsets and offers no readback path, matching platform security reviews, while Microchip's continued active status (verified 2026-09-03, 10-week lead time) supports long-duration program lifecycles. The 48K-gate capacity accommodates MIL-STD-1553-style protocol wrappers, bus arbitration, and sensor-interface glue functions typical of these retrofits. Procurement teams should qualify extended-temperature or screened ordering variants where ambient conditions exceed the commercial 0C to +70C rating, and should dual-source ordering suffixes within the same 256-FBGA footprint to hedge allocation risk across the 10-week factory lead time.
Empfohlen
ASIC Prototyping and Low-Volume Integration
Before committing an ASIC tape-out, teams use FPGAs to validate RTL, and the A54SX32A-2FGG256's 48K gates cover small ASIC blocks such as controllers, converters, and protocol engines. Although SRAM FPGAs dominate iterative prototyping, the SX-A is attractive at the transition to low-volume production: the same validated design can be frozen into one-time-programmable antifuse silicon at unit costs well below SRAM FPGA pricing, integrating multiple functions into a single low-cost chip as Microchip's product page describes. The -2 grade's roughly 238 MHz toggle capability covers moderate clock domains. The critical workflow consideration is that silicon cannot be reprogrammed - lock the RTL, complete timing sign-off in Microchip Designer, and validate on an SRAM platform first so every programmed A54SX32A-2FGG256 device ships with fully verified logic.
Empfohlen
Test and Measurement Instrument Logic
Bench and automated test instruments use the A54SX32A-2FGG256 for trigger logic, counter/timer functions, scan chains, and bus interfacing to GPIB, USB-bridge, or PXI backplane controllers. Instant-on antifuse configuration eliminates the several-hundred-millisecond configuration latency of SRAM FPGAs, which matters for instruments expected to be measurement-ready at power-on, and the absence of a configuration device improves long-term reliability in rack equipment. The 203 user I/Os in the 256-FBGA support dense parallel connections to ADC front ends and relay matrices. Since commercial temperature rating is 0C to +70C, laboratory instruments are an ideal fit, while portable field instruments exposed to outdoor temperatures should specify the industrial I-suffix variant in the identical footprint for qualification simplicity.
Empfohlen
Secure Single-Chip System Integration
Where a system must integrate control, sequencing, and interface logic into one programmable device with strong configuration confidentiality, the A54SX32A-2FGG256 offers a compelling profile: its programmed antifuses cannot be read back, so reverse engineering the fusemap requires destructive delayering and microscopy. Microchip positions SX-A for combining performance, security, and low power in single-chip solutions, replacing multi-chip glue-logic clusters and their supply-chain exposure. With 48K gates and 203 I/Os, typical secure-integration loads include secure-boot supervisory logic, tamper-response sequencing, and encrypted-bus bridging. The trade-off versus SRAM devices is permanence: any post-deployment functional change requires new programmed silicon, so secure designs should reserve spare I/O and include field-diagnostic state machines in the first-pass fusemap.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A54SX32A-2FGG256 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A54SX32A-2FGG256I | A54SX32A-1FGG256M | A54SX32A-1FGG256 | A54SX32A-FGG256A |
|---|---|---|---|---|---|
| Package | 256-FBGA (17x17 mm) | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 48000 | 48000 | 48000 | 48000 | 48000 |
| User I/O | 203 | 203 | 203 | 203 | 203 |
| Programmability | One-Time Programmable (antifuse) | One-Time Programmable (antifuse) | One-Time Programmable (antifuse) | One-Time Programmable (antifuse) | One-Time Programmable (antifuse) |
| Lifecycle Status | Active | Active | Active (listed on DigiKey) | Active | Active |
Wichtigste Unterscheidungsmerkmale
- Fastest commercial speed grade in the 256-FBGA SX-A family (vs. A54SX32A-1FGG256M)
- Extended-temperature drop-in available without board change (vs. A54SX32A-2FGG256I)
- Non-volatile antifuse fabric eliminates configuration memory (vs. SRAM-based competitor FPGAs (e.g., Lattice/Intel equivalents))
Designhinweise
The SX-A family spans a 2.25V to 5.25V supply range per distributor listings, but the 256-FBGA organizes I/O into banks whose voltage must match the interfaced logic family. Confirm per-bank VCCI requirements in the SX-A family datasheet (sxa_ds.pdf) before routing, and decouple each supply ball with at least 0.1 uF ceramic capacitance placed within 2 mm of the ball. Antifuse FPGAs draw no configuration current at power-up, so supply sequencing constraints are milder than SRAM FPGAs, but core current scales with toggle rate - simulate worst-case activity factors in Microchip Designer's power estimator.
The 256-FBGA (17x17 mm) uses a fine ball pitch requiring either dog-bone escape or via-in-pad routing on at least a 4-layer board with dedicated ground plane for signal return. The package is supplied in trays with a 10-week manufacturer lead time, so plan assembly schedules around factory lead time, not distributor stock alone. Follow the land pattern in the datasheet package mechanicals section exactly; BGA rework of antifuse parts is costly because each device is one-time-programmable and a damaged unit cannot be reprogrammed - it must be scrapped.
The most common SX-A mistake is treating the part like an SRAM FPGA: there is no field update path, so any functional change means physically swapping programmed silicon. Lock RTL and complete static timing analysis against the -2 speed grade library in Microchip Designer before submitting devices for programming, and archive the fusemap file with revision control. Also verify temperature grade: the standard -2 commercial part is rated 0C to +70C; deployments outside that window must switch to the I-suffix industrial variant, which is a drop-in on the same board.
Compliance-Informationen
ROHS3 Compliant per Microchip USA product listing (verified 2026-09-03). REACH, halogen-free, lead-free and conflict-minerals declarations not stated in provided data and must be confirmed with Microchip compliance documentation.
