A54SX32A-2FGG256 - 48K-Gate FPGA 256-FBGA | Microchip
MPN: A54SX32A-2FGG256 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $63.2 | $632.00 |
| 100 | $57.8 | $5,780.00 |
| 500 | $52.4 | $26,200.00 |
| 1,000 | $47.95 | $47,950.00 |
Drop-in alternatives for A54SX32A-2FGG256 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A54SX32A-2FGG256I
✅ Drop-In✓ In Stock
$368.59 / Unit
View Datasheet →A54SX32A-1FGG256M
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View Datasheet →A54SX32A-1FGG256
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$1 / Unit
View Datasheet →A54SX32A-1FGG256I
✅ Drop-In✓ In Stock
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View Datasheet →A54SX32A-FGG256A
✅ Drop-In✓ In Stock
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View Datasheet →A54SX32A-2FGG256 Maximum Ratings & Electrical Characteristics
| Family | SX-A (antifuse FPGA) |
| System Gates | 48000 |
| Logic Cells | 1800 |
| User I/O | 203 |
| Speed Grade | -2 |
| Maximum Toggle Rate | 238 MHz |
| Process Technology | 0.25 um |
| Supply Voltage | 2.25 V to 5.25 V |
| Operating Temperature | 0C to +70C (TA) |
| Package | 256-FBGA (17x17 mm) |
| Mounting Type | Surface Mount |
| Programmability | One-Time Programmable (antifuse) |
| Packaging | Tray |
| RoHS Status | ROHS3 Compliant |
| Manufacturer Lead Time | 10 weeks |
| Product Status | Active |
A54SX32A-2FGG256 256-fbga (17x17 mm) Pin Configuration Guide
Complete pinout information for A54SX32A-2FGG256 (256-fbga (17x17 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A54SX32A-2FGG256.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A54SX32A-2FGG256 is suitable for 6 applications: Industrial Control and Automation Glue Logic, Telecommunications Line-Card Interface Bridging, Defense and Avionics Legacy Design Sustainment, ASIC Prototyping and Low-Volume Integration, Test and Measurement Instrument Logic, Secure Single-Chip System Integration.
Industrial Control and Automation Glue Logic
The A54SX32A-2FGG256 consolidates address decoding, bus interfacing, state machines, and I/O expansion that would otherwise occupy multiple 74-series devices, using its 48,000 system gates and 203 user I/Os in a single 17x17 mm 256-FBGA. Its instant-on antifuse configuration means factory equipment starts with deterministic logic state at power application, with no configuration delay - a meaningful advantage for safety interlocks and machine sequencing. The 2.25V to 5.25V supply span eases interfacing with legacy 5V and 3.3V industrial I/O standards. Because the design is one-time-programmable, engineers should complete static timing closure at the -2 grade in Microchip Designer before releasing production fusemaps, then standardize on a single qualified programming source to guarantee device-to-device consistency across the installed base.
Recommended
Telecommunications Line-Card Interface Bridging
In telecom line cards, the A54SX32A-2FGG256 bridges backplane interfaces, handles framing logic, and manages board-level control signals. The -2 speed grade supports toggle rates up to approximately 238 MHz, sufficient for T1/E1-class framing and backplane glue functions, while the 256-FBGA's 203 user I/Os accommodate wide parallel data paths to PHY and framer devices. Its antifuse fabric introduces no configuration-readback path, supporting carrier equipment security requirements, and the non-volatile fabric means cards resume operation immediately on hot-swap or reboot. Designers should budget board area for the 17x17 mm BGA land pattern with standard via-in-pad or dog-bone escape routing, and verify I/O bank voltage compatibility (2.25V to 5.25V per distributor data) against neighboring transceiver devices to avoid level-shifting circuits.
Recommended
Defense and Avionics Legacy Design Sustainment
The SX-A antifuse family is a staple of defense and avionics obsolescence-management programs, and the A54SX32A-2FGG256 sustains platforms originally designed around Actel/Microsemi SX-A silicon. Antifuse one-time programming resists configuration upsets and offers no readback path, matching platform security reviews, while Microchip's continued active status (verified 2026-09-03, 10-week lead time) supports long-duration program lifecycles. The 48K-gate capacity accommodates MIL-STD-1553-style protocol wrappers, bus arbitration, and sensor-interface glue functions typical of these retrofits. Procurement teams should qualify extended-temperature or screened ordering variants where ambient conditions exceed the commercial 0C to +70C rating, and should dual-source ordering suffixes within the same 256-FBGA footprint to hedge allocation risk across the 10-week factory lead time.
Recommended
ASIC Prototyping and Low-Volume Integration
Before committing an ASIC tape-out, teams use FPGAs to validate RTL, and the A54SX32A-2FGG256's 48K gates cover small ASIC blocks such as controllers, converters, and protocol engines. Although SRAM FPGAs dominate iterative prototyping, the SX-A is attractive at the transition to low-volume production: the same validated design can be frozen into one-time-programmable antifuse silicon at unit costs well below SRAM FPGA pricing, integrating multiple functions into a single low-cost chip as Microchip's product page describes. The -2 grade's roughly 238 MHz toggle capability covers moderate clock domains. The critical workflow consideration is that silicon cannot be reprogrammed - lock the RTL, complete timing sign-off in Microchip Designer, and validate on an SRAM platform first so every programmed A54SX32A-2FGG256 device ships with fully verified logic.
Recommended
Test and Measurement Instrument Logic
Bench and automated test instruments use the A54SX32A-2FGG256 for trigger logic, counter/timer functions, scan chains, and bus interfacing to GPIB, USB-bridge, or PXI backplane controllers. Instant-on antifuse configuration eliminates the several-hundred-millisecond configuration latency of SRAM FPGAs, which matters for instruments expected to be measurement-ready at power-on, and the absence of a configuration device improves long-term reliability in rack equipment. The 203 user I/Os in the 256-FBGA support dense parallel connections to ADC front ends and relay matrices. Since commercial temperature rating is 0C to +70C, laboratory instruments are an ideal fit, while portable field instruments exposed to outdoor temperatures should specify the industrial I-suffix variant in the identical footprint for qualification simplicity.
Recommended
Secure Single-Chip System Integration
Where a system must integrate control, sequencing, and interface logic into one programmable device with strong configuration confidentiality, the A54SX32A-2FGG256 offers a compelling profile: its programmed antifuses cannot be read back, so reverse engineering the fusemap requires destructive delayering and microscopy. Microchip positions SX-A for combining performance, security, and low power in single-chip solutions, replacing multi-chip glue-logic clusters and their supply-chain exposure. With 48K gates and 203 I/Os, typical secure-integration loads include secure-boot supervisory logic, tamper-response sequencing, and encrypted-bus bridging. The trade-off versus SRAM devices is permanence: any post-deployment functional change requires new programmed silicon, so secure designs should reserve spare I/O and include field-diagnostic state machines in the first-pass fusemap.
Recommended
Recommended Products Summary
Engineering reference data for A54SX32A-2FGG256 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A54SX32A-2FGG256I | A54SX32A-1FGG256M | A54SX32A-1FGG256 | A54SX32A-FGG256A |
|---|---|---|---|---|---|
| Package | 256-FBGA (17x17 mm) | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 48000 | 48000 | 48000 | 48000 | 48000 |
| Speed Grade | -2 | -2 | -1 | -1 | [DATA_NEEDED] |
| User I/O | 203 | 203 | 203 | 203 | 203 |
| Operating Temperature | 0C to +70C | Industrial range (I suffix) | [DATA_NEEDED] | 0C to +70C | [DATA_NEEDED] |
| Programmability | One-Time Programmable (antifuse) | One-Time Programmable (antifuse) | One-Time Programmable (antifuse) | One-Time Programmable (antifuse) | One-Time Programmable (antifuse) |
| RoHS Status | ROHS3 Compliant | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Lifecycle Status | Active | Active | Active (listed on DigiKey) | Active | Active |
Key Differentiators
- Fastest commercial speed grade in the 256-FBGA SX-A family (vs A54SX32A-1FGG256M)
- Extended-temperature drop-in available without board change (vs A54SX32A-2FGG256I)
- Non-volatile antifuse fabric eliminates configuration memory (vs SRAM-based competitor FPGAs (e.g., Lattice/Intel equivalents))
Design Notes
The SX-A family spans a 2.25V to 5.25V supply range per distributor listings, but the 256-FBGA organizes I/O into banks whose voltage must match the interfaced logic family. Confirm per-bank VCCI requirements in the SX-A family datasheet (sxa_ds.pdf) before routing, and decouple each supply ball with at least 0.1 uF ceramic capacitance placed within 2 mm of the ball. Antifuse FPGAs draw no configuration current at power-up, so supply sequencing constraints are milder than SRAM FPGAs, but core current scales with toggle rate - simulate worst-case activity factors in Microchip Designer's power estimator.
The 256-FBGA (17x17 mm) uses a fine ball pitch requiring either dog-bone escape or via-in-pad routing on at least a 4-layer board with dedicated ground plane for signal return. The package is supplied in trays with a 10-week manufacturer lead time, so plan assembly schedules around factory lead time, not distributor stock alone. Follow the land pattern in the datasheet package mechanicals section exactly; BGA rework of antifuse parts is costly because each device is one-time-programmable and a damaged unit cannot be reprogrammed - it must be scrapped.
The most common SX-A mistake is treating the part like an SRAM FPGA: there is no field update path, so any functional change means physically swapping programmed silicon. Lock RTL and complete static timing analysis against the -2 speed grade library in Microchip Designer before submitting devices for programming, and archive the fusemap file with revision control. Also verify temperature grade: the standard -2 commercial part is rated 0C to +70C; deployments outside that window must switch to the I-suffix industrial variant, which is a drop-in on the same board.
Compliance Information
ROHS3 Compliant per Microchip USA product listing (verified 2026-09-03). REACH, halogen-free, lead-free and conflict-minerals declarations not stated in provided data and must be confirmed with Microchip compliance documentation.
