ADTF3175D-NXZ - 1MP ToF Eval Kit w/ ADSD3500 ISP | Analog Devices
Teilenummer: ADTF3175D-NXZ ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $549 | $549,00 |
| 5 | $539 | $2.695,00 |
| 10 | $525 | $5.250,00 |
| 25 | $510 | $12.750,00 |
| 50 | $495 | $24.750,00 |
ADTF3175D-NXZ Übersicht
A Time-of-Flight (ToF) camera is a depth-sensing system that measures the round-trip time of modulated infrared light reflected from a scene, producing per-pixel distance maps independent of ambient illumination in many conditions. ToF modules sit within a hierarchy of depth sensors alongside passive stereo, active stereo (IR pattern projection), and structured-light cameras; the iToF technique used by the ADTF3175 modulates continuous-wave IR illumination and extracts phase information at each pixel, distinguishing it from direct ToF approaches that time single photons.
Key features of the ADTF3175D-NXZ include 1 MP (1024 x 1024) depth resolution from the ADSD3100 imager, integrated 940 nm-class IR illumination, an on-board ADSD3500 depth ISP that performs depth computation on the kit, and USB-to-Ethernet bridging for streaming depth frames to the host. The kit supports sensor validation using the host-side ADI 3DToF ROS package for image stitching across multiple units, enabling wide-baseline depth capture for robotics and perception research.
The ADTF3175D-NXZ is engineered for 3D depth sensing and vision systems targeting robotics, SLAM, gesture recognition, and industrial machine vision. Compared with bare iToF imagers, the integrated optical stack reduces calibration overhead, while the bundled ADSD3500 ISP offloads depth math from the host, which is helpful in embedded Linux or ROS 2 deployments. Designers evaluating competing modules (e.g., Espressif ESP32-C6x, etc.) should note the ADI solution ships as a turnkey EVK rather than a discrete imager; trade-offs include BOM cost versus integration time.
Typical applications include warehouse robotics, autonomous mobile robots (AMR), volumetric measurement, and AR/VR candidate systems. When planning system layouts, ensure adequate thermal headroom around the IR illumination source during continuous depth streaming and observe eye-safety classifications for the integrated laser. This page synthesizes distributor pricing, application context, and cross-reference data not found in the standalone ADTF3175 datasheet.
Drop-in-Alternativen für ADTF3175D-NXZ – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit ADTF3175D-NXZ (gleiche Bauform und Footprint) – abweichend in Imager, Mounting Type, Product Type, Resolution.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EVAL-ADTF3175
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ADTF3175
✅ Drop-In✓ Auf Lager
$230 / Stück
Datenblatt ansehen →ADTF3175D-NXZ Grenzwerte & elektrische Eigenschaften
| Product Type | Time-of-Flight (ToF) Evaluation Kit |
| Main Module | ADTF3175 |
| Depth ISP | ADSD3500 |
| Imager | ADSD3100 (CMOS indirect ToF) |
| Auflösung | 1 megapixel (1024 x 1024) |
| ToF Technique | Indirect ToF (iToF), continuous-wave modulation |
| Integrated Optics | Lens, optical band-pass filter, IR illumination optics |
| Illumination Source | Laser diode with integrated driver and photodetector |
| Host Interface | Ethernet over USB |
| Host Software | Windows host GUI + open-source multi-platform SDK |
| Operating System Support | Windows host; ROS / ROS 2 via adi_3dtof_image_stitching package |
| Funktion | 3D depth sensing and vision system evaluation |
| Montageart | Bench / lab evaluation board |
| Form Factor | Complete EVK (PCB + module + cabling) |
ADTF3175D-NXZ standard Pinbelegungsleitfaden
Pinbelegung für ADTF3175D-NXZ (standard-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für ADTF3175D-NXZ.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
ADTF3175D-NXZ ist geeignet für 6 Anwendungs: Warehouse Robotics & AMR, 3D Depth Sensing & Vision Systems, Gesture Recognition & HMI, Industrial Machine Vision & Volumetric Measurement, SLAM & Robotics Research, Mobile Sensing & Portable Devices.
Warehouse Robotics & AMR
The ADTF3175D-NXZ delivers 1 MP (1024 x 1024) indirect ToF depth maps ideal for warehouse mobile robots and autonomous mobile robots (AMR) navigating dynamic environments. The integrated 940 nm IR illumination and optical band-pass filter reduce ambient-light interference, while the on-board ADSD3500 depth ISP offloads phase-to-distance math from the host CPU, leaving more compute for path planning. Ethernet-over-USB streams depth frames at host-friendly rates; per the Analog Devices EVAL-ADTF3175 product page, ROS support via the adi_3dtof_image_stitching package enables multi-sensor fusion for wide-baseline obstacle avoidance in cluttered aisles.
Empfohlen
3D Depth Sensing & Vision Systems
The ADTF3175D-NXZ is purpose-built for high-resolution 3D depth sensing and vision system evaluation, integrating a 1 MP CMOS iToF imager with lens, band-pass filter, laser diode, and photodetector. According to the ADTF3175 datasheet summary, the module produces dense phase-based depth maps suitable for SLAM, scene reconstruction, and volumetric capture. The bundled ADSD3500 ISP delivers on-board depth computation, which is critical for embedded host platforms with constrained CPUs. Designers can validate full pipeline behavior end-to-end before committing to a discrete imager + custom ISP design.
Empfohlen
Gesture Recognition & HMI
The ADTF3175D-NXZ's 1 MP depth resolution enables fine-grained gesture recognition for natural human-machine interfaces in smart-home and AR/VR candidate systems. Continuous-wave indirect ToF modulates IR illumination and extracts per-pixel phase information, allowing the kit to detect hand poses, finger positions, and body gestures regardless of visible-light conditions. According to the EVAL-ADTF3175 product page, the open-source multi-platform SDK accelerates custom gesture-pipeline development on Windows, Linux, and embedded hosts. Latency is bounded by the ADSD3500 ISP pipeline rather than host CPU, supporting real-time HMI responsiveness.
Empfohlen
Industrial Machine Vision & Volumetric Measurement
The ADTF3175D-NXZ enables industrial machine vision tasks including volumetric measurement of parcels, bin-picking, and inline quality inspection. The integrated laser diode and photodetector with calibrated optics produce repeatable depth measurements across production lines, while the 1 MP iToF imager captures dense 3D point clouds for downstream metrology. Per the ADTF3175 product page, the kit ships with Ethernet-over-USB host connectivity suitable for factory-floor PCs. The ADSD3500 depth ISP performs on-board depth math, reducing host CPU load and enabling deterministic cycle times in inspection cells.
Empfohlen
SLAM & Robotics Research
The ADTF3175D-NXZ supports SLAM and robotics research through ROS / ROS 2 integration via the adi_3dtof_image_stitching package, which stitches depth frames from multiple ADTF3175D sensors for wide-baseline mapping. According to the ROS Index listing, the package enables multi-sensor fusion scenarios useful for academic research in 3D perception, mapping, and navigation. The kit's open-source SDK accelerates publication-quality experimentation by removing low-level driver development. Researchers benefit from the calibrated optics and bundled depth ISP, which deliver reproducible depth data across lab sessions.
Empfohlen
Mobile Sensing & Portable Devices
The ADTF3175D-NXZ, while primarily a desktop evaluation platform, informs the design of mobile-sensing prototypes and portable depth-enabled devices. Per the Analog Devices EVAL-ADTF3175 product page, the open-source multi-platform SDK supports cross-compilation to embedded Linux targets, enabling engineers to prototype mobile use cases such as handheld scanners, AR accessories, and field inspection tools. The 940 nm illumination is eye-safety friendly for short-range portable use, and the ADSD3500 ISP offloads depth compute, extending battery life in field deployments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für ADTF3175D-NXZ – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EVAL-ADTF3175 | ADTF3175 |
|---|---|---|---|
| Package | EVK (carrier PCB + ADTF3175 module + ADSD3500) | EVK (no ADSD3500 carrier) | Bare ToF module |
| Brand | Analog Devices | Analog Devices | Analog Devices |
| Main Module | ADTF3175 | ADTF3175 | ADTF3175 |
| Depth ISP | ADSD3500 (bundled) | Not bundled | Not included |
| Resolution | 1 MP (1024 x 1024) | 1 MP (1024 x 1024) | 1 MP (1024 x 1024) |
| Host Interface | Ethernet over USB | Varies by carrier | Module-level MIPI / parallel |
| Host Software | Windows GUI + multi-platform SDK | Varies by carrier | SDK only |
| ROS / ROS 2 Support | Yes (adi_3dtof_image_stitching) | Yes (when paired with carrier) | Module-level only |
Wichtigste Unterscheidungsmerkmale
- Bundled ADSD3500 depth ISP for on-board depth computation (vs. ADTF3175 (bare module))
- Turnkey evaluation kit with Windows GUI and multi-platform SDK (vs. ADTF3175 (bare module))
- Ethernet-over-USB host interface for plug-and-play streaming (vs. EVAL-ADTF3175 (earlier EVK))
Designhinweise
Estimated: The integrated 940 nm IR illumination source (laser diode + driver) dissipates heat during continuous depth streaming; per the ADTF3175 product page, designers should provide airflow or thermal vias around the illumination source area on custom carrier boards. For benchtop EVK use, ambient room temperature is acceptable, but sustained 100% duty-cycle streaming may raise the laser driver temperature; a small heatsink or fan is recommended for thermal-margin testing in lab environments.
Per the Analog Devices EVAL-ADTF3175 product page, the EVK uses Ethernet-over-USB for host connectivity; when designing a custom carrier, maintain short, impedance-controlled USB traces and route the laser driver signals away from sensitive analog paths to avoid EMI coupling. The optical band-pass filter inside the ADTF3175 module should be kept free of contamination; per the datasheet summary, avoid touching the lens surface and use anti-static handling procedures.
Common pitfalls when evaluating the ADTF3175D-NXZ include: (1) confusing the EVAL-ADTF3175D-NXZ (full EVK with ADSD3500 ISP) with the bare ADTF3175 module (no on-board depth compute), (2) underestimating ambient IR interference in outdoor or sun-lit environments - the optical band-pass filter helps but is not a panacea, (3) ignoring eye-safety classifications for the integrated laser diode - consult local regulations. Per the Analog Devices EVAL-ADTF3175 product page, the EVK is intended for sensor validation, not desktop production, and is priced accordingly in that price band.
Compliance-Informationen
RoHS / REACH / lead-free / halogen-free / conflict-minerals status not stated in the verified snippet data for the EVAL-ADTF3175D-NXZ; consult the manufacturer declaration of conformity bundled with the EVK shipping package. AEC-Q100 not applicable (evaluation kit).
