Analog Devices

ADTF3175D-NXZ - 1MP ToF Eval Kit w/ ADSD3500 ISP | Analog Devices

料号: ADTF3175D-NXZ ✓ 量产中
有现货 1-3 个工作日内发货
低至 $495 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-05
批量定价
数量 单价 小计
1 $549 $549.00
5 $539 $2,695.00
10 $525 $5,250.00
25 $510 $12,750.00
50 $495 $24,750.00
ℹ️ 所有价格均以 USD 计价

ADTF3175D-NXZ 概述

The Analog Devices EVAL-ADTF3175D-NXZ is a complete 1 megapixel Time-of-Flight (ToF) evaluation kit built around the ADTF3175 ToF module and the ADSD3500 depth image signal processor (ISP). The kit integrates the ADSD3100 CMOS indirect ToF (iToF) imager together with the lens, optical band-pass filter, infrared illumination optics, laser diode, laser diode driver, and photodetector into a single calibrated module. According to the Analog Devices EVAL-ADTF3175D-NXZ product page, the kit exposes Ethernet-over-USB to a host PC for real-time visualization, capture, and post-processing of depth data, and ships with a Windows host GUI plus an open-source multi-platform SDK.

A Time-of-Flight (ToF) camera is a depth-sensing system that measures the round-trip time of modulated infrared light reflected from a scene, producing per-pixel distance maps independent of ambient illumination in many conditions. ToF modules sit within a hierarchy of depth sensors alongside passive stereo, active stereo (IR pattern projection), and structured-light cameras; the iToF technique used by the ADTF3175 modulates continuous-wave IR illumination and extracts phase information at each pixel, distinguishing it from direct ToF approaches that time single photons.

Key features of the ADTF3175D-NXZ include 1 MP (1024 x 1024) depth resolution from the ADSD3100 imager, integrated 940 nm-class IR illumination, an on-board ADSD3500 depth ISP that performs depth computation on the kit, and USB-to-Ethernet bridging for streaming depth frames to the host. The kit supports sensor validation using the host-side ADI 3DToF ROS package for image stitching across multiple units, enabling wide-baseline depth capture for robotics and perception research.

The ADTF3175D-NXZ is engineered for 3D depth sensing and vision systems targeting robotics, SLAM, gesture recognition, and industrial machine vision. Compared with bare iToF imagers, the integrated optical stack reduces calibration overhead, while the bundled ADSD3500 ISP offloads depth math from the host, which is helpful in embedded Linux or ROS 2 deployments. Designers evaluating competing modules (e.g., Espressif ESP32-C6x, etc.) should note the ADI solution ships as a turnkey EVK rather than a discrete imager; trade-offs include BOM cost versus integration time.

Typical applications include warehouse robotics, autonomous mobile robots (AMR), volumetric measurement, and AR/VR candidate systems. When planning system layouts, ensure adequate thermal headroom around the IR illumination source during continuous depth streaming and observe eye-safety classifications for the integrated laser. This page synthesizes distributor pricing, application context, and cross-reference data not found in the standalone ADTF3175 datasheet.

直接替换替代料: ADTF3175D-NXZ ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: ADTF3175D-NXZ (相同外形与封装尺寸) ——差异在于 Imager, Mounting Type, Product Type, Resolution.

Analog Devices
Imager: ADSD3100 CMOS indirect ToF (iToF)
Mounting Type: Board mount (open frame)
Product Type: Time-of-Flight (ToF) module
对比 ADTF3175D-NXZ →

快速对比工具——选择替代料号进行并排对比:

EVAL-ADTF3175

✅ 直接替换
📦 EVK (carrier PCB)
Same ADTF3175 module but without the bundled ADSD3500 depth ISP carrier; users supply external depth compute

📋 参考替代料(不在目录中)

ADTF3175

✅ 直接替换
Analog Devices
📦 ToF Module
Time-of-Flight (ToF) module · ADSD3100 CMOS indirect ToF (iToF) · 1024 H x 1024 V (1 megapixel) · 3.5 µm x 3.5 µm · MIPI CSI-2 Tx (4-lane) · Lens, optical band-pass filter, IR illuminator, power regulators · 75 mm x 75 mm open frame · Factory calibrated, multi-range + multi-resolution modes

✓ 有现货

$230 / 个

查看数据手册 →

ADTF3175D-NXZ 最大额定值与电气特性

Product Type Time-of-Flight (ToF) Evaluation Kit
Main Module ADTF3175
Depth ISP ADSD3500
Imager ADSD3100 (CMOS indirect ToF)
分辨率 1 megapixel (1024 x 1024)
ToF Technique Indirect ToF (iToF), continuous-wave modulation
Integrated Optics Lens, optical band-pass filter, IR illumination optics
Illumination Source Laser diode with integrated driver and photodetector
Host Interface Ethernet over USB
Host Software Windows host GUI + open-source multi-platform SDK
Operating System Support Windows host; ROS / ROS 2 via adi_3dtof_image_stitching package
功能 3D depth sensing and vision system evaluation
安装类型 Bench / lab evaluation board
Form Factor Complete EVK (PCB + module + cabling)

ADTF3175D-NXZ standard 引脚配置指南

ADTF3175D-NXZ(standard 封装)的引脚配置。 引脚编号、功能和连接图在制造商数据手册中定义。请参阅该手册以了解确切的封装尺寸和焊接指南。

ADTF3175D-NXZ 的 standard 封装引脚图

暂无详细引脚数据: ADTF3175D-NXZ.

请参阅 数据手册 以查看完整引脚配置。

典型应用

ADTF3175D-NXZ 适用于 6 应用s: Warehouse Robotics & AMR, 3D Depth Sensing & Vision Systems, Gesture Recognition & HMI, Industrial Machine Vision & Volumetric Measurement, SLAM & Robotics Research, Mobile Sensing & Portable Devices.

🏭

Warehouse Robotics & AMR

The ADTF3175D-NXZ delivers 1 MP (1024 x 1024) indirect ToF depth maps ideal for warehouse mobile robots and autonomous mobile robots (AMR) navigating dynamic environments. The integrated 940 nm IR illumination and optical band-pass filter reduce ambient-light interference, while the on-board ADSD3500 depth ISP offloads phase-to-distance math from the host CPU, leaving more compute for path planning. Ethernet-over-USB streams depth frames at host-friendly rates; per the Analog Devices EVAL-ADTF3175 product page, ROS support via the adi_3dtof_image_stitching package enables multi-sensor fusion for wide-baseline obstacle avoidance in cluttered aisles.

🖥️

3D Depth Sensing & Vision Systems

The ADTF3175D-NXZ is purpose-built for high-resolution 3D depth sensing and vision system evaluation, integrating a 1 MP CMOS iToF imager with lens, band-pass filter, laser diode, and photodetector. According to the ADTF3175 datasheet summary, the module produces dense phase-based depth maps suitable for SLAM, scene reconstruction, and volumetric capture. The bundled ADSD3500 ISP delivers on-board depth computation, which is critical for embedded host platforms with constrained CPUs. Designers can validate full pipeline behavior end-to-end before committing to a discrete imager + custom ISP design.

🧩

Gesture Recognition & HMI

The ADTF3175D-NXZ's 1 MP depth resolution enables fine-grained gesture recognition for natural human-machine interfaces in smart-home and AR/VR candidate systems. Continuous-wave indirect ToF modulates IR illumination and extracts per-pixel phase information, allowing the kit to detect hand poses, finger positions, and body gestures regardless of visible-light conditions. According to the EVAL-ADTF3175 product page, the open-source multi-platform SDK accelerates custom gesture-pipeline development on Windows, Linux, and embedded hosts. Latency is bounded by the ADSD3500 ISP pipeline rather than host CPU, supporting real-time HMI responsiveness.

🏭

Industrial Machine Vision & Volumetric Measurement

The ADTF3175D-NXZ enables industrial machine vision tasks including volumetric measurement of parcels, bin-picking, and inline quality inspection. The integrated laser diode and photodetector with calibrated optics produce repeatable depth measurements across production lines, while the 1 MP iToF imager captures dense 3D point clouds for downstream metrology. Per the ADTF3175 product page, the kit ships with Ethernet-over-USB host connectivity suitable for factory-floor PCs. The ADSD3500 depth ISP performs on-board depth math, reducing host CPU load and enabling deterministic cycle times in inspection cells.

🤖

SLAM & Robotics Research

The ADTF3175D-NXZ supports SLAM and robotics research through ROS / ROS 2 integration via the adi_3dtof_image_stitching package, which stitches depth frames from multiple ADTF3175D sensors for wide-baseline mapping. According to the ROS Index listing, the package enables multi-sensor fusion scenarios useful for academic research in 3D perception, mapping, and navigation. The kit's open-source SDK accelerates publication-quality experimentation by removing low-level driver development. Researchers benefit from the calibrated optics and bundled depth ISP, which deliver reproducible depth data across lab sessions.

📱

Mobile Sensing & Portable Devices

The ADTF3175D-NXZ, while primarily a desktop evaluation platform, informs the design of mobile-sensing prototypes and portable depth-enabled devices. Per the Analog Devices EVAL-ADTF3175 product page, the open-source multi-platform SDK supports cross-compilation to embedded Linux targets, enabling engineers to prototype mobile use cases such as handheld scanners, AR accessories, and field inspection tools. The 940 nm illumination is eye-safety friendly for short-range portable use, and the ADSD3500 ISP offloads depth compute, extending battery life in field deployments.

What is the ADTF3175D-NXZ evaluation kit?
The Analog Devices EVAL-ADTF3175D-NXZ is a Time-of-Flight (ToF) evaluation kit built around the ADTF3175 ToF module and the ADSD3500 depth ISP. According to the Analog Devices EVAL-ADTF3175D-NXZ product page, the kit supports Ethernet-over-USB connectivity to a host PC for real-time visualization, capture, and post-processing of depth data, and includes a Windows host GUI plus an open-source multi-platform SDK.
What imager and ISP does the ADTF3175D-NXZ use?
The ADTF3175D-NXZ uses the ADSD3100 1 megapixel CMOS indirect Time-of-Flight imager and the ADSD3500 depth image signal processor for on-board depth computation. According to the ADTF3175 datasheet on Mouser, the module integrates the imager, lens, optical band-pass filter, IR illumination optics, laser diode, laser diode driver, and photodetector into a single calibrated package.
What is the resolution of the ADTF3175 module?
The ADTF3175 module delivers 1 megapixel depth resolution at 1024 x 1024 pixels through the integrated ADSD3100 CMOS indirect ToF imager. This resolution enables dense depth maps for SLAM, volumetric measurement, and gesture recognition, per the ADTF3175 product page description from Analog Devices.
Where can I buy the ADTF3175D-NXZ online?
The EVAL-ADTF3175D-NXZ is in stock at authorized distributors including DigiKey, Mouser, Newark, and Octopart-listed resellers. Per DigiKey product listing 18702488, the part is shown with same-day shipping in the Q4 2026 timeframe; lead time may vary by distributor and quantity. Prices start around $549 per unit as of 2026-10-05.
What is the price of the ADTF3175D-NXZ?
The ADTF3175D-NXZ evaluation kit is priced around $549 at qty-1 based on current distributor listings (as of 2026-10-05). Volume discounts apply at qty 5, 10, 25, and 50 per Octopart aggregated distributor data; pricing reflects a complete EVK including module, ISP board, and cabling rather than a bare imager.
What is the lead time for the ADTF3175D-NXZ?
DigiKey lists the ADTF3175D-NXZ as 'ships today' for small quantities per the 2026 Q4 inventory snapshot. Per the Analog Devices product page, lead time is generally short because the part is in active distribution; bulk orders above 25 units should be confirmed with the distributor for current factory stock. No formal lead-time datasheet figure is provided.
Is the ADTF3175D-NXZ in stock?
The ADTF3175D-NXZ is shown in stock at major distributors including DigiKey and Mouser as of 2026-10-05. Per DigiKey listing 18702488, the part carries same-day shipping for small quantities, and Mouser also lists inventory. Stock fluctuates; consult each distributor page for real-time availability before placing a production order.
ADTF3175 vs ADTF3175D-NXZ - what is the difference?
The ADTF3175 is the bare Time-of-Flight module (integrated optics, laser, imager), while the ADTF3175D-NXZ is the complete evaluation kit that bundles the ADTF3175 module with the ADSD3500 depth ISP and a host-interface board. According to the Analog Devices EVAL-ADTF3175 product page, the kit adds Ethernet-over-USB connectivity, a Windows GUI, and an open-source multi-platform SDK not included with the bare module.
When should I choose the ADTF3175D-NXZ over a bare ToF imager?
Choose the ADTF3175D-NXZ when you need a turnkey 3D depth evaluation platform with on-board depth processing via the ADSD3500 ISP and a working SDK. For high-volume production where cost is critical, a bare imager plus a custom ISP implementation may be preferable; the EVK is optimized for sensor validation, not desktop production, and is priced accordingly.
Can the ADTF3175D-NXZ be used with ROS or ROS 2?
Yes, the ADTF3175D-NXZ supports ROS and ROS 2 via the adi_3dtof_image_stitching package, per the ROS Index listing. Per the package overview, the package stitches depth images from multiple ADTF3175D ToF sensors, which is useful for wide-baseline setups in robotics, SLAM, and multi-camera depth fusion scenarios. Host PC runs the stitching node while each EVK streams depth frames.
Where do I download the ADTF3175 datasheet PDF?
The ADTF3175 module datasheet is hosted by Mouser at mouser.com/datasheet/2/609/adtf3175-3134582.pdf, with evaluation kit documentation at the Analog Devices EVAL-ADTF3175 product page. Per Mouser catalog metadata, the ADTF3175 datasheet spans 107 kbytes and covers 2 pages; system-level EVK documentation lives at developer.analog.com under system-level reference designs.
Where do I find the ADTF3175D-NXZ pinout?
The ADTF3175D-NXZ is a complete evaluation kit, not a discrete IC, so a traditional pinout diagram does not apply; instead, the kit exposes Ethernet-over-USB, power input, and laser-safety interconnects on the carrier PCB. Per the Analog Devices EVAL-ADTF3175 product page, host-side cabling is documented in the user guide linked from the developer.analog.com portal.
What is the best drop-in alternative evaluation kit for the ADTF3175D-NXZ?
There is no pin-compatible drop-in replacement for the ADTF3175D-NXZ because it is a complete evaluation kit that bundles a proprietary ADTF3175 module with the ADSD3500 depth ISP. According to the verified cross-reference search, only generic cross-reference tools and the ADTF3175 module itself appear as direct references. Consider Microchip PIC32MZ-based host controllers from the XAIPART Site MPN list for downstream host firmware development.
What alternative ToF eval kits exist for the ADTF3175D-NXZ?
According to the Analog Devices product page, alternatives within the ADI ToF portfolio include the bare ADTF3175 module (without the ADSD3500 ISP carrier) and earlier ADI 3DToF evaluation kits. Per the ROS Index adi_3dtof_image_stitching package, multi-sensor stitching is supported across ADI 3DToF EVKs. No third-party drop-in alternative with identical optics and ISP integration was identified in the cross-reference search.
What is the operating voltage of the ADTF3175D-NXZ?
The ADTF3175D-NXZ is powered through the included USB-C or DC input on the carrier PCB; specific voltage values are documented in the EVAL-ADTF3175 user guide rather than the module datasheet. Per the Analog Devices EVAL-ADTF3175 product page, the host PC provides power through USB in typical lab setups. Always refer to the EVK user guide for exact rail voltages before bench bring-up.
Is the ADTF3175D-NXZ RoHS compliant?
RoHS compliance status for the EVAL-ADTF3175D-NXZ evaluation kit is not stated in the verified snippet data; per Analog Devices' general product policy, most EVKs ship RoHS compliant, but this should be confirmed against the manufacturer declaration of conformity. Per the EVAL-ADTF3175 product page, full environmental compliance certificates are typically bundled with the kit shipping package.

工程参考数据: ADTF3175D-NXZ ——对比、设计指导和合规信息。

选型指南

Choose the ADTF3175D-NXZ when you need a turnkey 1 MP indirect ToF evaluation kit with on-board depth computation via the ADSD3500 ISP and a working multi-platform SDK; it is optimized for sensor validation, robotics research, and AMR prototyping. Choose the bare ADTF3175 module if you are integrating depth compute into a custom carrier and want to minimize kit cost. Choose the earlier EVAL-ADTF3175 carrier if you already have an external ISP or want a different host-side connector layout. For ROS-based multi-sensor stitching, the ADTF3175D-NXZ pairs with the adi_3dtof_image_stitching package; verify eye-safety and ambient-light conditions in your target environment before deployment.

与替代料对比

参数 本产品 EVAL-ADTF3175 ADTF3175
Package EVK (carrier PCB + ADTF3175 module + ADSD3500) EVK (no ADSD3500 carrier) Bare ToF module
Brand Analog Devices Analog Devices Analog Devices
Main Module ADTF3175 ADTF3175 ADTF3175
Depth ISP ADSD3500 (bundled) Not bundled Not included
Resolution 1 MP (1024 x 1024) 1 MP (1024 x 1024) 1 MP (1024 x 1024)
Host Interface Ethernet over USB Varies by carrier Module-level MIPI / parallel
Host Software Windows GUI + multi-platform SDK Varies by carrier SDK only
ROS / ROS 2 Support Yes (adi_3dtof_image_stitching) Yes (when paired with carrier) Module-level only

关键差异点

  • Bundled ADSD3500 depth ISP for on-board depth computation (对比 ADTF3175 (bare module))
  • Turnkey evaluation kit with Windows GUI and multi-platform SDK (对比 ADTF3175 (bare module))
  • Ethernet-over-USB host interface for plug-and-play streaming (对比 EVAL-ADTF3175 (earlier EVK))

设计说明

Estimated: The integrated 940 nm IR illumination source (laser diode + driver) dissipates heat during continuous depth streaming; per the ADTF3175 product page, designers should provide airflow or thermal vias around the illumination source area on custom carrier boards. For benchtop EVK use, ambient room temperature is acceptable, but sustained 100% duty-cycle streaming may raise the laser driver temperature; a small heatsink or fan is recommended for thermal-margin testing in lab environments.

Per the Analog Devices EVAL-ADTF3175 product page, the EVK uses Ethernet-over-USB for host connectivity; when designing a custom carrier, maintain short, impedance-controlled USB traces and route the laser driver signals away from sensitive analog paths to avoid EMI coupling. The optical band-pass filter inside the ADTF3175 module should be kept free of contamination; per the datasheet summary, avoid touching the lens surface and use anti-static handling procedures.

Common pitfalls when evaluating the ADTF3175D-NXZ include: (1) confusing the EVAL-ADTF3175D-NXZ (full EVK with ADSD3500 ISP) with the bare ADTF3175 module (no on-board depth compute), (2) underestimating ambient IR interference in outdoor or sun-lit environments - the optical band-pass filter helps but is not a panacea, (3) ignoring eye-safety classifications for the integrated laser diode - consult local regulations. Per the Analog Devices EVAL-ADTF3175 product page, the EVK is intended for sensor validation, not desktop production, and is priced accordingly in that price band.

合规信息

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
无铅
Unknown
无卤
Unknown
冲突矿物
Unknown

RoHS / REACH / lead-free / halogen-free / conflict-minerals status not stated in the verified snippet data for the EVAL-ADTF3175D-NXZ; consult the manufacturer declaration of conformity bundled with the EVK shipping package. AEC-Q100 not applicable (evaluation kit).

相关搜索

ADTF3175D-NXZ ADTF3175D-NXZ datasheet Analog Devices ADTF3175D-NXZ EVAL-ADTF3175D-NXZ evaluation kit ADTF3175 vs ADTF3175D-NXZ Time-of-Flight evaluation kit 1MP iToF camera depth sensor ROS ADSD3500 depth ISP ADTF3175D-NXZ buy price ADTF3175D-NXZ in stock DigiKey Mouser ADTF3175D-NXZ alternative substitute what is iToF depth sensor module

相关元器件 & 术语

Analog Devices ADTF3175D-NXZ EVAL-ADTF3175 ADTF3175 ADSD3500 ADSD3100 Time-of-Flight ToF indirect ToF iToF depth image signal processor depth ISP 3D depth sensing vision system 940 nm IR illumination laser diode optical band-pass filter photodetector Ethernet over USB CMOS image sensor 1 megapixel 1024 x 1024 ROS ROS 2 adi_3dtof_image_stitching SLAM autonomous mobile robot AMR warehouse robotics gesture recognition machine vision volumetric measurement Windows host GUI open-source SDK multi-platform SDK evaluation kit EVK Eye safety
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