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Alliance Memory

AS4C8M16SA-6BAN - 128Mb SDRAM 166MHz 3.3V 54-TFBGA | Alliance Memory

Teilenummer: AS4C8M16SA-6BAN ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
3.3 V Vdss 54-TFBGA (8x8 mm) Package 166 MHz Speed SDRAM (synchronous DRAM), volatile Memory
Ab $14.85 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-06
Mengenpreise
Menge Stückpreis Gesamt
1 $21.93 $21,93
10 $19.9 $199,00
100 $18.1 $1.810,00
500 $16.5 $8.250,00
1.000 $14.85 $14.850,00
ℹ️ Alle Preise sind in USD

AS4C8M16SA-6BAN Übersicht

The Alliance Memory AS4C8M16SA-6BAN is a 128Mbit synchronous DRAM (SDRAM) memory IC organized as 8M x 16 bits, operating at 166 MHz with a 5 ns clock cycle time from a 3.3V supply, housed in a 54-ball TFBGA (8x8 mm) package rated for automotive temperature ranges.

Synchronous DRAM is a category of volatile DRAM memory that synchronizes all address, control, and data inputs to a single clock edge, unlike asynchronous DRAM which responds to control signal transitions independently. Within the memory hierarchy, SDRAM sits above asynchronous DRAM in performance and below DDR generations; it remains the workhorse memory class for embedded processors, networking equipment, and industrial systems that require burst-mode bandwidth without DDR controller complexity.

Key features of the AS4C8M16SA-6BAN include the 8M x 16 organization with four internal banks, a 166 MHz clock rate (CL3 programmable cas latency), auto refresh and self refresh modes per the Alliance Semiconductor/Alliance Memory datasheet, LVTTL-compatible 3.3V interface, and AEC-Q100-capable automotive temperature support. The 54-ball TFBGA (8x8 mm) package offers a compact surface-mount footprint with improved signal integrity compared to 54-pin TSOP II, reducing lead inductance for high-speed bus operation.

The device implements industry-standard SDRAM command architecture including bank activate, read, write, precharge, mode register set, and refresh commands, enabling straightforward integration with SDRAM controllers in FPGAs and microprocessors. The automotive temperature rating extends operation beyond the commercial 0C to +70C range, making the part suitable for harsh-environment designs.

Typical applications include automotive infotainment and telematics buffers, industrial HMI and PLC data buffers, FPGA-based instrumentation memory, medical equipment frame buffers, and communications equipment line-card buffering.

Design consideration: SDRAM requires continuous refresh - budget for the auto-refresh command interval in your controller scheduling, and terminate/series-damp clock and data lines to preserve 166 MHz signal integrity on multi-drop buses.

This page synthesizes distributor pricing, availability, drop-in replacement options, and practical design guidance not consolidated in the manufacturer datasheet.

Drop-in-Alternativen für AS4C8M16SA-6BAN – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

AS4C8M16SA-6BANTR

✅ Drop-In
📦 54-TFBGA (8x8)
identical die and 54-TFBGA footprint, tape-and-reel vs tray packaging (only handling format differs)

📋 Referenzalternative (nicht im Katalog)

AS4C8M16SA-6BIN

✅ Drop-In
📦 54-TFBGA (8x8)
same die and package, industrial temperature grade vs automotive temp grade (temperature range differs, electricals identical)

📋 Referenzalternative (nicht im Katalog)

AS4C8M16SA-6BAN Grenzwerte & elektrische Eigenschaften

Speichertyp SDRAM (synchronous DRAM), volatile
Speichergröße 128 Mbit
Memory Organization 8M x 16
Technology DRAM - SDRAM
Clock Frequency 166 MHz
Clock Cycle Time 5 ns
Versorgungsspannung 3.3 V
Schnittstellentyp Parallel, LVTTL
Access Time 5 ns
Gehäuse 54-TFBGA (8x8 mm)
Montageart Surface Mount
Temperature Grade Automotive temp range
Refresh Mode Auto Refresh and Self Refresh
Number of Banks 4
Packaging Tray
Product Status Active
Qualification Automotive, AEC-Q100

AS4C8M16SA-6BAN 54-tfbga (8x8 mm) Pinbelegungsleitfaden

Pinbelegung für AS4C8M16SA-6BAN (54-tfbga (8x8 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für AS4C8M16SA-6BAN im 54-tfbga (8x8 mm)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für AS4C8M16SA-6BAN.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

AS4C8M16SA-6BAN ist geeignet für 6 Anwendungs: Automotive Infotainment and Telematics, Industrial HMI and PLC Data Buffering, FPGA-Based Test and Measurement Instruments, Medical Equipment Frame Buffers and Working Memory, Communications and Networking Line Cards, Embedded Processor and MCU External Memory Expansion.

🚗

Automotive Infotainment and Telematics

The AS4C8M16SA-6BAN is explicitly graded for automotive temperature with AEC-Q100 qualification, making it a natural fit for infotainment graphics buffers, telematics data logging, and display frame buffers. Its 8M x 16 organization provides 16-bit wide bursts at 166 MHz, delivering roughly 333 MB/s peak bandwidth - sufficient for 800x480 display refresh or CAN/LIN-to-media buffering. Placed on a processor or FPGA SDRAM controller bus, the BGA package shortens trace stubs versus TSOP, improving signal integrity at speed. Designers should place the part within 50 mm of the controller, series-terminate address lines at the driver, and reserve CKE control so the memory can enter self refresh during key-off states to preserve data with minimal standby drain.

🏭

Industrial HMI and PLC Data Buffering

Industrial human-machine interfaces and PLC front ends need reliable, non-complex RAM for screen buffers, recipe storage staging, and logging FIFOs. The AS4C8M16SA-6BAN provides 128Mbit of volatile buffering at 166 MHz from a simple 3.3V rail, avoiding the PHY complexity and termination rails DDR demands. Its four-bank architecture allows interleaved bank operation so a graphics engine can read a display region while the controller writes a log region, hiding latency in the SDRAM controller scheduler. With auto refresh at the standard 15.6 us interval and self refresh for panel standby, the design retains buffer contents through brief power interruptions backed by bulk capacitance. Alliance Memory positions its SDRAM line specifically for industrial applications requiring drop-in, pin-to-pin compatible sourcing.

🔧

FPGA-Based Test and Measurement Instruments

Oscilloscope, logic analyzer, and data-acquisition front ends require deep capture buffers with deterministic latency. The AS4C8M16SA-6BAN's 16-bit bus at 166 MHz sustains approximately 333 MB/s peak, adequate for streaming from ADCs such as the AD9609 or multi-channel pipelines after decimation. The four internal banks enable ping-pong capture schemes - one bank fills while another drains - and the mode register allows burst length and CAS latency programming to match the FPGA controller pipeline. LVTTL 3.3V I/O simplifies bank-level design in legacy FPGA families without requiring voltage translation. Fly-by or matched-length point-to-point routing within 60 mm keeps setup/hold margins healthy at CL3, and DQM signals permit byte masking during capture alignment.

💊

Medical Equipment Frame Buffers and Working Memory

Patient monitors, ultrasound display subsystems, and diagnostic imaging consoles rely on dependable volatile memory for scan-line buffers, waveform histories, and GUI frame stores. The AS4C8M16SA-6BAN supplies 128Mbit organized as 8M x 16, letting 16-bit ADC sample words from devices like the ADS1274 store at native width without packing overhead. Alliance Memory explicitly targets medical applications for its SDRAM family, and the automotive-grade thermal rating gives margin inside fanless medical enclosures where ambient temperatures rise. The self refresh mode supports low-power standby between acquisitions, and byte-enable DQM lanes allow partial-word updates of status regions without read-modify-write cycles. Design the power-up sequence with a 100 us stabilization delay and mode register initialization per the datasheet before first access.

🌐

Communications and Networking Line Cards

Packet buffering, queue management, and statistics aggregation on industrial Ethernet switches and gateways benefit from the AS4C8M16SA-6BAN's deterministic SDRAM interface. Pairing it with switch silicon such as the KSZ9893RNXI or a protocol processor, the 166 MHz 16-bit bus absorbs burst traffic while the controller schedules four banks as separate packet queues, using DQM for partial-frame writes. The BGA package reduces lead inductance relative to TSOP II, lowering ground bounce during simultaneous read/write switching - a visible benefit at full bus utilization. Auto refresh scheduling must be accounted for in worst-case buffer latency calculations; at 4096 cycles per 64 ms, refresh overhead is roughly a few percent of bandwidth, predictable and bounded.

🖥️

Embedded Processor and MCU External Memory Expansion

High-pin-count microcontrollers and SoCs with an external memory interface - such as PIC32MZ or Sitara families - use external SDRAM to escape on-chip SRAM limits for RTOS heaps, GUI libraries, and file-system caches. The AS4C8M16SA-6BAN connects directly to 3.3V LVTTL memory controllers at up to 166 MHz; its 8M x 16 organization matches 16-bit EMIF data buses natively. Initialization follows the standard SDRAM power-up sequence: wait 100 us, precharge all, issue two auto refresh cycles, then load the mode register for CL3 and the desired burst length. Keep address/control traces length-matched within the controller's skew budget and add 22-33 ohm series resistors on clock and strobes to damp reflections.

What are the key specifications of AS4C8M16SA-6BAN?
The AS4C8M16SA-6BAN is a 128Mbit SDRAM from Alliance Memory organized as 8M x 16, running at 166 MHz (5 ns cycle) from a 3.3V LVTTL parallel interface. It comes in a 54-ball TFBGA (8x8 mm) package, supports auto refresh and self refresh, is rated for automotive temperature, and ships in trays. According to the Alliance Memory product listing and DigiKey, the part is active and drop-in replacement oriented.
What is the operating voltage of AS4C8M16SA-6BAN?
The AS4C8M16SA-6BAN operates from a single 3.3V power supply with LVTTL-compatible input and output levels. According to the Mouser listing, it is specified as a 3.3V DRAM SDRAM. Designers should decouple VDD/VDDQ with low-ESR ceramic capacitors and ensure the 3.3V rail stays within the SDRAM tolerance band at full bus loading for reliable 166 MHz operation.
What is the price of AS4C8M16SA-6BAN?
Pricing for the AS4C8M16SA family is in the roughly $15-22 per unit range at single-piece quantities as of 2026-10-06, with the DigiKey listing for the related -6BANTR variant showing a unit price of $21.93. Bulk tier pricing at 100 to 1000 pieces drops meaningfully. XAIPART shows tiered pricing starting at $21.93 at qty 1 as of 2026-10-06; always request a formal quote for volume commitments.
Where to buy AS4C8M16SA-6BAN online?
The AS4C8M16SA-6BAN is available from authorized distributors including DigiKey (stock listed, ships same day) and Mouser, plus brokers such as Heisener (8,208 pieces reported in stock), Ampheo, Utsource, and TrustedParts network distributors as of 2026-10-06. XAIPART also supplies this part with tiered pricing and datasheet access. For automotive projects, buy only from authorized or franchise channels to guarantee traceability.
Is AS4C8M16SA-6BAN in stock and what is the lead time?
Yes, stock is broadly available as of 2026-10-06: DigiKey shows the part ships today, and third-party sources report 8,208 pieces (Heisener) and over 1,200 pieces on the related tray variant. Lead time from authorized distributors is typically same-day to a few days; broker lead times are quoted per order. Octopart lists 7 distributors carrying the part, so supply risk is currently low.
What is the difference between AS4C8M16SA-6BAN and AS4C16M16SA-6TCN?
The main differences are density, organization, and package. According to an Octopart parameter comparison, AS4C16M16SA-6TCN offers 256Mbit in a 16M x 16 organization in a 54-TSOP II package, while AS4C8M16SA-6BAN offers 128Mbit in 8M x 16 in a 54-TFBGA. Both are Alliance Memory SDRAMs at the same speed class, but the different densities and packages mean the -6TCN is not a drop-in replacement - PCB footprint and address mapping must be redesigned.
Is AS4C8M16SA-6BAN the same as AS4C8M16SA-6BANTR?
Electrically they are the same die in the same 54-TFBGA package; only the packaging format differs. The -6BAN suffix indicates tray packaging, while -6BANTR indicates tape and reel. According to DigiKey, the -6BANTR variant is listed as a parametric equivalent of the -6BAN. For prototype or hand assembly, choose the tray version; for automated pick-and-place volume production, tape and reel improves throughput.
Can AS4C8M16SA-6BAN replace a Micron SDRAM?
Alliance Memory explicitly positions the AS4C8M16SA family as a drop-in, pin-to-pin compatible replacement for equivalent SDRAM parts, and publishes a comparison document against Micron MT48LC8M16A2P-6A:L. The TSOP II version is a documented cross for the Micron TSOP; for a 54-ball FBGA board, verify the ballout mapping and speed grade against your controller settings before qualifying the swap. Contact Alliance Memory for the automotive-grade cross confirmation.
Is AS4C8M16SA-6BAN suitable for automotive applications?
Yes. According to the Mouser listing, the AS4C8M16SA-6BAN is specified for automotive temperature and carries Automotive/AEC-Q100 qualification per the Octopart parameter comparison. This makes it suitable for infotainment, telematics, and body-electronics memory buffering. For designs outside the passenger-compartment thermal envelope, verify the exact temperature limits on the Alliance Memory datasheet and consider board-level thermal analysis of the BGA package.
What is the best drop-in replacement for AS4C8M16SA-6BAN?
The closest same-manufacturer drop-in is the AS4C8M16SA-6BIN, which uses the identical die and 54-TFBGA package in an industrial temperature grade - it is pin-to-pin and functionally interchangeable if your thermal environment stays within industrial limits. Within the automotive grade, the -6BANTR (tape and reel of the same part) is a direct equivalent per DigiKey. No second-source BGA cross-brand drop-in was confirmed in current web data.
Where to download AS4C8M16SA-6BAN datasheet PDF?
The AS4C8M16SA-6BAN datasheet PDF is available from Alliance Memory at alliancememory.com/as4c8m16sa and via aggregator sites such as Alldatasheet (55-page document, Alliance Semiconductor/Alliance Memory, covering auto refresh and self refresh operation). Datasheets.com and distributor pages (DigiKey, Mouser) also host the PDF. Always use the manufacturer-hosted datasheet as the authoritative source for timing parameters and AC/DC characteristics.
How do I connect the AS4C8M16SA-6BAN pinout in my design?
The 54-ball TFBGA ballout follows the standard SDRAM signal set: 13 address inputs (A0-A12), 16 data I/O (DQ0-DQ15) with DQM masks, bank select (BA0-BA1), clock (CLK), clock enable (CKE), chip select (CS), RAS/CAS/WE commands, and power/ground balls. Refer to the Alliance Memory datasheet for the exact BGA ball coordinates rather than assuming the TSOP pin map, since BGA ball numbering differs from TSOP pin numbering.
When should I choose AS4C8M16SA-6BAN over a DDR memory?
Choose AS4C8M16SA-6BAN when your controller is an SDRAM-class interface (166 MHz single data rate, 3.3V LVTTL), when you need 128Mbit of buffering without DDR PHY complexity, or when automotive qualification and a compact BGA footprint matter. DDR memories offer far higher bandwidth but require VTT termination rails, length-matched fly-by routing, and DDR controllers. For FPGA soft-controllers, 8/16-bit MCUs with SDRAM EMI, and legacy industrial designs, SDRAM remains simpler and lower cost.
What is the best Alliance Memory (or other brand) equivalent for AS4C8M16SA-6BAN?
From Alliance Memory itself, the AS4C8M16SA-6BIN (industrial grade, same 54-TFBGA) is the direct same-family equivalent. Alliance also publishes a cross-comparison against Micron MT48LC8M16A2P-6A:L for the TSOP II version of this die. As of the latest web data, no independently verified cross-brand 54-TFBGA drop-in was found, so for automotive BGA designs Alliance Memory is effectively the single qualified source - plan lifecycle accordingly.
Does AS4C8M16SA-6BAN support self refresh for low-power operation?
Yes. According to the Alliance Memory datasheet (hosted on Alldatasheet), the AS4C8M16SA family supports both auto refresh, issued externally by the controller at the specified refresh interval, and self refresh, in which the device refreshes itself internally after CKE is deasserted. Self refresh is essential for battery-backed retention and sleep states in automotive and portable systems; re-entry and exit timing per the datasheet must be respected by the controller.
What refresh requirements does the 128Mb SDRAM impose on my controller?
The AS4C8M16SA requires an AUTO REFRESH command every 15.6 microseconds (4096 refresh cycles per 64 ms interval) per the standard 128Mb SDRAM refresh scheme described in the Alliance datasheet. Your SDRAM controller must arbitrate refresh commands against pending reads and writes, and honor tRFC timing between refresh operations. Missing refresh windows causes random bit corruption that is notoriously hard to debug - implement refresh as a highest-priority fixed-rate task.

Technische Referenzdaten für AS4C8M16SA-6BAN – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the AS4C8M16SA-6BAN when you need a 128Mbit, 8M x 16 SDRAM at 166 MHz in a compact 54-ball TFBGA with automotive temperature and AEC-Q100 qualification - the typical case for automotive infotainment buffers, harsh-environment industrial HMIs, and medical equipment. Choose the AS4C8M16SA-6BIN for the identical die and footprint when industrial temperature suffices and cost or sourcing flexibility matters. Choose the AS4C8M16SA-6TIN if your board already uses a 54-TSOP II footprint, since the BGA and TSOP are not footprint-compatible. If you need 256Mbit of buffering, move up to the AS4C16M16SA family, accepting a redesign for the different organization and package. Trade-offs: the BGA package complicates rework and inspection versus TSOP, and Alliance Memory is effectively the only verified BGA second-source-free supplier for this configuration, so plan lifecycle monitoring accordingly.

Vergleich mit Alternativen

Parameter Dieses Produkt AS4C8M16SA-6BANTR AS4C8M16SA-6BIN AS4C8M16SA-6TIN AS4C16M16SA-6TCN
Package 54-TFBGA (8x8 mm) 54-TFBGA (8x8 mm) - same 54-TFBGA (8x8 mm) - same 54-TSOP II - different 54-TSOP II - different
Brand Alliance Memory Alliance Memory Alliance Memory Alliance Memory Alliance Memory
Memory Size 128 Mbit 128 Mbit 128 Mbit 128 Mbit 256 Mbit
Memory Organization 8M x 16 8M x 16 8M x 16 8M x 16 16M x 16
Clock Frequency 166 MHz 166 MHz 166 MHz 166 MHz 166 MHz
Supply Voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Temperature Grade Automotive temp, AEC-Q100 Automotive temp Industrial temp Industrial temp Commercial temp
Refresh Support Auto refresh and self refresh Auto refresh and self refresh Auto refresh and self refresh Auto refresh and self refresh Auto refresh and self refresh

Wichtigste Unterscheidungsmerkmale

  • Automotive temperature grade with AEC-Q100 qualification (vs. AS4C8M16SA-6BIN)
  • Compact BGA package versus TSOP II equivalents (vs. AS4C8M16SA-6TIN)
  • Single-qualified-source trade-off for automotive BGA designs (vs. MT48LC8M16A2P-6A:L (Micron))

Designhinweise

For 166 MHz SDRAM operation, keep all address, control, and data traces as short as practical - ideally under 60 mm point-to-point in a single-DRAM system. Match data-group trace lengths to the clock within the controller skew specification, and place 22-33 ohm series resistors at the driver on CLK, DQS-equivalent strobes, and DQM lines to damp reflections. The 54-TFBGA ballout means escape routing on the bottom layer; allow via-in-pad or dog-bone fanout with at least one solid ground plane directly under the BGA for return current paths.

Decouple VDD and VDDQ separately: place at least 2x 0.1 uF ceramic capacitors adjacent to the supply balls plus one 10 uF bulk capacitor per device. SDRAM current is strongly burst-correlated - simultaneous bank activation on multiple DQ lines creates fast di/dt events that show up as rail droop and timing jitter. Estimated: at 166 MHz full-page bursts, expect tens of mA average with peaks above 100 mA; size the 3.3V regulator for peak, not average, and verify rail droop stays inside the 3.3V tolerance band.

The most common SDRAM bring-up failure is incorrect initialization order: the controller must wait approximately 100 us after stable power, issue PRECHARGE ALL, perform two or more AUTO REFRESH cycles, then load the MODE REGISTER before any data access. Second, refresh must run at the 15.6 us auto-refresh interval (4096 cycles per 64 ms) - omitting it produces intermittent bit errors that look like software bugs. Third, respect CKE sequencing: entering and exiting self refresh has minimum pulse-width requirements per the Alliance Memory datasheet.

Compliance-Informationen

RoHS
Unknown
REACH
Unknown
AEC-Q100
Qualified
Bleifrei
Unknown
Halogenfrei
Unknown
Konfliktmineralien
Unknown

Octopart parameter comparison lists the AS4C8M16SA-6BAN as Automotive, AEC-Q100. RoHS/REACH/lead-free/halogen status not stated in the provided web data.

Daten verifiziert am: 2026-10-06 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

Ähnliche Suchanfragen

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Verwandte Bauteile & Begriffe

Alliance Memory Alliance Semiconductor AS4C8M16SA-6BAN AS4C8M16SA-6BIN AS4C8M16SA-6BANTR AS4C8M16SA-6TIN AS4C16M16SA-6TCN MT48LC8M16A2P-6A:L Micron Technology SDRAM synchronous DRAM DRAM volatile memory memory IC AEC-Q100 54-TFBGA TSOP II BGA auto refresh self refresh LVTTL CAS latency DigiKey Mouser Octopart
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