ATSAM4SD16CA-CUR - 120MHz Cortex-M4 MCU 1MB Flash | Microchip
Teilenummer: ATSAM4SD16CA-CUR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $8.39 | $8,39 |
| 10 | $7.62 | $76,20 |
| 100 | $6.92 | $692,00 |
| 500 | $6.18 | $3.090,00 |
| 1.000 | $5.55 | $5.550,00 |
ATSAM4SD16CA-CUR Übersicht
What is a Cortex-M4 microcontroller? A Cortex-M4 MCU is a 32-bit RISC processor core designed by ARM for deterministic embedded applications, featuring a single-precision FPU, DSP extensions, and low interrupt latency. It sits within the broader taxonomy of microcontroller -> 32-bit MCU -> ARM Cortex-M family -> Cortex-M4 sub-family, and is widely used in industrial, consumer, and connectivity applications where both signal-processing performance and low power are required.
Key features include 1 MB embedded Flash organised as dual-bank 512 KB for in-application programming, 160 KB SRAM with optional battery backup domain, a high-speed MultiMedia Card Interface (HSMCI) for SD cards, and an Embedded Trace Macrocell (ETM) for real-time instruction trace. The device operates from 1.62 V to 3.6 V and is qualified for the industrial temperature range (-40 °C to +85 °C).
Architecturally, the SAM4SD16 uses a 3-layer AHB/LPB bus matrix that allows simultaneous peripheral and SRAM access without contention, plus a Peripheral DMA controller (PDC) that offloads memory transfers from the CPU. The integrated FPU delivers single-cycle MAC operations, enabling audio codecs, sensor-fusion algorithms, and small FFT workloads to run on the MCU itself.
Typical applications include industrial PLCs and motor-control front ends, USB peripherals and human-interface devices, smart energy and metering, medical instrumentation, and consumer audio products. The dual-bank Flash and bootloader (SAM-BA) support secure field upgrades, which is important for long-life industrial deployments.
When designing with this part, allocate the 100-ball TFBGA footprint carefully: it requires microvia-compatible PCB stack-ups and proper thermal copper under the array. Power-supply decoupling must include a 100 nF cap per VDD pin and a bulk 4.7 µF near the regulator, as recommended in the SAM4S datasheet.
This page synthesises distributor pricing, drop-in same-package alternatives, comparison data, and practical PCB design notes not found in the manufacturer datasheet alone, helping engineers evaluate second-source options and accelerate their design-in decisions.
Drop-in-Alternativen für ATSAM4SD16CA-CUR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit ATSAM4SD16CA-CUR (gleiche Bauform und Footprint) – abweichend in Package, ADC, Operating Temperature, Mounting Type, Core Architecture.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
ATSAM4SD16CA-CU
✅ Drop-In✓ Auf Lager
$5.2 / Stück
Datenblatt ansehen →ATSAM4S16CA-CU
✅ Drop-In✓ Auf Lager
$4.89 / Stück
Datenblatt ansehen →ATSAM4SA16CA-AUR
✅ Drop-In✓ Auf Lager
$6.23 / Stück
Datenblatt ansehen →ATSAM4S8CA-CFUR
✅ Drop-In✓ Auf Lager
$3.95 / Stück
Datenblatt ansehen →ATSAM4SD16BB-MN
✅ Drop-In✓ Auf Lager
$7.55 / Stück
Datenblatt ansehen →ATSAM4SD16BA-MU
✅ Drop-In✓ Auf Lager
$4.12 / Stück
Datenblatt ansehen →ATSAM4SD16CA-CUR Grenzwerte & elektrische Eigenschaften
| Core Architecture | ARM Cortex-M4 with FPU |
| Core Bit Width | 32-bit |
| Maximum CPU Clock | 120 MHz |
| Program Memory (Flash) | 1 MB (2 x 512 KB dual-bank) |
| SRAM | 160 KB |
| Gehäuse | 100-TFBGA (9 x 9 mm) |
| Supply Voltage (VDD) | 1.62 V to 3.6 V |
| I/O Voltage | 1.62 V to 3.6 V |
| Betriebstemperatur | -40 °C to +85 °C (Industrial) |
| Communication Interfaces | USB 2.0 Full-Speed, 2 x CAN, USART/UART, SPI, TWI (I²C), HSMCI |
| ADC | 12-bit, up to 24 channels |
| PWM / Timer | 16-bit, multi-channel |
| DMA | Peripheral DMA Controller (PDC) |
| Trace | Embedded Trace Macrocell (ETM) + SWD |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| MSL-Level | MSL3 (per JEDEC J-STD-020) |
ATSAM4SD16CA-CUR 100-tfbga (9 x 9 mm) Pinbelegungsleitfaden
Pinbelegung für ATSAM4SD16CA-CUR (100-tfbga (9 x 9 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für ATSAM4SD16CA-CUR.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
ATSAM4SD16CA-CUR ist geeignet für 7 Anwendungs: Industrial Motor Control and PLC Front End, USB Peripherals and HID Devices, Smart Energy and Metering, Medical Instrumentation and Patient Monitors, Consumer Audio and Wireless Headsets, Industrial Gateways and CAN-FD Bridges, Automotive Body and HMI Modules.
Industrial Motor Control and PLC Front End
The ATSAM4SD16CA-CUR fits industrial motor control because it integrates two CAN 2.0B controllers, a 12-bit 1 Msps ADC, and a 16-bit multi-channel PWM block on a single 120 MHz Cortex-M4 die. The FPU executes field-oriented control (FOC) loops in <10 µs, while the dual-bank 1 MB Flash enables safe in-field firmware upgrades without bricking the PLC. Place the device on a 100-TFBGA footprint with a 4-layer FR4 PCB, decouple each VDD pin with 100 nF X7R, and add a 4.7 µF bulk cap; the same part can drive both AC induction and BLDC motors.
Empfohlen
USB Peripherals and HID Devices
For USB keyboards, mice, custom HID, and CDC-class peripherals, the ATSAM4SD16CA-CUR provides an integrated USB 2.0 Full-Speed (12 Mbps) controller with on-chip transceiver, eliminating the need for an external PHY and saving BOM cost. The 1 MB Flash accommodates USB class drivers plus application code, while 160 KB SRAM buffers USB packets comfortably. Configure D+ with a 1.5 kΩ pull-up to VDDIO to signal full-speed device mode, and use the SAM-BA bootloader on UART or USB for field updates.
Empfohlen
Smart Energy and Metering
Smart electricity meters and sub-metering gateways require deterministic processing of ADC samples and isolated communication. The ATSAM4SD16CA-CUR's 120 MHz Cortex-M4 with FPU computes RMS power and harmonics on each AC cycle, while the dual-bank Flash supports secure OTA tariff updates from the utility. The two CAN interfaces connect to in-home energy buses (e.g. CANopen), and the HSMCI port accepts an SD card for data logging up to 32 GB.
Empfohlen
Medical Instrumentation and Patient Monitors
The ATSAM4SD16CA-CUR's Cortex-M4 with FPU runs DSP-style signal-processing algorithms for ECG, SpO2, and pulse-oximetry front ends, while the wide 1.62 V to 3.6 V supply range simplifies battery management on 2x AA or Li-ion packs. Industrial temperature grade (-40 °C to +85 °C) supports equipment deployed in clinical and field environments. Pair with the on-board 12-bit ADC plus an external 24-bit sigma-delta for high-resolution bio-signal acquisition, and use the USB port for data download to a PC.
Empfohlen
Consumer Audio and Wireless Headsets
Audio applications benefit from the ATSAM4SD16CA-CUR's Cortex-M4 FPU, which can run low-latency codecs such as SBC, AAC, or proprietary DSP voice enhancement in real time. The I²S interface (driven through TWI/SPI peripherals with external codec) connects to Class-D amplifiers, while the 160 KB SRAM holds 44.1 kHz audio buffers with headroom. Power consumption is well controlled through the SAM4S sleep modes (e.g. Wait mode at ~10 µA), extending battery life in portable audio products.
Empfohlen
Industrial Gateways and CAN-FD Bridges
The ATSAM4SD16CA-CUR is well suited as a CAN-to-Ethernet or CAN-to-USB bridge for industrial gateways, with two independent CAN controllers plus USB and Ethernet MAC available through peripherals. The 1 MB Flash accommodates TCP/IP stacks (e.g. lwIP) and protocol-conversion firmware, while 160 KB SRAM buffers network packets. Place an external Ethernet PHY on RMII for full gateway capability; for smaller bridges, drop in the ATSAM4S8CA-CFUR with 512 KB Flash and 128 KB SRAM (70% parametric match).
Empfohlen
Automotive Body and HMI Modules
Although the ATSAM4SD16CA-CUR is industrial-grade rather than AEC-Q100 qualified, it is widely used in non-safety automotive body modules such as climate-control HMI, lighting controllers, and seat-adjustment keypads. The dual CAN interfaces connect to vehicle body networks, while the 12-bit ADC reads potentiometers and thermistors. Pair with external CAN transceivers (e.g. MCP2551) and a switching regulator for 12V battery operation; choose the ATSAM4S16CA-CU single-bank variant for cost-sensitive HMI nodes.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für ATSAM4SD16CA-CUR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | ATSAM4SD16CA-CU | ATSAM4S16CA-CU | ATSAM4SA16CA-AUR | ATSAM4S8CA-CFUR | ATSAM4SD16BB-MN |
|---|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Architecture | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU |
| Max CPU Clock | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 1 MB (2 x 512 KB dual-bank) | 1 MB (2 x 512 KB dual-bank) | 1 MB (single-bank) | 1 MB (single-bank) | 512 KB (single-bank) | 1 MB (2 x 512 KB dual-bank) |
| SRAM | 160 KB | 160 KB | 128 KB | 128 KB | 128 KB | 160 KB |
| CAN Controllers | 2 | 2 | 2 | 2 | 2 | 2 |
| USB 2.0 Interface | Full-Speed Device/Host | Full-Speed Device/Host | Full-Speed Device/Host | Full-Speed Device/Host | Full-Speed Device/Host | Full-Speed Device/Host |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Silicon Revision | A | A | A | A | A | B (recommended for new designs) |
Wichtigste Unterscheidungsmerkmale
- Dual-bank 1 MB Flash for in-application firmware updates (vs. ATSAM4S16CA-CU)
- Higher SRAM (160 KB vs 128 KB) for data buffers and stacks (vs. ATSAM4SA16CA-AUR)
- Revision B silicon available as drop-in upgrade (vs. ATSAM4SD16BB-MN)
Designhinweise
The 100-TFBGA package at 9x9 mm requires a PCB stack-up with microvias (0.1 mm laser-drilled) or via-in-pad to escape the inner rows of balls. Recommended: 4-layer FR4 with 0.5 oz copper, 0.2 mm via pitch, and a continuous GND plane under the BGA for both thermal dissipation and return-path integrity. Place 100 nF X7R decoupling caps on every VDD pin within 2 mm of the ball, plus one 4.7 µF bulk capacitor near the voltage regulator output (per SAM4S datasheet power-supply section).
Power the ATSAM4SD16CA-CUR from a low-noise LDO such as MCP1700 or a small DC-DC followed by an LDO, especially when the analog peripherals (12-bit ADC) are used. The internal 1.2 V core LDO requires that VDDIN and VDDCORE pins both be supplied; connect a 1 µF + 100 nF pair on VDDCORE. Avoid switching-noise on VDDIN exceeding 50 mV ripple, as it can degrade ADC SNR by 3-5 dB.
Do not assume the boot mode after reset defaults to Flash execution; the ATSAM4SD16CA-CUR samples the BMS (Boot Mode Select) pin at NRST release. Tie BMS to GND for normal Flash boot, or pull high to enter SAM-BA bootloader on USB or UART0. Also, on dual-bank parts, the GPNVM bits control whether the second bank is visible - configure them in the startup code, otherwise firmware linking may exceed 512 KB and overflow silently.
Estimated: At full CPU load (120 MHz, all peripherals active, 3.3 V VDD), the ATSAM4SD16CA-CUR consumes approximately 100 mW. With the 100-TFBGA theta_JA of ~35 °C/W on a 4-layer JEDEC test board, junction temperature rise above ambient is ~3.5 °C - well within the -40 °C to +85 °C industrial range. For sealed enclosures with no airflow, derate by 20% to keep Tj below 110 °C.
Compliance-Informationen
RoHS compliant per Microchip product page; industrial temperature grade -40 °C to +85 °C. NOT AEC-Q100 qualified - this is an industrial-grade part; for automotive safety applications use SAM V71/SAM S70 or similar AEC-Q100 qualified variants.
