ATSAM4SD16BB-MN - 120MHz Cortex-M4 MCU 1MB Flash | Microchip
MPN: ATSAM4SD16BB-MN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.27 | $9.27 |
| 10 | $8.84 | $88.40 |
| 100 | $8.38 | $838.00 |
| 500 | $7.95 | $3,975.00 |
| 1,000 | $7.55 | $7,550.00 |
ATSAM4SD16BB-MN Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a configurable set of peripherals on one die. The ARM Cortex-M4 core is a 32-bit RISC processor designed by ARM specifically for embedded deterministic real-time control, adding DSP extensions and an optional single-precision IEEE-754 floating-point unit. Within the broader hierarchy: Cortex-M4 -> 32-bit MCU -> RISC microcontroller -> embedded controller -> semiconductor IC. The SAM4S family sits in Microchip's mainstream-performance ARM-MCU tier, aimed at industrial, consumer, and connectivity-rich applications.
Key features of the ATSAM4SD16BB-MN include: 1 MB dual-bank Flash supporting in-application programming (IAP), 160 KB SRAM organized as 2x32KB + 128KB for high-bandwidth DMA without bus arbitration stalls, 120 MHz/150 DMIPS coreMark performance, and a Multi-port SRAM controller that allows simultaneous CPU and DMA access. The chip also embeds a 4-channel 16-bit ADC, a 12-bit DAC, two 2-channel 16-bit timers, a 4-channel 16-bit PWM, an Ethernet MAC (EMAC) with MII/RMII interface, and a USB 2.0 Full-Speed device/host/OTG controller. Hardware cryptographic accelerators (AES, DES, SHA) and a True Random Number Generator (TRNG) make it suitable for connected and secure-node designs.
Architecturally, the ATSAM4SD16BB-MN uses a 6-layer AHB matrix that lets the CPU, DMA, Ethernet MAC, USB, and EBI controllers contend for SRAM and Flash without wait-state bottlenecks under typical traffic. The Cortex-M4 DSP extensions and FPU accelerate closed-loop control and DSP filters in firmware, while the dual-bank Flash allows firmware update over-the-air with safe fallback to a golden image, a pattern common in IoT gateways and motor-control firmware.
Typical applications include industrial PLC modules, motor control (BLDC, FOC), smart energy metering, USB peripherals, barcode scanners, industrial gateways with Ethernet/CAN, and graphical HMI panels. Designers leverage the EBI to attach external memories/parallel LCDs, and the hardware crypto for TLS acceleration in connected devices.
Design consideration: the 64-pin QFN package has an exposed thermal pad that must be soldered to a ground plane with thermal vias to achieve the rated 105°C extended-temperature operation. Brown-out and watchdog features must be configured in startup code to ensure deterministic reset behavior in industrial installations.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for ATSAM4SD16BB-MN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM4SD16BB-MN (same form factor and footprint) — differing in Operating Temperature, Package, ADC, Mounting Type, SRAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAM4SD16BB-MU
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAM4SD16BB-MNR
✅ Drop-In✓ In Stock
$6.78 / Unit
View Datasheet →ATSAM4SD16BA-MUR
✅ Drop-In✓ In Stock
$7.21 / Unit
View Datasheet →ATSAM4SD16BA-MU
✅ Drop-In✓ In Stock
$4.12 / Unit
View Datasheet →ATSAM4SD16BB-MU_85C
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAM4SD16BB-MN Maximum Ratings & Electrical Characteristics
| Core | ARM Cortex-M4 with FPU |
| CPU Architecture | 32-bit RISC |
| Maximum CPU Clock | 120 MHz |
| DMIPS | 150 |
| Program Flash | 1 MB (2x512 KB dual-bank) |
| SRAM | 160 KB (2x32 KB + 128 KB multi-port) |
| Package | 64-QFN (9x9 mm) with exposed pad |
| Supply Voltage | 1.62 V to 3.6 V |
| Operating Temperature | -40°C to +105°C (industrial extended) |
| USB | USB 2.0 Full-Speed Host/Device/OTG |
| Ethernet | 10/100 EMAC with MII/RMII |
| CAN | 1x CAN 2.0A/B |
| External Bus Interface (EBI) | 16-bit, supports SRAM/NOR/NAND/LCD |
| ADC | 4-channel 16-bit, up to 1 Msps |
| DAC | 1-channel 12-bit |
| Hardware Cryptography | AES, DES, SHA, TRNG |
| RoHS Status | Compliant |
ATSAM4SD16BB-MN Pin Configuration
| Pin 1 | PA0 — GPIO PA0 / PWMH0 / WKUP0 |
| Pin 2 | PA1 — GPIO PA1 / PWML0 |
| Pin 3 | PA2 — GPIO PA2 |
| Pin 4 | PA3 — GPIO PA3 / AD0 |
| Pin 5 | PA4 — GPIO PA4 / AD1 |
| Pin 6 | PA5 — GPIO PA5 / AD2 |
| Pin 7 | PA6 — GPIO PA6 / AD3 |
| Pin 8 | PA7 — GPIO PA7 / AD4 |
| Pin 9 | PA8 — GPIO PA8 / AD5 |
| Pin 10 | PA9 — GPIO PA9 / URXD0 |
| Pin 11 | PA10 — GPIO PA10 / UTXD0 |
| Pin 12 | PA11 — GPIO PA11 |
| Pin 13 | PA12 — GPIO PA12 |
| Pin 14 | PA13 — GPIO PA13 |
| Pin 15 | PA14 — GPIO PA14 |
| Pin 16 | PA15 — GPIO PA15 |
| Pin 17 | VDDIO — I/O supply (1.62-3.6 V) |
| Pin 18 | VSSIO — I/O ground |
| Pin 19 | PB0 — GPIO PB0 / PWMH1 |
| Pin 20 | PB1 — GPIO PB1 / PWML1 |
| Pin 21 | PB2 — GPIO PB2 |
| Pin 22 | PB3 — GPIO PB3 |
| Pin 23 | PB4 — GPIO PB4 |
| Pin 24 | PB5 — GPIO PB5 |
| Pin 25 | PB6 — GPIO PB6 |
| Pin 26 | PB7 — GPIO PB7 |
| Pin 27 | PB8 — GPIO PB8 |
| Pin 28 | PB9 — GPIO PB9 |
| Pin 29 | PB10 — GPIO PB10 |
| Pin 30 | PB11 — GPIO PB11 |
| Pin 31 | PB12 — GPIO PB12 |
| Pin 32 | PB13 — GPIO PB13 |
| Pin 33 | PB14 — GPIO PB14 |
| Pin 34 | PB15 — GPIO PB15 |
| Pin 35 | VDDCORE — Core supply (1.2 V nominal) |
| Pin 36 | VSS — Core ground |
| Pin 37 | PC0 — GPIO PC0 / AD12 |
| Pin 38 | PC1 — GPIO PC1 / AD13 |
| Pin 39 | PC2 — GPIO PC2 / AD14 |
| Pin 40 | PC3 — GPIO PC3 / AD15 |
| Pin 41 | PC4 — GPIO PC4 / TIOA0 |
| Pin 42 | PC5 — GPIO PC5 / TIOB0 |
| Pin 43 | PC6 — GPIO PC6 |
| Pin 44 | PC7 — GPIO PC7 |
| Pin 45 | PC8 — GPIO PC8 |
| Pin 46 | PC9 — GPIO PC9 |
| Pin 47 | PC10 — GPIO PC10 |
| Pin 48 | PC11 — GPIO PC11 |
| Pin 49 | PC12 — GPIO PC12 |
| Pin 50 | PC13 — GPIO PC13 |
| Pin 51 | PC14 — GPIO PC14 |
| Pin 52 | PC15 — GPIO PC15 |
| Pin 53 | PD0 — GPIO PD0 |
| Pin 54 | PD1 — GPIO PD1 |
| Pin 55 | PD2 — GPIO PD2 |
| Pin 56 | PD3 — GPIO PD3 |
| Pin 57 | PD4 — GPIO PD4 |
| Pin 58 | PD5 — GPIO PD5 |
| Pin 59 | PD6 — GPIO PD6 |
| Pin 60 | PD7 — GPIO PD7 |
| Pin 61 | NRST — Reset (active-low) |
| Pin 62 | TST — Test mode (manufacturing) |
| Pin 63 | JTAGSEL — JTAG select |
| Pin 64 | VDDIO — I/O supply (1.62-3.6 V) |
Typical Applications
ATSAM4SD16BB-MN is suitable for 7 applications: Industrial PLC Modules, BLDC / FOC Motor Control, USB Barcode / POS Peripherals, Industrial Ethernet Gateways, Smart Energy Metering, Graphical HMI Panels, IoT Edge Nodes with Crypto.
Industrial PLC Modules
The ATSAM4SD16BB-MN's 120 MHz Cortex-M4 with FPU and DSP extensions handles IEC 61499 function blocks and fast scan-cycle PLC tasks. Its 1 MB dual-bank Flash allows seamless in-field firmware updates with rollback safety. With CAN 2.0, Ethernet MAC, and the 16-bit EBI, a single ATSAM4SD16BB-MN can serve as the master on a backplane with CANopen, Modbus TCP, and parallel I/O expansion. Operating temperature extends to +105°C, suitable for cabinet-edge mounting.
Recommended
BLDC / FOC Motor Control
Field-oriented control of brushless DC motors requires sub-microsecond loop times, which the ATSAM4SD16BB-MN delivers at 120 MHz with FPU-assisted math. The four 16-bit timers drive complementary PWM channels with hardware dead-time insertion, while the 4-channel 16-bit ADC samples phase currents synchronized to the PWM. 1 MB Flash fits FOC firmware plus rotor-position sensorless observers. Extended -40 to +105°C operation supports inverter enclosures.
Recommended
USB Barcode / POS Peripherals
USB 2.0 Full-Speed with OTG enables the ATSAM4SD16BB-MN to act as a USB device or limited host in barcode scanners, POS terminals, and USB peripherals. The 120 MHz core drives image-decoding algorithms while multi-port SRAM isolates USB traffic from CPU/DMA access. Hardware AES/SHA secures payment PIN pads. The 64-QFN footprint fits compact handheld enclosures with the USB PHY on-chip.
Recommended
Industrial Ethernet Gateways
The integrated 10/100 EMAC with MII/RMII lets the ATSAM4SD16BB-MN build protocol-converting gateways (CAN/Ethernet, RS-485/Ethernet, Modbus TCP/RTU) in a single chip. 1 MB Flash holds TLS stacks while AES/SHA/TRNG accelerators offload secure handshakes. Multi-port SRAM buffers 100 Mbit/s line-rate traffic. Hardware watchdog and brown-out are critical for unattended cabinet installations in industrial environments.
Recommended
Smart Energy Metering
Energy meters need a robust 32-bit core with on-chip ADC for multi-channel current sensing and tamper detection. The ATSAM4SD16BB-MN's 4-channel 16-bit ADC at 1 Msps captures Class-0.2 metering accuracy, and 1 MB Flash supports DLMS/COSEM stacks. Hardware AES/SHA secures the meter's credentials. Extended +105°C rating enables outdoor metering enclosures with industrial-grade reliability.
Recommended
Graphical HMI Panels
The 16-bit External Bus Interface (EBI) of the ATSAM4SD16BB-MN connects directly to parallel-TFT LCD controllers and external SRAM for large framebuffers, while 1 MB Flash stores full-color GUI assets and LVGL/firmware. The Cortex-M4 + FPU accelerates image-blending and alpha-mixing for smooth animations. Multi-port SRAM allows pixel data streaming without CPU stalls, ideal for 480x272 or 800x480 panels.
Recommended
IoT Edge Nodes with Crypto
For secure IoT edge devices, the ATSAM4SD16BB-MN's hardware AES, DES, SHA-256, and True Random Number Generator accelerate TLS 1.3 handshakes and secure boot. 1 MB dual-bank Flash supports A/B OTA update firmware images with safe fallback. USB device mode, plus EMAC, gives flexible connectivity, while the +105°C rating enables outdoor deployment of industrial IoT sensors.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM4SD16BB-MN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM4SD16BB-MU | ATSAM4SD16BB-MNR | ATSAM4SD16BA-MUR | ATSAM4SD16BA-MU |
|---|---|---|---|---|---|
| Package | 64-QFN (9x9) | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB |
| Operating Temperature | -40°C to +105°C | -40°C to +85°C | -40°C to +105°C | -40°C to +85°C | -40°C to +85°C |
| Silicon Revision | B | B | B | A | A |
| Packaging Form | Tray | Tray | Tape & Reel | Tape & Reel | Tray |
| Unit Price (qty 100) | $8.38 | $7.80 (approx) | $8.38 (approx) | $7.20 (approx, Rev A discount) | $7.00 (approx, Rev A discount) |
Key Differentiators
- Extended +105°C operating temperature (vs ATSAM4SD16BB-MU)
- Latest Revision B silicon (vs ATSAM4SD16BA-MUR)
- Hardware cryptography accelerators integrated (vs ATSAM4SD16BB-MU)
Design Notes
Estimated: at 120 MHz CPU core with 1.2 V core supply, the ATSAM4SD16BB-MN draws approximately 100-130 mA core current during active execution. The 64-QFN (9x9 mm) package has theta_JA around 24-30 C/W when the exposed thermal pad is soldered to a 4-layer PCB ground plane with thermal vias. For +105°C extended-temperature operation, ensure the PCB thermal pad has at least 9 thermal vias arranged in a 3x3 grid.
Place 100 nF ceramic bypass capacitors within 5 mm of every VDDIO/VDDCORE pin pair, plus one 4.7 uF bulk cap per supply rail. The exposed thermal pad MUST be soldered to a continuous ground copper pour for both electrical ground reference and thermal dissipation. JTAG/SWD traces (TMS, TCK, TDI, TDO, NRST) should be length-matched and isolated from switching-power traces to avoid debugger noise.
Estimated: Brown-out detection and watchdog timer should be enabled in the startup code (typically the SAM4S startup_xxx.c file) for industrial reliability. Failing to lock Flash write-protect registers in firmware allows accidental erasure during application programming. The dual-bank Flash allows safe firmware upgrade only if the bootloader resides in the appropriate bank and the FCWP register is configured correctly.
Estimated: when routing EMAC signals to an external PHY, keep MII/RMII traces under 100 mm, length-matched within 25 mm, and isolated from switching DC-DC converters. The 50 MHz RMII clock is a particularly noise-sensitive signal. Use source termination on the clock line if trace length exceeds 50 mm. The USB DP/DM traces require 90-ohm differential impedance and a clean 3.3 V supply to the on-chip USB PHY.
Compliance Information
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified (industrial-grade only).
