Microchip Technology

ATSAMA5D33A-CUR - 536MHz Cortex-A5 MPU, 324-LFBGA | Microchip

Teilenummer: ATSAMA5D33A-CUR ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
1.2 V Vdss 324-LFBGA (15x15 mm), 0.8 mm pitch Package 536 MHz Speed 160 KB Memory
Ab $8.95 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-09-20
Mengenpreise
Menge Stückpreis Gesamt
1 $13.92 $13,92
10 $12.78 $127,80
100 $11.42 $1.142,00
500 $10.05 $5.025,00
1.000 $8.95 $8.950,00
ℹ️ Alle Preise sind in USD

ATSAMA5D33A-CUR Übersicht

The Microchip ATSAMA5D33A-CUR is a high-performance, ultra-low-power ARM Cortex-A5 microprocessor (MPU) from the SAMA5D3 family, housed in a 324-pin LFBGA (15x15 mm) package. It integrates a single 32-bit Cortex-A5 core running up to 536 MHz with 32 KB each of instruction and data cache, 128 KB internal SRAM, and a hardware floating-point unit. The part operates from a 1.2 V core supply and supports industrial temperature range operation (the "A" suffix).

An ARM Cortex-A5 MPU is a microprocessor unit (as distinct from a microcontroller) that requires external memory and is designed to run a full operating system such as Linux. Within the embedded hierarchy, this positions the SAMA5D3 as a mid-tier application processor above Cortex-M microcontrollers but below Cortex-A53/A72 application processors. It bridges the gap for products that need a graphical UI, networking stack, or file system without the cost of a higher-end applications processor. The MPU category itself sits within the broader taxonomy of system-on-chip (SoC) semiconductors designed for embedded computing.

Key features of the ATSAMA5D33A-CUR include a 128 KB L2 cache, dedicated L1 caches for instruction and data, and an integrated ARM NEON-style media engine (per SAMA5D3 family documentation). The device supports DDR2/LPDDR/LPDDR2 external memory interfaces via the MPDDRC controller, high-speed USB 2.0 with embedded high-speed PHY, dual EMAC Ethernet, and a wide array of peripherals including CAN, HSMCI, SSC, I2S, TWI, SPI, and UART. The variant suffix "A" denotes revision A silicon with industrial-grade temperature support.

The ATSAMA5D33A-CUR is built on a low-power CMOS process with multiple power domains to enable aggressive power gating for battery-powered designs. SAMA5D3 devices typically consume less than 200 mW in active mode at full clock and drop to single-digit mW in low-power retention modes. The integrated NEON media engine accelerates video and audio codecs, while the LCD controller (LCDC) supports up to WXGA resolution panels, enabling cost-effective HMI designs.

Typical applications include human-machine interface (HMI) panels, industrial gateways and PLC controllers, building automation, smart energy and metering terminals, point-of-sale (POS) systems, medical patient monitoring, and connected IoT edge devices running embedded Linux. The wide peripheral set also suits factory automation controllers with real-time Ethernet and fieldbus requirements.

When designing with this MPU, plan the PCB stack-up around the 324-ball LFBGA 0.8 mm pitch package early; trace escape routing and via-in-pad design rules must be factored in before schematic capture. Decoupling the core 1.2 V rail with bulk and high-frequency ceramics placed directly under the BGA is essential for clean power delivery to the high-speed Cortex-A5 core.

This page consolidates distributor pricing, same-brand drop-in SAMA5D3 alternatives, and practical PCB/package design notes that complement the manufacturer datasheet.

Drop-in-Alternativen für ATSAMA5D33A-CUR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit ATSAMA5D33A-CUR (gleiche Bauform und Footprint) – abweichend in Package, Ethernet, USB, Core Architecture, Display Controller.

Microchip Technology
Package: 324-TFBGA, 15x15 mm
Vergleichen mit ATSAMA5D33A-CUR →
Microchip Technology
Package: 324-LFBGA (15x15 mm)
Ethernet: 10/100 MAC (MII/RMII)
USB: 2x HS USB 2.0 (host + device)
Vergleichen mit ATSAMA5D33A-CUR →
Microchip Technology
Package: 324-LFBGA (15 mm x 15 mm)
Ethernet: 2x 10/100/1000 MAC with IEEE 1588
USB: 2x USB 2.0 High-Speed Host + Device
Vergleichen mit ATSAMA5D33A-CUR →
Microchip Technology
Package: 324-LFBGA (15x15 mm, 0.8 mm pitch)
Ethernet: 10/100/1000 Mbps MAC (GMII/RGMII/RMII)
USB: 3x USB 2.0 High-Speed (1 OTG + 2 Host)
Vergleichen mit ATSAMA5D33A-CUR →
Microchip Technology
Package: 324-LFBGA (15 x 15 mm)
Ethernet: 2x 10/100 EMAC (GMAC) with TSN time-stamping
USB: USB 2.0 High-Speed Host + Device
Vergleichen mit ATSAMA5D33A-CUR →
Microchip Technology
Package: 324-pin LFBGA (15x15 mm)
Ethernet: 10/100/1000 Mbps (1x GMAC)
USB: 3x USB 2.0 (2 Host + 1 Device/Host)
Vergleichen mit ATSAMA5D33A-CUR →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

ATSAMA5D33A-CU

✅ Drop-In
Microchip Technology
📦 324-LFBGA (15x15)
ARM Cortex-A5 (32-bit, single core) · 536 MHz · 850 DMIPS · Single-precision hardware (VFPv4) · 128 KB · 32 KB · 32 KB · 160 KB

✓ Auf Lager

$8.95 / Stück

Datenblatt ansehen →

ATSAMA5D31A-CUR

✅ Drop-In
Microchip Technology
📦 324-LFBGA (15x15)
ARM Cortex-A5 (32-bit) with FPU · 536 MHz · 32 KB · 32 KB · 128 KB · 1.2 V (typ) · 1.8 V / 3.3 V · 324-LFBGA (15 mm x 15 mm)

✓ Auf Lager

$12.85 / Stück

Datenblatt ansehen →

ATSAMA5D31A-CU

✅ Drop-In
Microchip Technology
📦 324-LFBGA (15x15)
ARM Cortex-A5 (32-bit) · 536 MHz · 850 DMIPS · 128 KB · 32 KB instruction + 32 KB data · Yes (VFPv4) · Yes · DDR2 / LPDDR / LPDDR2 (16-bit)

✓ Auf Lager

$5.65 / Stück

Datenblatt ansehen →

ATSAMA5D35A-CUR

✅ Drop-In
Microchip Technology
📦 324-LFBGA (15x15)
ARM Cortex-A5 (ARMv7-A) · 1 · 32-bit · 536 MHz · 32 KB · 32 KB · 128 KB · Yes (VFPv4)

✓ Auf Lager

$15 / Stück

Datenblatt ansehen →

ATSAMA5D31A-CFUR

✅ Drop-In
Microchip Technology
📦 324-LFBGA (15x15)
ARM Cortex-A5 (32-bit) · 536 MHz · 1 · 32 KB · 32 KB · 128 KB · Yes (VFPv4 + NEON) · DDR2, LPDDR, LPDDR2 (up to 1 GB)

✓ Auf Lager

$11.65 / Stück

Datenblatt ansehen →

ATSAMA5D33A-CUR Grenzwerte & elektrische Eigenschaften

Core Architecture ARM Cortex-A5 (32-bit)
Number of Cores 1
Maximum CPU Clock 536 MHz
Floating Point Unit Yes (hardware FPU)
L1 Instruction Cache 32 KB
L1 Data Cache 32 KB
Internal SRAM 128 KB
ROM (Boot ROM) 160 KB
Core Supply Voltage 1.2 V
Gehäuse 324-LFBGA (15x15 mm), 0.8 mm pitch
Montageart Surface Mount
External Memory Interface DDR2 / LPDDR / LPDDR2 via MPDDRC
USB USB 2.0 High-Speed with embedded PHY
Ethernet Dual 10/100 EMAC (GMII/RMII/MII)
Display Controller LCDC supporting up to WXGA
RoHS-Status Compliant (per DigiKey listing)

ATSAMA5D33A-CUR 324-lfbga (15x15 mm), 0.8 mm pitch Pinbelegungsleitfaden

Pinbelegung für ATSAMA5D33A-CUR (324-lfbga (15x15 mm), 0.8 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für ATSAMA5D33A-CUR im 324-lfbga (15x15 mm), 0.8 mm pitch-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für ATSAMA5D33A-CUR.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

ATSAMA5D33A-CUR ist geeignet für 7 Anwendungs: Industrial HMI Panels, Industrial Gateways and PLC Controllers, Building Automation Controllers, Medical Patient Monitoring, Smart Energy and Metering Terminals, Point-of-Sale (POS) Terminals, Connected IoT Edge Devices.

🏭

Industrial HMI Panels

The ATSAMA5D33A-CUR suits industrial human-machine interface (HMI) panels because its Cortex-A5 core at 536 MHz with hardware FPU runs embedded Linux graphical stacks (Qt, LVGL) smoothly. Its integrated LCDC supports WXGA panels directly, while 128 KB of internal SRAM accelerates framebuffer compositing without consuming DDR bandwidth. The 324-LFBGA package fits standard 4-6 inch panel controller boards, and dual EMAC ports enable deterministic network connectivity to PLC backbones.

🌐

Industrial Gateways and PLC Controllers

The ATSAMA5D33A-CUR fits industrial gateways because it integrates dual 10/100 Ethernet MACs, USB 2.0 high-speed with embedded PHY, and CAN peripherals needed for fieldbus bridging in a single 324-LFBGA chip. The Cortex-A5 at 536 MHz executes protocol stacks (Modbus TCP, EtherCAT, PROFINET) with headroom, while the MPDDRC controller supports DDR2/LPDDR up to ample capacity for buffering telemetry. Linux support with mainline kernel enables long-term security maintenance for industrial deployments.

🏭

Building Automation Controllers

Building automation controllers benefit from the ATSAMA5D33A-CUR's combination of Cortex-A5 compute, dual Ethernet, and rich peripherals in a 324-LFBGA package. The MPU runs BACnet, KNX, or LonWorks stacks under Linux while driving a local touchscreen via LCDC. Industrial temperature support ("A" suffix) and the part's documented low-power modes let controllers idle during off-hours without missing scheduled events, reducing operating cost in commercial buildings.

💊

Medical Patient Monitoring

Medical patient monitors leverage the ATSAMA5D33A-CUR for its deterministic real-time behavior combined with Linux flexibility. The Cortex-A5 core runs waveform rendering and alarm logic while the integrated LCDC drives bedside displays up to WXGA. Hardware FPU accelerates DSP-style filters for ECG/SPO2 signal processing, and the documented industrial temperature range supports the thermal envelope of clinical equipment housings. Long-term Linux BSP support from Microchip eases FDA documentation of cyber-security maintenance.

⚡

Smart Energy and Metering Terminals

Smart energy meters use the ATSAMA5D33A-CUR because its Cortex-A5 at 536 MHz performs encryption, signed firmware verification, and DLMS/COSEM protocol handling with margin. The dual Ethernet ports support HAN/LAN separation, and the integrated LCDC drives customer-facing displays directly. Industrial temperature range and RoHS compliance meet utility metering standards, while the MPDDRC controller supports tamper-resistant external memory layouts required by revenue-grade meters.

🖥️

Point-of-Sale (POS) Terminals

POS terminals rely on the ATSAMA5D33A-CUR's mix of Cortex-A5 performance, integrated LCDC for cashier and customer-facing displays, and dual Ethernet for store-LAN and payment-processor connectivity. The hardware FPU accelerates price/transaction computations, and USB 2.0 high-speed supports peripherals such as barcode scanners, printers, and PIN pads. The 324-LFBGA package is well-proven in high-volume payment terminals, and Linux BSPs simplify PCI-PTS certification effort.

🧩

Connected IoT Edge Devices

IoT edge devices benefit from the ATSAMA5D33A-CUR's combination of Linux-capable compute and integrated dual Ethernet plus USB for cellular/Wi-Fi module connectivity. The Cortex-A5 at 536 MHz runs containerized workloads (Docker, balenaCloud) and on-device ML inference for predictive maintenance, while the documented low-power modes let battery-powered sensors sleep between transmissions. The 324-LFBGA package suits compact edge gateway form factors with strict size constraints.

What is the maximum CPU clock speed of the ATSAMA5D33A-CUR?
The ATSAMA5D33A-CUR runs the ARM Cortex-A5 core at up to 536 MHz. According to the Microchip SAMA5D3 datasheet, the Cortex-A5 includes a hardware floating-point unit and NEON media engine, and is paired with 32 KB each of L1 instruction and data caches plus 128 KB on-chip SRAM. This places the MPU firmly in the mid-performance embedded Linux category.
How much on-chip memory does the ATSAMA5D33A-CUR have?
The ATSAMA5D33A-CUR integrates 128 KB of internal SRAM and 160 KB of boot ROM. The L1 cache is split into 32 KB instruction and 32 KB data caches, while external DDR2/LPDDR/LPDDR2 is supported via the multi-port DDR controller. This combination allows fast deterministic access to critical code while offloading bulk memory to the external DRAM.
Does the ATSAMA5D33A-CUR run Linux?
Yes. The ATSAMA5D33A-CUR is a microprocessor unit (MPU) designed to run a full operating system such as Linux, with Microchip providing a mainline-supported BSP and buildroot/Yocto layers. The integrated peripherals (Ethernet, USB HS, LCD controller) and external DRAM interface provide the I/O and memory bandwidth needed for graphical Linux applications, networking stacks, and file systems.
What package does the ATSAMA5D33A-CUR use?
The ATSAMA5D33A-CUR uses a 324-pin LFBGA package measuring 15x15 mm with 0.8 mm ball pitch. PCB layout for this package requires via-in-pad or dog-bone fan-out and a controlled-impedance stack-up; plan escape routing during schematic capture rather than as a layout afterthought to avoid costly respins.
Where can I buy the ATSAMA5D33A-CUR and what is the price?
The ATSAMA5D33A-CUR is in stock at DigiKey, Mouser, Heisener, Hotenda, and other authorized distributors, with unit pricing starting at approximately $13.92 each at qty 1 as of 2026-09-21. Bulk discounts are available at 100, 500, and 1000-piece breaks; lead time for larger orders is typically 10-14 weeks per distributor listings. Check distributor real-time stock for current availability.
What is the lead time for ATSAMA5D33A-CUR orders?
The ATSAMA5D33A-CUR ships from multiple authorized distributors with stock on hand; small quantities typically ship within 1-2 business days from in-stock inventory, while larger production orders have a factory lead time of approximately 10 weeks per the Heisener listing. For long-term supply assurance, confirm RoHS/REACH compliance certificates and request a fixed-ship date before issuing a purchase order.
ATSAMA5D33A-CUR vs ATSAMA5D31A-CUR - which is better for industrial HMI?
Both ATSAMA5D33A-CUR and ATSAMA5D31A-CUR share the 324-LFBGA package, Cortex-A5 core at 536 MHz, and LCDC, but the ATSAMA5D33A-CUR adds an LCD controller with higher resolution and richer peripherals per the SAMA5D3 datasheet. For WXGA HMI panels with larger memory needs, choose ATSAMA5D33A-CUR; for cost-optimized QVGA/WVGA displays with lower peripheral count, the ATSAMA5D31A-CUR is sufficient.
ATSAMA5D33A-CUR vs ATSAMA5D35A-CUR - what is the difference?
The ATSAMA5D35A-CUR adds CAN FD and enhanced cryptography (hardware accelerator) compared with the ATSAMA5D33A-CUR, while both retain the same 324-LFBGA package and 536 MHz Cortex-A5 core. If your design needs CAN FD for automotive or industrial networks, choose the ATSAMA5D35A-CUR; for general-purpose HMI without CAN FD, the ATSAMA5D33A-CUR is the more cost-effective drop-in.
When should I choose the ATSAMA5D33A-CUR over the ATSAMA5D28C-LD1G-CUR?
Choose the ATSAMA5D33A-CUR when you need the 324-LFBGA package and a higher-performance Cortex-A5 MPU with the SAMA5D3 peripheral set. Choose the ATSAMA5D28C-LD1G-CUR if your design requires the lower-power SAMA5D2 family with deeper low-power retention modes for battery-driven products. They are NOT drop-in alternatives because the packages and pinouts differ.
What is the best drop-in replacement for the ATSAMA5D33A-CUR?
The best drop-in replacement for the ATSAMA5D33A-CUR is the ATSAMA5D33A-CU, which uses the identical 324-LFBGA package and die but ships in tray packaging instead of tape-and-reel. Per the FindIC comparison, both parts share the same performance characteristics and are fully pin-compatible, requiring no circuit modification when swapping reel for tray.
Can the ATSAMA5D31A-CUR replace the ATSAMA5D33A-CUR?
Yes, the ATSAMA5D31A-CUR is a SAMA5D3 family member in the same 324-LFBGA package and is a pin-compatible alternative, but it offers a reduced peripheral set and lower memory bandwidth. Check the SAMA5D3 datasheet carefully: if your design only uses the peripherals present on the SAMA5D31, it can be a drop-in; otherwise verify the missing peripherals in your BOM.
Where to download the ATSAMA5D33A-CUR datasheet PDF?
The official ATSAMA5D33A-CUR datasheet PDF is available from the Microchip product page at https://www.microchip.com/en-us/product/ATSAMA5D33. Third-party mirrors are also hosted on datasheets.com, hotenda, and findic.us, but always cross-reference with the Microchip original to ensure the latest revision is used in your design.
Where can I find the ATSAMA5D33A-CUR pinout and ball map?
The ATSAMA5D33A-CUR pinout and 324-LFBGA ball map are in the SAMA5D3 datasheet package chapter, available as a PDF from the Microchip product page. The package is 15x15 mm with 0.8 mm pitch in a 18x18 ball grid (with corner balls removed per LFBGA convention); refer to the package outline drawing for exact A1 orientation and pin-1 marker.
What are the key specifications engineers should know about the ATSAMA5D33A-CUR?
The ATSAMA5D33A-CUR integrates a 32-bit ARM Cortex-A5 core at up to 536 MHz with hardware FPU, 32 KB L1 I-cache, 32 KB L1 D-cache, 128 KB on-chip SRAM, 160 KB boot ROM, and a multi-port DDR2/LPDDR/LPDDR2 controller. The 324-LFBGA package includes USB 2.0 high-speed PHY, dual 10/100 Ethernet MACs, LCD controller, CAN, HSMCI, SSC, I2S, TWI, SPI, and UART, with a 1.2 V core supply and industrial temperature range.
Is there a Microchip ATSAMA5D33A-CUR equivalent from another brand?
There is no fully drop-in second-source for the ATSAMA5D33A-CUR because the 324-LFBGA pinout and peripheral set are Microchip-proprietary to the SAMA5D3 family. Functional alternatives from other vendors (NXP i.MX 6, TI Sitara AM335x, ST STM32MP1) share the Cortex-A5/A8/A9 class and Linux support but require PCB redesign because packages and pinouts differ; they are NOT drop-in replacements.

Technische Referenzdaten für ATSAMA5D33A-CUR – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the ATSAMA5D33A-CUR when you need an industrial-temperature, Linux-capable ARM Cortex-A5 MPU at 536 MHz with the full SAMA5D3 peripheral set in the standard 324-LFBGA 15x15 mm package. It is the canonical choice for HMI panels, industrial gateways, and POS terminals where the LCDC, dual Ethernet, and USB high-speed are all needed simultaneously. Choose the ATSAMA5D33A-CU only if you specifically need tray packaging for low-volume prototyping. Choose the ATSAMA5D31A-CUR for cost-down BOMs that do not need the full peripheral set. Choose the ATSAMA5D35A-CUR if CAN FD or hardware cryptographic modules are mandatory. Avoid the lower-power SAMA5D2 family unless your design is battery-driven and needs sub-100 uW retention.

Vergleich mit Alternativen

Parameter Dieses Produkt ATSAMA5D33A-CU ATSAMA5D31A-CUR ATSAMA5D31A-CU ATSAMA5D35A-CUR ATSAMA5D31A-CFUR
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 324-LFBGA (15x15) 324-LFBGA (15x15) - same 324-LFBGA (15x15) - same 324-LFBGA (15x15) - same 324-LFBGA (15x15) - same 324-LFBGA (15x15) - same
Core Cortex-A5 536 MHz Cortex-A5 536 MHz Cortex-A5 536 MHz Cortex-A5 536 MHz Cortex-A5 536 MHz Cortex-A5 536 MHz
Internal SRAM 128 KB 128 KB 128 KB 128 KB 128 KB 128 KB
CAN FD No No No No Yes No
Hardware Crypto No No No No Yes No
Packaging Format Tape & Reel Tray Tape & Reel Tray Tape & Reel Tape & Reel (extended code)

Wichtigste Unterscheidungsmerkmale

  • Industrial-grade silicon revision with documented low-power modes (vs. ATSAMA5D33A-CU)
  • Cost-down path within the same 324-LFBGA footprint (vs. ATSAMA5D31A-CUR)
  • Clear upgrade path to CAN FD and security without PCB redesign (vs. ATSAMA5D35A-CUR)

Designhinweise

Estimated: the 324-LFBGA package with 0.8 mm ball pitch requires either via-in-pad (VIPPO) or dog-bone fan-out escape routing. Plan the PCB stack-up early - typical designs use 4-6 layer stack-ups with microvias; signal layers should be placed adjacent to the BGA fan-out to minimize via stubs. Set controlled impedance for DDR2/LPDDR traces (target 50 ohm single-ended) before schematic capture to avoid costly layout respins.

Decouple the 1.2 V core rail with a combination of bulk and high-frequency ceramic capacitors placed directly under the BGA. Use at least one 22 uF bulk cap plus 0.1 uF + 1 nF high-frequency ceramics within 5 mm of the supply balls. Separate analog and digital ground planes where possible, joining at a single point near the MPU to avoid ground-loop noise coupling into the DDR interface.

Estimated: at 536 MHz worst-case active, the SAMA5D3 MPU typically dissipates 200-500 mW depending on peripheral use; with the 324-LFBGA package, thermal resistance is dominated by PCB copper area. Design with at least 4 thermal via arrays under the BGA thermal balls and connect to internal ground planes; for industrial-temperature designs, ensure the junction-to-ambient rise stays below 30 C at maximum sustained load to preserve operating margin.

Verify boot mode strapping resistors BEFORE first prototype bring-up - the SAMA5D3 boots from NAND, SPI flash, SD card, or UART depending on BMS pin state. Mixed-voltage peripherals (3.3 V I/O on a 1.8 V DDR rail) require level shifters; do not assume 3.3 V tolerance on DDR pins. Also confirm the DDR2/LPDDR initialization sequence in the BSP matches your memory vendor's timing parameters to avoid intermittent boot failures.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS and REACH compliance per Microchip product page. AEC-Q100 not applicable - this is an industrial-grade MPU, not an automotive-qualified part.

Daten verifiziert am: 2026-09-21 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Microchip Technology ATSAMA5D33A-CUR ATSAMA5D33A-CU ATSAMA5D31A-CUR ATSAMA5D31A-CU ATSAMA5D35A-CUR ATSAMA5D31A-CFUR ARM Cortex-A5 MPU microprocessor unit microcontroller system-on-chip 324-LFBGA BGA package family surface mount LPDDR DDR2 LCDC EMAC USB 2.0 CAN FD hardware floating-point unit NEON media engine Linux BSP RoHS industrial temperature range HMI panel industrial gateway POS terminal IoT edge device embedded Linux mainline kernel
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