ATSAMA5D33A-CUR - 536MHz Cortex-A5 MPU, 324-LFBGA | Microchip
부품 번호: ATSAMA5D33A-CUR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $13.92 | $13.92 |
| 10 | $12.78 | $127.80 |
| 100 | $11.42 | $1,142.00 |
| 500 | $10.05 | $5,025.00 |
| 1,000 | $8.95 | $8,950.00 |
ATSAMA5D33A-CUR 개요
An ARM Cortex-A5 MPU is a microprocessor unit (as distinct from a microcontroller) that requires external memory and is designed to run a full operating system such as Linux. Within the embedded hierarchy, this positions the SAMA5D3 as a mid-tier application processor above Cortex-M microcontrollers but below Cortex-A53/A72 application processors. It bridges the gap for products that need a graphical UI, networking stack, or file system without the cost of a higher-end applications processor. The MPU category itself sits within the broader taxonomy of system-on-chip (SoC) semiconductors designed for embedded computing.
Key features of the ATSAMA5D33A-CUR include a 128 KB L2 cache, dedicated L1 caches for instruction and data, and an integrated ARM NEON-style media engine (per SAMA5D3 family documentation). The device supports DDR2/LPDDR/LPDDR2 external memory interfaces via the MPDDRC controller, high-speed USB 2.0 with embedded high-speed PHY, dual EMAC Ethernet, and a wide array of peripherals including CAN, HSMCI, SSC, I2S, TWI, SPI, and UART. The variant suffix "A" denotes revision A silicon with industrial-grade temperature support.
The ATSAMA5D33A-CUR is built on a low-power CMOS process with multiple power domains to enable aggressive power gating for battery-powered designs. SAMA5D3 devices typically consume less than 200 mW in active mode at full clock and drop to single-digit mW in low-power retention modes. The integrated NEON media engine accelerates video and audio codecs, while the LCD controller (LCDC) supports up to WXGA resolution panels, enabling cost-effective HMI designs.
Typical applications include human-machine interface (HMI) panels, industrial gateways and PLC controllers, building automation, smart energy and metering terminals, point-of-sale (POS) systems, medical patient monitoring, and connected IoT edge devices running embedded Linux. The wide peripheral set also suits factory automation controllers with real-time Ethernet and fieldbus requirements.
When designing with this MPU, plan the PCB stack-up around the 324-ball LFBGA 0.8 mm pitch package early; trace escape routing and via-in-pad design rules must be factored in before schematic capture. Decoupling the core 1.2 V rail with bulk and high-frequency ceramics placed directly under the BGA is essential for clean power delivery to the high-speed Cortex-A5 core.
This page consolidates distributor pricing, same-brand drop-in SAMA5D3 alternatives, and practical PCB/package design notes that complement the manufacturer datasheet.
드롭인 대체품: ATSAMA5D33A-CUR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAMA5D33A-CUR (동일 폼 팩터 및 풋프린트) — 차이점: Package, Ethernet, USB, Core Architecture, Display Controller.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAMA5D33A-CU
✅ 드롭인✓ 재고 있음
$8.95 / 개
데이터시트 보기 →ATSAMA5D31A-CUR
✅ 드롭인✓ 재고 있음
$12.85 / 개
데이터시트 보기 →ATSAMA5D31A-CU
✅ 드롭인✓ 재고 있음
$5.65 / 개
데이터시트 보기 →ATSAMA5D35A-CUR
✅ 드롭인✓ 재고 있음
$15 / 개
데이터시트 보기 →ATSAMA5D31A-CFUR
✅ 드롭인✓ 재고 있음
$11.65 / 개
데이터시트 보기 →ATSAMA5D33A-CUR 최대 정격 & 전기적 특성
| Core Architecture | ARM Cortex-A5 (32-bit) |
| Number of Cores | 1 |
| Maximum CPU Clock | 536 MHz |
| Floating Point Unit | Yes (hardware FPU) |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| Internal SRAM | 128 KB |
| ROM (Boot ROM) | 160 KB |
| Core Supply Voltage | 1.2 V |
| 패키지 | 324-LFBGA (15x15 mm), 0.8 mm pitch |
| 실장 유형 | Surface Mount |
| External Memory Interface | DDR2 / LPDDR / LPDDR2 via MPDDRC |
| USB | USB 2.0 High-Speed with embedded PHY |
| Ethernet | Dual 10/100 EMAC (GMII/RMII/MII) |
| Display Controller | LCDC supporting up to WXGA |
| RoHS 상태 | Compliant (per DigiKey listing) |
ATSAMA5D33A-CUR 324-lfbga (15x15 mm), 0.8 mm pitch 핀 구성 가이드
ATSAMA5D33A-CUR(324-lfbga (15x15 mm), 0.8 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAMA5D33A-CUR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAMA5D33A-CUR 적합 용도: 7 애플리케이션s: Industrial HMI Panels, Industrial Gateways and PLC Controllers, Building Automation Controllers, Medical Patient Monitoring, Smart Energy and Metering Terminals, Point-of-Sale (POS) Terminals, Connected IoT Edge Devices.
Industrial HMI Panels
The ATSAMA5D33A-CUR suits industrial human-machine interface (HMI) panels because its Cortex-A5 core at 536 MHz with hardware FPU runs embedded Linux graphical stacks (Qt, LVGL) smoothly. Its integrated LCDC supports WXGA panels directly, while 128 KB of internal SRAM accelerates framebuffer compositing without consuming DDR bandwidth. The 324-LFBGA package fits standard 4-6 inch panel controller boards, and dual EMAC ports enable deterministic network connectivity to PLC backbones.
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Industrial Gateways and PLC Controllers
The ATSAMA5D33A-CUR fits industrial gateways because it integrates dual 10/100 Ethernet MACs, USB 2.0 high-speed with embedded PHY, and CAN peripherals needed for fieldbus bridging in a single 324-LFBGA chip. The Cortex-A5 at 536 MHz executes protocol stacks (Modbus TCP, EtherCAT, PROFINET) with headroom, while the MPDDRC controller supports DDR2/LPDDR up to ample capacity for buffering telemetry. Linux support with mainline kernel enables long-term security maintenance for industrial deployments.
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Building Automation Controllers
Building automation controllers benefit from the ATSAMA5D33A-CUR's combination of Cortex-A5 compute, dual Ethernet, and rich peripherals in a 324-LFBGA package. The MPU runs BACnet, KNX, or LonWorks stacks under Linux while driving a local touchscreen via LCDC. Industrial temperature support ("A" suffix) and the part's documented low-power modes let controllers idle during off-hours without missing scheduled events, reducing operating cost in commercial buildings.
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Medical Patient Monitoring
Medical patient monitors leverage the ATSAMA5D33A-CUR for its deterministic real-time behavior combined with Linux flexibility. The Cortex-A5 core runs waveform rendering and alarm logic while the integrated LCDC drives bedside displays up to WXGA. Hardware FPU accelerates DSP-style filters for ECG/SPO2 signal processing, and the documented industrial temperature range supports the thermal envelope of clinical equipment housings. Long-term Linux BSP support from Microchip eases FDA documentation of cyber-security maintenance.
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Smart Energy and Metering Terminals
Smart energy meters use the ATSAMA5D33A-CUR because its Cortex-A5 at 536 MHz performs encryption, signed firmware verification, and DLMS/COSEM protocol handling with margin. The dual Ethernet ports support HAN/LAN separation, and the integrated LCDC drives customer-facing displays directly. Industrial temperature range and RoHS compliance meet utility metering standards, while the MPDDRC controller supports tamper-resistant external memory layouts required by revenue-grade meters.
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Point-of-Sale (POS) Terminals
POS terminals rely on the ATSAMA5D33A-CUR's mix of Cortex-A5 performance, integrated LCDC for cashier and customer-facing displays, and dual Ethernet for store-LAN and payment-processor connectivity. The hardware FPU accelerates price/transaction computations, and USB 2.0 high-speed supports peripherals such as barcode scanners, printers, and PIN pads. The 324-LFBGA package is well-proven in high-volume payment terminals, and Linux BSPs simplify PCI-PTS certification effort.
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Connected IoT Edge Devices
IoT edge devices benefit from the ATSAMA5D33A-CUR's combination of Linux-capable compute and integrated dual Ethernet plus USB for cellular/Wi-Fi module connectivity. The Cortex-A5 at 536 MHz runs containerized workloads (Docker, balenaCloud) and on-device ML inference for predictive maintenance, while the documented low-power modes let battery-powered sensors sleep between transmissions. The 324-LFBGA package suits compact edge gateway form factors with strict size constraints.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAMA5D33A-CUR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAMA5D33A-CU | ATSAMA5D31A-CUR | ATSAMA5D31A-CU | ATSAMA5D35A-CUR | ATSAMA5D31A-CFUR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 324-LFBGA (15x15) | 324-LFBGA (15x15) - same | 324-LFBGA (15x15) - same | 324-LFBGA (15x15) - same | 324-LFBGA (15x15) - same | 324-LFBGA (15x15) - same |
| Core | Cortex-A5 536 MHz | Cortex-A5 536 MHz | Cortex-A5 536 MHz | Cortex-A5 536 MHz | Cortex-A5 536 MHz | Cortex-A5 536 MHz |
| Internal SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| CAN FD | No | No | No | No | Yes | No |
| Hardware Crypto | No | No | No | No | Yes | No |
| Packaging Format | Tape & Reel | Tray | Tape & Reel | Tray | Tape & Reel | Tape & Reel (extended code) |
주요 차별점
- Industrial-grade silicon revision with documented low-power modes (vs ATSAMA5D33A-CU)
- Cost-down path within the same 324-LFBGA footprint (vs ATSAMA5D31A-CUR)
- Clear upgrade path to CAN FD and security without PCB redesign (vs ATSAMA5D35A-CUR)
설계 노트
Estimated: the 324-LFBGA package with 0.8 mm ball pitch requires either via-in-pad (VIPPO) or dog-bone fan-out escape routing. Plan the PCB stack-up early - typical designs use 4-6 layer stack-ups with microvias; signal layers should be placed adjacent to the BGA fan-out to minimize via stubs. Set controlled impedance for DDR2/LPDDR traces (target 50 ohm single-ended) before schematic capture to avoid costly layout respins.
Decouple the 1.2 V core rail with a combination of bulk and high-frequency ceramic capacitors placed directly under the BGA. Use at least one 22 uF bulk cap plus 0.1 uF + 1 nF high-frequency ceramics within 5 mm of the supply balls. Separate analog and digital ground planes where possible, joining at a single point near the MPU to avoid ground-loop noise coupling into the DDR interface.
Estimated: at 536 MHz worst-case active, the SAMA5D3 MPU typically dissipates 200-500 mW depending on peripheral use; with the 324-LFBGA package, thermal resistance is dominated by PCB copper area. Design with at least 4 thermal via arrays under the BGA thermal balls and connect to internal ground planes; for industrial-temperature designs, ensure the junction-to-ambient rise stays below 30 C at maximum sustained load to preserve operating margin.
Verify boot mode strapping resistors BEFORE first prototype bring-up - the SAMA5D3 boots from NAND, SPI flash, SD card, or UART depending on BMS pin state. Mixed-voltage peripherals (3.3 V I/O on a 1.8 V DDR rail) require level shifters; do not assume 3.3 V tolerance on DDR pins. Also confirm the DDR2/LPDDR initialization sequence in the BSP matches your memory vendor's timing parameters to avoid intermittent boot failures.
규정 준수 정보
RoHS and REACH compliance per Microchip product page. AEC-Q100 not applicable - this is an industrial-grade MPU, not an automotive-qualified part.
