ATSAMB11-XR210PA - Bluetooth SiP Module w/ Antenna | Microchip
Teilenummer: ATSAMB11-XR210PA ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $8.2 | $8,20 |
| 10 | $7.65 | $76,50 |
| 100 | $6.95 | $695,00 |
| 500 | $6.4 | $3.200,00 |
| 1.000 | $5.85 | $5.850,00 |
ATSAMB11-XR210PA Übersicht
What is a Bluetooth SiP module? A Bluetooth SiP (System-in-Package) module is a pre-certified wireless module that integrates the RF transceiver, baseband processor, microcontroller, passives, and antenna into a single surface-mount package. Compared to discrete Bluetooth SoC designs, an SiP module reduces BOM count, eliminates RF layout complexity, and shortens time-to-market by bundling modular regulatory pre-certification. SiP modules sit within the broader category of wireless modules, which are themselves a subset of RF & Wireless connectivity products.
Key features include integrated BLE 4.1 stack support, embedded ARM Cortex-M0 core, on-module crystal and passive components, and a top-mounted chip antenna (XR variant). The module provides GPIO and standard peripheral interfaces from the underlying ATSAMB11 die, simplifying host-MCU integration. The pre-certified RF section eliminates costly FCC/ETSI/IC certification cycles for the OEM.
The ATSAMB11 SiP module uses a QFN-style SiP substrate, with the chip antenna mounted on top of the SiP, providing an omnidirectional radiation pattern optimized for 2402-2480 MHz BLE operation. The die-down configuration places the RF shielding and antenna trace stack-up to deliver consistent RF performance across end-product enclosures, supporting indoor range up to 30 m line-of-sight.
Typical applications include wearable fitness devices, smart-home sensors and beacons, BLE proximity tags, industrial wireless sensor nodes, and remote controls. The integrated antenna variant (XR) is ideal when external antenna connectors are not feasible due to enclosure constraints or cost targets. Use the MR variant when an external antenna is preferred for tuned radiation.
When designing with this device, follow Microchip's reference layout for the host PCB keep-out region beneath the SiP to preserve antenna gain. Confirm regulatory certifications for the target geographies, and verify the host enclosure does not attenuate the BLE signal in the 2.4 GHz band.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet to help engineers evaluate the ATSAMB11-XR210PA for production deployment.
Drop-in-Alternativen für ATSAMB11-XR210PA – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit ATSAMB11-XR210PA (gleiche Bauform und Footprint) – abweichend in Module Type, Antenna, Frequency Band, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
ATSAMB11-XR2100A
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$6.48 / Stück
Datenblatt ansehen →ATSAMB11-ZR210PA
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
ATSAMB11-MR210CA
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$6.85 / Stück
Datenblatt ansehen →ATSAMB11-XR210UA
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
CYBLE-222005-00
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ATSAMB11-XR210PA Spezifikationen (herstellerveröffentlicht)
| Product Type | RF System on a Chip / Module (SoC) |
| Bluetooth Specification | Bluetooth 4.1 Low Energy (BLE) |
| Operating Frequency | 2.402 GHz to 2.480 GHz (ISM band) |
| Antenna Configuration | Integrated chip antenna (mounted on top of SiP) |
| Core Processor | ARM Cortex-M0 |
| Module Type | SmartConnect ATSAMB11 SiP Module |
| Package Type | SiP Module, surface mount |
| RF Modulation | GFSK |
| Montageart | Surface Mount |
| RoHS-Status | ROHS3 Compliant |
| Stock Quantity (Full-Electronic) | 4187 units |
ATSAMB11-XR210PA Schnittstellen & Anschlüsse
ATSAMB11-XR210PA bietet die folgenden, vom Hersteller veröffentlichten Schnittstellen und Anschlüsse: Bluetooth. Pinbelegung der Erweiterungsheader, Nummerierung der Anschlüsse und elektrische Grenzwerte sind in der Herstellerdokumentation definiert.
| Bluetooth | Bluetooth 4.1 Low Energy (BLE) |
Siehe die Herstellerdokumentation für die vollständige Pinbelegung der Erweiterungsleiste und die Nummerierung der Steckverbinder-Pins.
Typische Anwendungen
ATSAMB11-XR210PA ist geeignet für 6 Anwendungs: Wearable Fitness Bands, BLE Beacons and Proximity Tags, Smart Home Sensors, Industrial Wireless Sensor Nodes, BLE Remote Controls, Medical and Health Monitoring Devices.
Wearable Fitness Bands
The ATSAMB11-XR210PA's integrated chip antenna and BLE 4.1 low-energy stack make it ideal for wearable fitness bands where PCB real estate is severely constrained. With the 2.4 GHz chip antenna mounted directly on the SiP, designers eliminate the host antenna trace and keep-out zone, fitting the radio into sub-30 mm wristband enclosures. The ARM Cortex-M0 core handles BLE stack, heart-rate sensor I2C readouts, and step-counting algorithms in a single low-power MCU. Per Microchip's SmartConnect portfolio guidance, the module achieves months of battery life on a coin cell when paired with efficient sensor duty-cycling, making it a strong fit for always-on fitness wearables targeting consumer retail price points.
Empfohlen
BLE Beacons and Proximity Tags
The ATSAMB11-XR210PA suits BLE beacon and proximity-tag deployments because the integrated chip antenna delivers consistent omnidirectional radiation for indoor positioning and retail analytics use cases. The BLE 4.1 advertising-only operation draws minimal current, allowing beacons to run for 1-2 years on a CR2032 coin cell with appropriate firmware tuning. The SiP module eliminates antenna matching complexity on the host PCB, accelerating time-to-market for iBeacon/Eddystone compatible tags deployed in retail, museums, and asset-tracking applications. Engineers designing multi-vendor beacon fleets benefit from Microchip's documented BLE stack and reference advertising firmware.
Empfohlen
Smart Home Sensors
The ATSAMB11-XR210PA enables compact smart-home sensor nodes (temperature, humidity, motion, door/window contact) that communicate with a central BLE gateway or directly with consumer smartphones. The integrated chip antenna simplifies enclosure design for wall-mounted or battery-powered sensors where an external antenna is impractical. The module's ARM Cortex-M0 core can host both the BLE stack and application sensor logic, eliminating the need for a separate host MCU in low-complexity designs. Microchip's pre-certified modular approval helps OEMs ship FCC/ETSI-compliant smart-home products without in-house RF certification costs.
Empfohlen
Industrial Wireless Sensor Nodes
The ATSAMB11-XR210PA serves industrial wireless sensor nodes where cable-free installation simplifies deployment in factories, warehouses, and process plants. The chip-antenna SiP supports up to 30 m line-of-sight indoor range, suitable for plant-floor sensor telemetry to a BLE gateway or edge controller. The module's surface-mount SiP form factor withstands industrial vibration and shock better than cabled antenna solutions. Engineers can leverage Microchip's BLE stack and documented API to implement custom industrial protocols on top of the standard GATT services, enabling integration with PLCs and SCADA systems via BLE-to-Ethernet gateways.
Empfohlen
BLE Remote Controls
The ATSAMB11-XR210PA is well matched to BLE remote controls for smart TVs, set-top boxes, audio equipment, and consumer electronics where a pointing antenna and battery-powered operation are required. The chip antenna's omnidirectional pattern eliminates the need for precise remote orientation, improving end-user experience. The low-power BLE 4.1 link supports months of battery life on standard AAA cells, and the integrated Cortex-M0 can handle custom HID descriptors and pairing flows without an external MCU. Compared to legacy IR remotes, BLE provides two-way communication, voice command support, and reliable non-line-of-sight operation.
Empfohlen
Medical and Health Monitoring Devices
The ATSAMB11-XR210PA's compact SiP form factor and low-power BLE 4.1 operation support portable medical and health-monitoring devices such as pulse oximeters, glucose meters, and connected thermometers. The chip antenna's small footprint allows medical-device designers to fit the radio into handheld enclosures previously dominated by IrDA or wired interfaces. The pre-certified modular approval shortens FDA/CE submission timelines for connected medical devices by inheriting the BLE radio certification. Note: medical applications typically require additional IEC 60601 compliance and risk-analysis beyond the BLE radio certification.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für ATSAMB11-XR210PA – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | ATSAMB11-XR2100A | ATSAMB11-ZR210PA | ATSAMB11-MR210CA | ATSAMB11-XR210UA | CYBLE-222005-00 |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Infineon (Cypress) |
| Package | SiP Module (integrated chip antenna) | SiP Module (chip antenna) - same family | SiP Module - same family | SiP Module (external antenna) | SiP Module (U.FL connector) | BLE Module SiP |
| Bluetooth Specification | BLE 4.1 | BLE 4.1 | BLE 5 | BLE 4.1 | BLE 4.1 | BLE 4.2 |
| Operating Frequency | 2.402-2.480 GHz | 2.402-2.480 GHz | 2.402-2.480 GHz | 2.402-2.480 GHz | 2.402-2.480 GHz | 2.402-2.480 GHz |
| Core Processor | ARM Cortex-M0 | ARM Cortex-M0 | ARM Cortex-M0 | ARM Cortex-M0 | ARM Cortex-M0 | ARM Cortex-M0 (PSoC 4) |
| Antenna Type | Integrated chip antenna (top-mounted) | Integrated chip antenna | Integrated chip antenna | External antenna connector | U.FL antenna connector | Integrated chip antenna |
| RoHS Compliance | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS Compliant |
Wichtigste Unterscheidungsmerkmale
- Integrated chip antenna eliminates host antenna design (vs. ATSAMB11-MR210CA)
- Pre-certified modular regulatory approval (vs. CYBLE-222005-00)
- ARM Cortex-M0 core with on-module BLE stack (vs. Discrete BLE SoC designs)
Designhinweise
Preserve the antenna keep-out zone directly beneath and around the ATSAMB11-XR210PA per Microchip's reference layout. The chip antenna's radiation pattern is sensitive to ground plane proximity; place no copper, traces, or components within the documented keep-out region (typically the entire SiP footprint plus 5 mm perimeter). Avoid mounting the SiP near metal enclosures, battery contacts, or display ground planes, which detune the antenna and reduce BLE link range. A plastic or low-loss enclosure material above the SiP is recommended.
Estimated: at typical BLE advertising intervals (e.g., 1 s, 0 dBm TX), average current draw is in the single-digit microampere range with peaks around 5-10 mA during TX bursts. Decouple VDD with a 1 uF ceramic capacitor close to the SiP power pin and a 100 nF for high-frequency noise. Power-rail sequencing is not required, but the BLE radio is sensitive to supply ripple; use a low-noise LDO (e.g., 50-100 uVrms) rather than a switching converter directly on the SiP supply.
Common pitfalls: (1) Do not place the SiP at the edge of the host PCB without maintaining the antenna keep-out - range will degrade by 50%+. (2) Do not assume BLE 4.1 supports Mesh or Long Range - those require BLE 5.0 silicon. (3) The integrated chip antenna cannot be re-tuned by the OEM; the matching network is internal to the SiP. (4) Verify the host enclosure does not enclose the SiP in metal. (5) Confirm regulatory modular approval listings for the exact country before shipping.
Compliance-Informationen
ROHS3 Compliant per Full-Electronic product listing. AEC-Q100 not applicable for wireless module. REACH/halogen-free/conflict-mineral status not stated in verified web data.
