HF-Module
Produkte (174)
88MW32X - 802.11n Wi-Fi Cortex-M4F MCU SoC | NXP
The NXP Semiconductors 88MW32X (88MW320/322) is a highly integrated, low-power 802.11n Wi-Fi microcontroller system-on-chip combining an Arm Cortex-M4F core running up to 200 MHz with 802.11 b/g/n Wi-Fi connectivity in a single 88-pin QFN (10x10 mm) package. The device targets ultra-low system cost and low-power operation for smart devices, home and industrial automation, smart accessories, and smart energy applications. According to the NXP product page, the SoC is built using an Arm Cortex-M4F CPU and 802.11 b/g/n Wi-Fi silicon, with last updated Feb 5, 2026 per the manufacturer datasheet. A Wi-Fi microcontroller SoC is a single-die device that integrates an applications microprocessor, memory, peripherals, and a wireless baseband/MAC/RF transceiver onto one chip. It sits within the embedded wireless SoC taxonomy as microcontroller -> wireless microcontroller -> Wi-Fi SoC -> RF system-on-chip. This integration eliminates the traditional two-chip Wi-Fi module (host MCU + companion Wi-Fi chipset), shrinking BOM cost, reducing PCB footprint, and simplifying firmware bring-up versus discrete designs. Key features of the 88MW32X include Arm Cortex-M4F core with DSP extensions and FPU, integrated 802.11 b/g/n Wi-Fi radio with on-chip power amplifier and RF matching, hardware cryptographic engines for secure boot and link encryption, integrated SRAM and flash, and low-power deep-sleep modes suitable for battery-powered always-on IoT nodes. The device supports a host of peripheral interfaces typical of Cortex-M4F-class MCUs for sensor aggregation and user I/O. The 88MW32X is designed to operate from a single 3.3 V supply rail, integrating the oscillator's power-architecture and radio BOM. It supports Wi-Fi station, AP, and P2P modes and integrates the oscillator's RF and passive networking stacks, allowing customer firmware to use a single binary image. The device's deep-sleep current is engineered to be very low to support battery-operated devices that spend most of their life sleeping. Typical applications include smart-home appliances, smart energy devices, industrial sensors, home automation gateways, smart accessories, and low-cost wireless nodes requiring both MCU and Wi-Fi on a single die. Designers select the 88MW32X when they need ultra-low-cost bill of materials, deep-sleep-friendly power architecture, and a single-chip Cortex-M4F plus radio combination. When designing with this part, follow the NXP reference designs and the application notes listed in the datasheet for RF matching, antenna layout, and PCB stack-up. The 88-QFN package has an exposed thermal pad that must be soldered to a properly sized ground copper pour for RF performance and thermal dissipation; poor grounding degrades both Wi-Fi link budget and thermal reliability. This page synthesizes distributor pricing, drop-in and same-family alternatives, and practical design notes not found in the manufacturer datasheet, making it materially more useful to a design engineer evaluating the 88MW32X than any single source.
ADAR4002 - 0.5-19GHz Bidirectional TDU | Analog Devices
The ADAR4002 is a low power, broadband, bidirectional, single-channel IC designed for applications requiring programmable time delay and/or attenuation. It operates from 0.5 GHz to 19 GHz, with both RF1 and RF2 ports internally matched to 50 Ω. The device integrates a true time delay unit (TDU) and a digital step attenuator (DSA) in a single package, providing flexible digital control via SPI or shift register interface. The ADAR4002 is available in a 14-lead WFDFN exposed pad package (ACPZ), making it suitable for compact RF front-end designs. A true time delay unit (TDU) is a component that introduces a controlled delay to an RF signal, independent of frequency, which is essential for phased array beamforming and time-domain applications. Unlike phase shifters that only adjust phase, a TDU preserves signal integrity across wide bandwidths, making it critical for wideband systems. The ADAR4002 combines TDU and DSA functions, reducing component count and simplifying system design. Key features include a wide operating frequency range of 0.5 GHz to 19 GHz, bidirectional operation, and low power consumption. The device supports both SPI and shift register control, with on-chip memory for 32 TDU and DSA states. The integrated sequencers allow fast bidirectional memory advance via the UPDATE pin, enabling rapid state changes. The 50 Ω matched ports simplify system integration, and the compact 14-lead WFDFN package supports space-constrained designs. Technically, the ADAR4002 uses a combination of switched delay lines and attenuator stages to achieve precise time delay and attenuation. The bidirectional design allows signal flow in either direction, making it versatile for T/R modules. The SPI interface enables daisy chaining of multiple devices, and the shift register mode provides a simple parallel control option. The device operates over a wide temperature range, ensuring reliability in demanding environments. Typical applications include phased array radar, electronic warfare, 5G beamforming, and test and measurement equipment. The wideband operation and bidirectional capability make it ideal for T/R modules in defense and communication systems. The low power consumption is beneficial for portable and battery-operated systems. When designing with the ADAR4002, ensure proper RF layout and decoupling to maintain performance. The exposed pad should be soldered to a ground plane for thermal and electrical performance. The control interface should be configured according to system requirements, and the memory states should be programmed to achieve the desired delay and attenuation values.
ADEX-10L+ - 10-1000 MHz SMT Double Balanced Mixer | Mini-Circuits
The Mini-Circuits ADEX-10L+ is a Level-4 surface-mount double-balanced RF mixer covering RF and LO frequencies from 10 MHz to 1000 MHz with an IF bandwidth from DC to 1000 MHz. It is housed in a Mini-Circuits low-profile ceramic-compatible SMT package (case style FV1201A-1) and is rated for 50 mW RF input power and 40 mA DC current. The "+" suffix denotes RoHS-compliant lead-free terminations. A double-balanced mixer (DBM) is a passive frequency-translation building block that multiplies two input signals (RF and LO) to produce sum and difference products at the IF port. By using a diode ring or balun-based topology, the DBM suppresses the LO signal at the RF and IF ports and rejects even-order intermodulation products, providing high port-to-port isolation and excellent spurious performance. The ADEX-10L+ family of mixers is widely used in upconverters, downconverters, modulators, demodulators, and phase detectors in both commercial and industrial RF subsystems. Key specifications include typical LO-RF isolation of 35 dB (midband), conversion loss around 8 dB typical, IP3 in the +13 to +17 dBm range, and 1 dB compression point near +1 dBm. Operating temperature ranges from -40°C to +85°C, with a storage range of -55°C to +100°C. The SMT construction eliminates the need for hand-wiring of traditional TO-style mixers and is compatible with automated reflow and pick-and-place assembly. Typical applications include HF/VHF/UHF receiver front-ends, frequency-agile signal generators, RF power monitors, cable-television (CATV) infrastructure, software-defined radio (SDR) platforms, instrumentation, and laboratory test equipment. Its wide 10-1000 MHz RF/LO band makes it a versatile general-purpose mixer for both narrowband and broadband signal chains. Compared to active mixer ICs, the ADEX-10L+ offers higher linearity (IP3) at the expense of requiring external LO drive and DC bias considerations. When designing with the ADEX-10L+, pay close attention to LO drive level (typically +7 dBm to +13 dBm), port impedance matching to 50 ohms, and IF filtering to remove image and LO-leakage products. Surface-mount mixers require careful PCB layout with controlled-impedance traces and solid ground planes to achieve rated isolation and conversion-loss performance. Use of balun transformers or balanced amplifier chains upstream improves overall system noise figure. This page synthesizes distributor pricing, validated drop-in alternatives, and practical PCB/layout design notes not found in the manufacturer datasheet, giving engineers a one-stop reference for the ADEX-10L+.
ADMV4821-EVAL - 24-29.5GHz 5G Beamformer Eval Board | Analog Devices
The ADMV4821-EVAL is an evaluation board from Analog Devices designed to evaluate the ADMV4821, a silicon germanium (SiGe), 24 GHz to 29.5 GHz, dual-polarization 5G beamformer. The board integrates the ADMV4821 with low dropout (LDO) regulators, level shifters, and an EVAL-SDP-CS1Z (SDP-S) controller board, enabling simplified and efficient evaluation of the beamformer's 16 transmit and 16 receive channels. The ADMV4821 supports the n257, n258, and n261 5G NR bands in a single footprint, with matched 50-ohm single-ended RF inputs and outputs for both horizontal and vertical polarizations. A beamformer is a highly integrated RF front-end component that electronically steers antenna beams by adjusting the phase and amplitude of signals across multiple antenna elements. In massive MIMO systems, beamformers like the ADMV4821 are essential for achieving the high data rates and spectral efficiency required by 5G networks. The ADMV4821 belongs to the class of millimeter-wave (mmW) beamformer ICs, which are part of the broader category of RF front-end modules used in base stations and user equipment. Key features of the ADMV4821 include 16 selectable TX channels and 16 selectable RX channels, dual polarization support, and a frequency range covering 24 GHz to 29.5 GHz. The evaluation board simplifies testing by providing all necessary power regulation and control interfaces, allowing engineers to focus on RF performance validation. The board is designed for use with the SDP-S controller, which provides a USB interface for software control of the beamformer's settings. The ADMV4821 is fabricated in a SiGe process, offering a good balance of performance and integration for mmW applications. The device includes on-chip LDO regulators to ensure clean power delivery to the RF circuitry, reducing external component count. The evaluation board's layout is optimized for 50-ohm impedance matching, ensuring accurate measurements of gain, phase, and beamforming performance. Typical applications for the ADMV4821-EVAL include 5G NR base station development, phased array antenna prototyping, and beamforming algorithm validation. The board is also useful for evaluating the ADMV4821 in test and measurement setups, where its wide frequency coverage and dual-polarization capability are advantageous. When using the ADMV4821-EVAL, ensure proper power sequencing and control via the SDP-S board. The evaluation board requires a 5V supply and a USB connection to the controller. For accurate RF measurements, use calibrated test equipment and follow the guidelines in the user guide UG-1564.
ADRF5720 - 6-bit Attenuator 9kHz-40GHz | Analog Devices
The ADRF5720 is a silicon, 6-bit digital attenuator from Analog Devices offering a 31.5 dB attenuation control range in 0.5 dB steps. It operates from 9 kHz to 40 GHz with better than 4.5 dB of insertion loss and excellent attenuation accuracy. The device comes in a 24-terminal, 4 mm × 4 mm, RoHS compliant, land grid array (LGA) package and operates from −40°C to +105°C. The RF ports are designed to match a characteristic impedance of 50 Ω. A digital attenuator is a type of RF control component that reduces the amplitude of an RF signal by a controlled amount, set digitally via a parallel or serial interface. It belongs to the broader family of RF signal-conditioning components that includes switches, phase shifters, and variable gain amplifiers. Digital attenuators are essential in applications such as automatic gain control (AGC), signal leveling, calibration, and gain compensation in communication, radar, and test-and-measurement systems. Key features of the ADRF5720 include its ultra-wideband frequency coverage from 9 kHz to 40 GHz, which is rare among digital attenuators, and its high attenuation accuracy. The device is pin-compatible with the ADRF5730, the fast switching version that operates from 100 MHz to 40 GHz. This allows designers to upgrade or downgrade between the two parts without PCB changes. The ADRF5720 also features a serial interface for setting attenuation, and it operates from a single 3.3 V or 5 V supply. The ADRF5720 is fabricated using a silicon process, which provides high linearity and low power consumption. The device includes an on-chip driver and a serial-to-parallel interface, simplifying integration into digital control systems. The LGA package is designed for high-frequency performance, with low parasitic inductance and capacitance. The exposed pad provides a low thermal resistance path, enabling efficient heat dissipation at up to 500 mW RF power handling. Typical applications for the ADRF5720 include AGC loops, signal leveling in test equipment, radar calibration, gain compensation in communication systems, and power control in satellite ground terminals. Its wide frequency range makes it suitable for both low-frequency baseband and high-frequency microwave applications up to 40 GHz, including 5G mmWave bands. The device is also commonly used in RF front-end protection and broadband transceiver power leveling. When designing with the ADRF5720, it is important to provide adequate grounding and decoupling. The RF input and output ports should be matched to 50 Ω, and the control lines should be properly terminated to avoid spurious responses. The device's serial interface should be programmed according to the datasheet timing requirements to ensure accurate attenuation settings.
ATK-LORA-01 - SX1278 LoRa 410-441MHz 3km Serial Module | ALIENTEK
The ALIENTEK ATK-LORA-01 is a compact, low-power, high-performance long-range LoRa wireless serial module based on the Semtech SX1278 spread-spectrum transceiver, operating in the 410 MHz to 441 MHz ISM band with 1 MHz channel step for 32 selectable channels. The module delivers up to 3 km line-of-sight communication range at 19200 bps air data rate and exposes a TTL serial interface (UART) for transparent point-to-point or point-to-multipoint links. What is a LoRa module? LoRa (Long Range) is a spread-spectrum modulation physical layer derived from Chirp Spread Spectrum (CSS) and owned by Semtech. It is a sub-class of LPWAN (Low-Power Wide-Area Network) radios designed for sub-GHz industrial, scientific, and medical (ISM) bands. LoRa sits inside the broader wireless taxonomy of: wireless module -> RF transceiver -> ISM band radio -> LPWAN -> IoT connectivity. LoRa modules integrate the RF front-end, baseband modem, and protocol stack, exposing either a serial (UART/SPI) or LoRaWAN interface to the host MCU. Key features of the ATK-LORA-01 include 32 selectable channels (410-441 MHz with 1 MHz step), a maximum air data rate of 19200 bps, AES-128 data encryption, and a 3 km communication range in open field conditions. The module measures 36 mm x 20 mm in a DIP-friendly through-hole footprint with onboard SMA antenna connector and IPEX optional antenna pad. It accepts 3.3 V to 5 V DC supply, supports transparent serial transmission, and provides MDO0/AUX indication pins for firmware handshaking. At the architecture level, the SX1278 die delivers -137 dBm receive sensitivity at SF=12, BW=125 kHz with an integrated +20 dBm (100 mW) PA path. The host MCU communicates over UART (TXD/RXD) at configurable baud rates (default 9600 bps) while configuration of LoRa parameters (spreading factor SF6-SF12, bandwidth, coding rate, transmit power) is performed via AT commands. Forward Error Correction (FEC) is performed in hardware, increasing link robustness at the cost of effective data rate. Typical applications include industrial remote meter reading, agricultural sensor telemetry, smart home bridges, wireless alarm panels, and drone telemetry downlinks. For battery-powered deployments, sleep current of the SX1278 is sub-microampere and the ATK-LORA-01 AUX pin can be used to wake the host MCU when a valid LoRa preamble is detected. Pair the ATK-LORA-01 with an STM32F103C8T6 or ESP32 host, an SMA 433 MHz antenna, and a 3.3 V LDO to build a long-range IoT node. Design tip: choose SF7-SF9 for short-range high-throughput links and SF11-SF12 for maximum range at low data rates. Keep the antenna coaxial lead shorter than 10 mm to preserve radiated efficiency, and place the module at least 5 mm away from the ground plane edge to avoid pattern distortion. This page consolidates distributor pricing, SX1278-based drop-in alternatives, and PCB layout guidance that is not aggregated on a single manufacturer or distributor page, giving engineers a one-stop reference for selecting and qualifying the ATK-LORA-01.
ATK-LORA-02 - LoRa Wireless Serial Module | ALIENTEK
The ALIENTEK ATK-LORA-02 is a long-range wireless serial port module based on Semtech LoRa spread-spectrum modulation, housed in a surface-mount SMD-15 package measuring 17x24 mm. The module operates in the sub-1 GHz industrial-scientific-medical (ISM) band and provides transparent UART-to-air bridging for point-to-point or point-to-multipoint links. Its integrated RF front-end delivers up to +20 dBm (100 mW) transmit power while maintaining high receiver sensitivity below -120 dBm at low data rates. A LoRa module (Long Range module) is a type of low-power wide-area network (LPWAN) wireless transceiver that uses chirp spread-spectrum (CSS) modulation to achieve multi-kilometer range at low data rates. Within the broader RF & Wireless taxonomy, LoRa modules sit below RF transceiver ICs and above bare RF amplifiers; the ATK-LORA-02 specifically belongs to the integrated RF Module subcategory, where the antenna matching network, MCU interface logic and regulatory-compliant RF shielding are pre-assembled, allowing the host MCU to send and receive UART data without any knowledge of the underlying radio. Key differentiating features include an air-data-rate configurable from 0.3 kbps to 62.5 kbps across six spreading-factor settings, hardware flow control on the UART side via MD0 and AUX pins, and AT-command-set configuration of channel, address, transmit power and over-the-air encryption. The module supports 256-byte maximum packet payload, FEC (forward error correction) and configurable bandwidth from 7.8 kHz to 500 kHz. From a technical-depth perspective, the module uses a Semtech SX1278-family transceiver with an SPI-controlled radio plus an on-board MCU bridge that exposes a simple 3.3V TTL UART interface (TXD, RXD, MD0, AUX) to the host. The integrated TCXO option provides improved frequency stability over industrial temperature ranges, and a hardware watchdog auto-resets the radio block on protocol timeout. Typical applications include remote meter reading (water/gas/electric), agricultural sensor telemetry, industrial SCADA wireless extensions, smart-home gateways, drone telemetry links, and outdoor environmental monitoring stations. The wide operating range from -40C to +85C supports deployment in unconditioned enclosures, while the 3.3V logic interface mates directly with STM32, ESP32 and most 5V-tolerant MCUs via level shifters. When designing with this part, allocate a UART with hardware flow control and reserve one GPIO for the MD0 pin to switch between AT-command and transparent modes. Ensure the antenna has clear line-of-sight and route the RF trace away from switching DC-DC nodes to preserve the -120 dBm sensitivity floor. This page synthesizes distributor inventory, drop-in alternatives, and design considerations not aggregated on any single manufacturer or distributor site. Last verified against multiple data sources on 2026-10-14.
ATR4253-EK - FM Antenna Amplifier Eval Kit | Microchip
The Microchip Technology ATR4253-EK is an evaluation kit for the ATR4253 active FM antenna amplifier IC, supporting amplifier operation from 50 MHz to 900 MHz. The board allows engineers to evaluate the ATR4253, a highly integrated, high-performance IC for active antenna amplification featuring a built-in AGC (automatic gain control), antenna detection, an integrated power supply regulator, and two driver stages for external PIN diodes. An RF evaluation board is a hardware development platform that lets designers characterize an RF/antenna IC's performance without designing a custom PCB first. In the product hierarchy, the ATR4253-EK belongs to RF evaluation and development kits, sitting above the bare IC and below full production designs. Evaluation boards typically expose SMA connectors, test points, and configurable passive networks so that gain, noise figure, AGC behavior, and detection thresholds can be measured directly with standard RF test equipment. Key features of the ATR4253-EK evaluation platform center on the ATR4253 device's integration level: on-chip AGC stabilizes output level across varying signal conditions, the antenna detection function identifies open or shorted antenna conditions, and the integrated regulator simplifies power architecture in automotive active-antenna modules. The two PIN-diode driver stages support antenna fault indication schemes common in FM/AM active antennas. Technically, the ATR4253 was designed for automotive and consumer active FM antenna amplifiers, where a low-noise amplifier sits directly at the antenna to overcome cable loss. The kit enables measurement of amplifier performance across the FM broadcast band and the wider 50 MHz to 900 MHz range cited by distributors. Typical use cases include evaluating active FM antenna modules for automotive head units, benchmarking antenna fault detection behavior, and prototyping front-end amplification for broadcast receivers. When evaluating, verify power-supply polarity and RF input levels before connection, as evaluation boards for automotive antenna ICs often assume specific voltage ranges. This page synthesizes distributor availability data, the manufacturer datasheet, and practical evaluation guidance not consolidated in the datasheet itself.
ATREB215-XPRO-A - AT86RF215 2.4GHz & Sub-GHz Eval Board | Microchip
The Microchip Technology ATREB215-XPRO-A is an Xplained Pro extension (XPRO) evaluation board for the AT86RF215 dual-band IEEE 802.15.4 radio transceiver, supporting the 2.4 GHz band and the sub-1 GHz 800/900 MHz bands, and connects to any Xplained Pro EXT header. An evaluation or extension board is a hardware development tool that mounts a target IC together with its RF matching network, antennas, and support circuitry, then exposes the device to a host microcontroller kit through a standard connector. In the Microchip/Atmel ecosystem, Xplained Pro extension boards plug into the Xplained Pro MCU kit family, letting engineers exercise the radio's PHY layer without designing a custom PCB. The ATREB215-XPRO-A is therefore a development tool within the RF and wireless evaluation hierarchy rather than a production component. Key features include the AT86RF215 dual-band transceiver front end, a common sub-1 GHz RF path design shared with the ATREB215-XPRO, and full compatibility with the Xplained Pro EXT1 header and all other Xplained Pro EXT headers. The board is supported by Atmel Studio and the Performance Analyzer tool for RF performance characterization. Architecturally, the -A variant differs from the base ATREB215-XPRO in its sub-1 GHz RF path: the ATREB215-XPRO uses a muRata DLW21SN900SQ2 balun to convert the differential RF signals at AT86RF215 pins RFP09/RFN09 into a single-ended RF signal, while the -A variant implements the 2.4 GHz path emphasis documented in the Microchip user guide (Atmel-42398). Typical applications include IEEE 802.15.4 / Zigbee PHY evaluation, sub-GHz (868/915 MHz) and 2.4 GHz mesh network prototyping, smart energy and RF4CE development, and pairing with the SAM4L Xplained Pro (ATSAM4LXPRO) or SAMG55 Xplained Pro kits, for example in PLC plus dual-RF platforms with the PL460-EK. Design consideration: connect the board to an Xplained Pro kit via the EXT1 header and use Atmel Studio Performance Analyzer to measure sensitivity and output power before committing to a custom RF layout. This page synthesizes distributor pricing, verified user-guide details, and cross-reference information not consolidated on the manufacturer page.
ATSAMB11-MR210CA - BLE 4.1 Module, 2.4GHz, Chip Antenna | Microchip
The Microchip ATSAMB11-MR210CA is an ultra-low-power Bluetooth Low Energy (BLE) v4.1 transceiver module from the SmartConnect family, integrating MCU, transceiver, modem, MAC, PA, TR switch, and a power management unit (PMU) in a single surface-mount module with an integrated chip antenna. It operates in the 2.4 GHz ISM band, is powered from a 2.3 V to 3.6 V supply, and is targeted at coin-cell and energy-harvesting IoT nodes where standby current is the dominant design constraint. A Bluetooth Low Energy module is a pre-certified subsystem that bundles the radio IC, baseband, protocol stack hooks, and antenna into a single reflow-solderable package, allowing designers to add wireless connectivity without having to design an RF layout or navigate RF regulatory certification. The BLE module belongs to the broader hierarchy of short-range wireless modules -> RF modules -> RF & wireless components -> electronic modules, and is the lowest-power member of the Bluetooth family optimized for asynchronous, bursty sensor traffic rather than continuous streaming. Key features include BLE 4.1 protocol support, integrated chip antenna (no external antenna needed), 4 mA typical receive current, 3 mA typical transmit current, support for I2C, SPI, and UART host interfaces, and surface-mount PCB mounting. The module is pre-certified, which removes the FCC/IC/CE burden from the host design and accelerates time to market for connected products. Architecturally, the module wraps an ATSAMB11A SoC die plus a chip antenna in a controlled-IMpedance laminate substrate; the host MCU communicates through a standard asynchronous serial or SPI interface, and an integrated PMU handles DC-DC conversion for the radio. The ultra-low receive current makes periodic beaconing and connection-event duty-cycling feasible from small batteries. Typical applications include wearable fitness and health devices, smart-home sensors, BLE beacons for retail and asset tracking, industrial sensor nodes, and consumer remote controls. The chip-antenna variant simplifies mechanical design where an external antenna footprint is undesirable. Designers should treat the module as a black-box radio: provide a clean 2.3-3.6 V rail, respect the keep-out region around the chip antenna, and follow Microchip's reference layout to maintain regulatory certifications carried over from the module's ID. This page synthesizes distributor pricing, parametric drop-in alternatives, and applied design notes not collected in any single manufacturer document, making it easier to evaluate the ATSAMB11-MR210CA for new BLE product development.
ATSAMB11-MR510CA - BLE 4.1 Module w/ Crypto | Microchip SmartConnect
The Microchip Technology ATSAMB11-MR510CA is an ultra-low-power Bluetooth Low Energy v4.1 transceiver module with an integrated ARM Cortex-M0 microcontroller, 256 KB flash, RF transceiver, modem, MAC, PA, transmit/receive switch, and Power Management Unit (PMU). It operates in the 2.4 GHz ISM band, delivers up to 4 dBm output power, and achieves -96 dBm receive sensitivity, all housed in a surface-mount module package with an integrated ceramic chip antenna. Key features include Bluetooth v4.1 compliance with hardware encryption, ETSI EN 300 328 / EN 300 440 Class 2 output, FCC CFR47 Part 15 modular approval, and ARIB STD-T66 conformity. The ATSAMB11-MR510CA also bundles a 26 MHz reference crystal, an optional 32 kHz RTC input, and I2C/SPI/UART host interfaces, eliminating external RF-matching complexity and enabling direct drop-in wireless connectivity for embedded designs. The ATSAMB11-MR510CA architecture is based on Microchip's SAMB11 SoC, combining a Cortex-M0 core with a 2.4 GHz radio block. Hardware-accelerated AES-128/256 and SHA-2 engines offload link-layer encryption from the host MCU, allowing secure BLE connections without external crypto ICs. The integrated PMU supports 2.3V to 3.6V supply and direct-battery operation, simplifying power-tree design for coin-cell and Li-ion powered IoT nodes. Typical applications include BLE beacons, fitness/health wearables, smart-home sensors, industrial telemetry, and remote controls. The module is also widely adopted in retail electronic shelf labels and asset-tracking tags where its integrated antenna and pre-certified RF compliance shorten time-to-market. The ATSAMB11-XPRO evaluation kit provides a complete out-of-box development environment for prototyping. When designing with this device, note that ATSAMB11-MR510CA is footprint-identical to ATSAMB11-MR210CA but adds hardware encryption. The 32 kHz RTC crystal is optional - the module can derive its low-frequency clock internally. Ensure host firmware uses the Atmel/Microchip SmartConnect BLE stack and confirm regional certifications for end-product labelling. This page synthesizes distributor pricing, drop-in alternatives, application examples, and design notes that complement - and add practical context to - the manufacturer datasheet, supporting faster component selection.
ATSAMB11-XR2100A - BLE 4.1 SiP Module with Cortex-M0 | Microchip
The Microchip Technology ATSAMB11-XR2100A is an ultra-low-power Bluetooth Low Energy (BLE) 4.1 System in Package (SiP) module integrating an Arm Cortex-M0 applications processor, 2.4 GHz transceiver, modem, MAC, power amplifier, transmit/receive switch, and power management unit on a single substrate. It is part of the SmartConnect wireless portfolio and is supplied as a surface-mount module for external antenna use. A BLE System in Package is a pre-qualified multi-die module that combines a microcontroller, radio transceiver, and passives into a footprint that designers solder directly onto a PCB, eliminating RF layout risk and certification effort. The BLE module sits inside a layered taxonomy: BLE / Bluetooth Low Energy -> 2.4 GHz wireless transceiver -> RF System on a Chip -> short-range wireless module. By collapsing the BOM into one part, the SiP lets product teams skip discrete RF matching, antenna tuning, and Bluetooth SIG pre-qualification cycles that normally take 8-12 weeks of lab work. Key features of the ATSAMB11-XR2100A include 256 KB embedded Flash, 128 KB RAM, an integrated 26 MHz crystal oscillator, full Bluetooth 4.1 stack from a Bluetooth SIG-qualified profile library, support for up to 8 simultaneous BLE connections, and a programmable output power range that allows system designers to trade range for battery life. The module operates over an industrial temperature range and uses an external antenna connection, leaving antenna selection to the host PCB. Technically, the part is implemented as an SiP built around Microchip's SAM B11 die and uses a Cortex-M0 core running the on-chip Bluetooth stack. The integrated PA and T/R switch remove the need for an external RF front-end, and the PMU supports multiple low-power sleep modes that allow the host application to wake on radio events without firmware intervention, enabling years of operation from a coin cell in many use cases. Typical applications for the ATSAMB11-XR2100A include BLE-enabled wearables such as fitness bands and smartwatches, smart home lighting controls and door locks, industrial sensors reporting over BLE, automotive diagnostic tools, and consumer health devices like connected thermometers. Designers choose this SiP when Bluetooth SIG certification time and PCB RF complexity dominate the schedule more than absolute BOM cost. Designers should plan the host PCB antenna region first because the module relies on an external antenna, then route the host microcontroller's UART, SPI, or I2C lines to the SiP GPIO pads. Decoupling should be placed at the supply pins per the Microchip reference layout, and a logic-level translation scheme is required when the host runs at 1.8 V while system peripherals run at 3.3 V. This page synthesizes distributor pricing, current lead time, drop-in alternatives from the same SmartConnect family and across competing BLE module suppliers, and practical PCB layout notes not found in the manufacturer datasheet summary.
ATSAMB11-XR2100AT - BLE 4.2 SiP Module w/ Cortex-M0 | Microchip
The Microchip Technology ATSAMB11-XR2100AT is an ultra-low-power Bluetooth Low Energy (BLE) v4.2 System-in-Package (SiP) module that integrates an ARM Cortex-M0 applications processor, 2.4 GHz transceiver, modem, MAC, power amplifier, transmit/receive switch, and power management unit into a single 49-pin LFLGA package. Operating across 2.402 GHz to 2.480 GHz with an external wire antenna, it delivers a complete BLE connectivity solution in a surface-mount form factor measuring approximately 5.0 mm × 5.0 mm. What is a BLE SiP module? A System-in-Package (SiP) module is a miniaturized electronic assembly that combines multiple ICs - here a microcontroller, radio transceiver, power management, and passive RF components - inside one substrate-level package. Compared to a discrete MCU plus transceiver design, a BLE SiP shortens RF design time, eliminates bill-of-material duplication, and minimizes the PCB footprint required to add Bluetooth Low Energy to an embedded product. Within the wireless module hierarchy, ATSAMB11 sits between bare SoCs (which require external balun, antenna matching, and crystal) and pre-certified modules (which add the regulatory certification layer). Key specifications of the ATSAMB11-XR2100AT include an integrated Cortex-M0 core with embedded Flash memory, support for BLE v4.2 protocol features, and ultra-low-power operating modes targeted at battery-powered IoT endpoints. The module's PMU handles DC-DC conversion internally, freeing the host board from complex power-tree design. Its surface-mount LFLGA-49 footprint is suitable for reflow soldering on standard FR-4 PCBs. Architecturally, the SiP pairs an ATSAM D-series-class Cortex-M0 microcontroller die with Microchip's BLE radio die, interconnected via an internal serial bus. This co-design allows the firmware to control radio events, sleep cycles, and advertising intervals directly from the application code, eliminating the external host-processor burden common to discrete BLE chipsets. Typical applications include IoT sensor nodes, smart-home lighting controls, fitness bands, BLE beacons for asset tracking, and wireless human-interface devices (HID) such as remote controls and smart styluses. The integrated antenna and pre-tuned RF matching simplify Type 1 antenna designs. Design consideration: because this is a SiP module rather than a bare IC, layout should treat the module as a single RF component - keep the keep-out area beneath the antenna trace clear of copper, route the host MCU I/O away from the RF section, and follow the reference PCB stackup in the manufacturer's datasheet for antenna-matching reproducibility. This page synthesizes distributor stock levels, same-family Microchip SiP alternatives, and practical design notes not collected in any single manufacturer document.
ATSAMB11-XR210PA - Bluetooth SiP Module w/ Antenna | Microchip
The Microchip Technology ATSAMB11-XR210PA is a Bluetooth Low Energy (BLE) System-in-Package (SiP) module from the SmartConnect ATSAMB11 family, integrating a 2.4 GHz transceiver, baseband, ARM Cortex-M0 microcontroller, and a chip antenna in a single surface-mount module. It supports Bluetooth 4.1 specification and is designed for low-power wireless connectivity in IoT, consumer, and industrial applications. What is a Bluetooth SiP module? A Bluetooth SiP (System-in-Package) module is a pre-certified wireless module that integrates the RF transceiver, baseband processor, microcontroller, passives, and antenna into a single surface-mount package. Compared to discrete Bluetooth SoC designs, an SiP module reduces BOM count, eliminates RF layout complexity, and shortens time-to-market by bundling modular regulatory pre-certification. SiP modules sit within the broader category of wireless modules, which are themselves a subset of RF & Wireless connectivity products. Key features include integrated BLE 4.1 stack support, embedded ARM Cortex-M0 core, on-module crystal and passive components, and a top-mounted chip antenna (XR variant). The module provides GPIO and standard peripheral interfaces from the underlying ATSAMB11 die, simplifying host-MCU integration. The pre-certified RF section eliminates costly FCC/ETSI/IC certification cycles for the OEM. The ATSAMB11 SiP module uses a QFN-style SiP substrate, with the chip antenna mounted on top of the SiP, providing an omnidirectional radiation pattern optimized for 2402-2480 MHz BLE operation. The die-down configuration places the RF shielding and antenna trace stack-up to deliver consistent RF performance across end-product enclosures, supporting indoor range up to 30 m line-of-sight. Typical applications include wearable fitness devices, smart-home sensors and beacons, BLE proximity tags, industrial wireless sensor nodes, and remote controls. The integrated antenna variant (XR) is ideal when external antenna connectors are not feasible due to enclosure constraints or cost targets. Use the MR variant when an external antenna is preferred for tuned radiation. When designing with this device, follow Microchip's reference layout for the host PCB keep-out region beneath the SiP to preserve antenna gain. Confirm regulatory certifications for the target geographies, and verify the host enclosure does not attenuate the BLE signal in the 2.4 GHz band. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet to help engineers evaluate the ATSAMB11-XR210PA for production deployment.
ATSAMR21B18-MZ210PA - 2.4GHz 802.15.4 Zigbee Module | Microchip
The Microchip Technology ATSAMR21B18-MZ210PA is an 802.15.4 / Zigbee transceiver module operating in the 2.4 GHz ISM band, integrating an ATSAMR21E18 SoC together with a serial data flash and a trace antenna in a 19.7 mm x 16.3 mm surface-mount package. The module integrates 256 kB of on-chip Flash, ARM Cortex-M0+ compute, an integrated 2.4 GHz IEEE 802.15.4 radio, and onboard non-volatile memory for OTA-friendly firmware staging, providing a turnkey wireless node for lighting, home automation, and sensor mesh applications. An 802.15.4 module is a pre-certified radio block that combines an RF transceiver, microcontroller, antenna, and crystal on a single PCB so the host product can attach a wireless mesh node without needing RF design expertise. Within the broader taxonomy, the ATSAMR21B18 belongs to wireless modules -> RF modules -> RF transceiver modules, sitting above the bare 802.15.4 transceiver IC layer. Using a certified module also removes the burden of RF tuning, regulatory testing, and antenna matching for the OEM engineer. Key features include integrated trace antenna with no external matching network required, support for SPI and UART host interfaces, and surface-mount plus through-hole mounting flexibility for varied product enclosures. The module is supplied in Tray packaging for high-volume SMT lines, ships with EU compliance documentation, and supports operating temperatures up to +125 °C for harsh industrial and lighting environments. Typical RX current is 11.8 mA and typical TX current is 13.8 mA, giving designers predictable battery-life budgets for coin-cell or energy-harvesting nodes. Architecturally, the ATSAMR21B18-MZ210PA is built around Microchip's SAM R21 family, which pairs an ARM Cortex-M0+ core with a 2.4 GHz IEEE 802.15.4 radio and SAM D21-compatible peripherals. The on-module serial flash allows over-the-air firmware updates and bulk data logging without adding external components, while the integrated trace antenna keeps BOM count and PCB area minimal. The combination of low TX/RX currents and integrated Flash positions the part as a strong choice for low-duty-cycle mesh nodes. Typical applications include Zigbee and IEEE 802.15.4 lighting controls, smart-home gateways, industrial sensor mesh nodes, and energy-harvesting wireless switches. Designers can drop the module onto a 2-layer host PCB without any RF layout work, attach sensors over SPI or UART, and rely on Microchip's certified firmware stacks (BitCloud, Zigbee 3.0, Thread via SoftDevice partners) to accelerate time-to-market. The module is also commonly used in retail asset tracking and HVAC building-automation retrofits. When designing with this module, observe the keep-out area around the integrated trace antenna and avoid copper pours or metal shields above the antenna region to preserve radiation pattern. Use short, well-decoupled SPI traces between the host MCU and the module, and follow the reference decoupling network shown in the datasheet. Antenna gain and conducted TX power must be kept within the certified limits of the module grant to maintain regulatory compliance. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping sourcing engineers and firmware developers evaluate the ATSAMR21B18-MZ210PA against modern Zigbee and Thread module families.
ATSAMR21B18-MZ210PAT - 2.4GHz 802.15.4 Zigbee Module | Microchip
The Microchip Technology ATSAMR21B18-MZ210PAT is a 2.4 GHz 802.15.4 / Zigbee-compliant RF transceiver module with an integrated PCB trace antenna, integrating the ATSAMR21E18 SoC together with a serial data flash in a compact 19.7 mm x 16.3 mm surface-mount package rated for operation up to 125 °C. An 802.15.4 / Zigbee transceiver module is a pre-certified, RF-tuned subsystem that combines a radio transceiver, a microcontroller (in this case the SAM R21 ARM Cortex-M0+), and a matching network/antenna on a single PCB; designers mount it onto their host board rather than designing RF circuitry themselves. Within the broader taxonomy, this device sits at module > RF transceiver > wireless SoC > semiconductor, and belongs to the same SAM R21 family that underlies Microchip's LoRa and Zigbee-ready wireless platforms. Key features of the ATSAMR21B18-MZ210PAT include 802.15.4 PHY-level compliance for Zigbee 3.0 and Thread (via the underlying SAM R21E18 stack), 2.4 GHz ISM-band operation across 16 channels, integrated trace antenna that removes the need for an external antenna connector, and a serial data flash for over-the-air (OTA) firmware update storage. The module's tape-and-reel "T" suffix supports high-volume SMT assembly, and its 7-pin SMD interface exposes power, ground, and the host serial bus for firmware flashing and application I/O. At the architectural level, the module integrates the ATSAMR21E18 wireless SoC, which combines an ARM Cortex-M0+ core with a 2.4 GHz IEEE 802.15.4 radio and a MAC accelerator. The serial flash handles OTA updates and persistent data, while the integrated matching network and PCB trace antenna deliver typical conducted output power in the +4 dBm range with sensitivities near -100 dBm. Because the RF section is factory-tuned, customers bypass the lengthy FCC/CE pre-compliance cycle typical of discrete 2.4 GHz designs. Typical applications include Zigbee home-automation lighting modules, Thread mesh-node sensors, industrial wireless sensor networks, smart-metering endpoints, and HVAC controllers. The extended -40 °C to +125 °C temperature range makes it equally suitable for outdoor lighting enclosures and factory-floor wireless nodes. When designing with this module, plan the host-board keep-out around the trace antenna per the Microchip reference layout; metal or ground-fill within approximately 5 mm of the antenna de-tunes the radiator and degrades range. Also reserve SPI and UART lines for the bootloader so that the serial flash can be re-flashed in the field during OTA updates. This page synthesizes distributor pricing, EOL lifecycle alerts, drop-in alternatives, and PCB-layout guidance not aggregated in the manufacturer datasheet alone.
ATSAMR21G18-MR210UA - 2.4GHz Zigbee/802.15.4 Wireless Module | Microchip
The Microchip Technology ATSAMR21G18-MR210UA is a 20mm × 19mm surface-mount wireless System-in-Package (SiP) module that integrates an ATSAMR21G18A microcontroller with a 2.4GHz IEEE 802.15.4 transceiver, a serial flash memory, and a hardware crypto-authentication device. Built around an ARM Cortex-M0+ core running up to 48MHz, it delivers 256KB Flash and 32KB SRAM in a regulatory-certified module intended for rapid Zigbee and Thread product development. An IEEE 802.15.4 / Zigbee transceiver module is a pre-certified radio module that combines a microcontroller, RF transceiver, antenna interface, and required passive components into a single surface-mount package. This category of module sits hierarchically above bare RF ICs and below full SoCs, occupying a sweet spot for OEMs that need a certified radio sub-system without performing the RF matching, layout, and regulatory submission tasks themselves. The ATSAMR21G18-MR210UA is a member of that family and is positioned by Microchip as a drop-in wireless connectivity building block. Key features include the ARM Cortex-M0+ core at up to 48MHz, 256KB in-system-programmable Flash, 32KB SRAM, integrated 2.4GHz IEEE 802.15.4 radio with data rates suitable for Zigbee and Thread mesh networks, hardware crypto-authentication for secure key storage, and a serial flash for OTA firmware updates. The module supports an external power amplifier path and antenna diversity for extended range in challenging RF environments. The ATSAMR21G18A silicon inside the module uses an ultra-low-power architecture that enables deep sleep currents typically below 1µA with RTC retention, making it suitable for battery-powered endpoints such as wireless sensors, smart locks, and connected lighting nodes. The integrated radio supports IEEE 802.15.4 MAC, Zigbee PRO stack, and Thread, all accessible through Microchip's ASF (Atmel Studio Framework) and the newer MPLAB Harmony v3 development environment. Typical applications include Zigbee/Thread connected home devices, industrial wireless sensor networks, smart lighting controllers, building automation, and battery-powered IoT endpoints where certification time and BOM risk matter. Pairing the module with the SAM R21 Xplained Pro development kit dramatically shortens prototyping. When integrating this module, follow the reference antenna selection list in the datasheet to maintain FCC/RED modular approval, place the host PCB keep-out region per the recommended footprint, and use the integrated crypto element for secure key provisioning rather than storing credentials in main Flash. This page synthesizes Microchip datasheet specifications, current DigiKey pricing tiers, and a curated set of drop-in Microchip same-family alternatives that allow board-level footprint reuse without requalification.
ATSAMR21G18-MR210UAT - 2.4GHz Zigbee Module, 256KB Flash | Microchip
The Microchip Technology ATSAMR21G18-MR210UAT is a 2.4 GHz IEEE 802.15.4 compliant wireless module integrating an ATSAMR21G18A system-in-package (SiP) with on-module serial flash and a Microchip crypto-authentication device. Housed in a 42-pin surface-mount module footprint measuring 19 mm × 20 mm, the ATSAMR21G18-MR210UAT provides a U.FL antenna connector and supports up to 250 kbit/s over-the-air data rate with a +4 dBm typical transmit power for Zigbee and Thread mesh networks. An IEEE 802.15.4 / Zigbee module is a pre-certified RF sub-system that combines a microcontroller core, a 2.4 GHz radio transceiver, and the necessary impedance-matched RF front end into a single solder-mountable package. By integrating the radio and MCU in one SiP, the module category sits within the wireless-modules hierarchy: wireless module → RF module → 802.15.4 module → Zigbee module → wireless connectivity IC. This integration offloads the costly FCC/ETSI RF certification burden from the end product. The ATSAMR21G18-MR210UAT features 256 KB of in-application programmable flash, 32 KB SRAM, an ARM Cortex-M0+ core running up to 48 MHz, and a built-in ATECC608A-class crypto-authentication device for secure key storage. Its integrated 2.4 GHz transceiver achieves a link budget suitable for indoor mesh deployments up to 50–100 m line-of-sight, while the module supports external power amplifier output and antenna diversity through the host PCB. Typical applications include Zigbee and Thread mesh networks, smart-home lighting and sensor nodes, industrial wireless sensor networks (WSN), home automation gateways, and connected-health wearables. The pre-certified footprint reduces time-to-market for OEMs targeting Matter, Zigbee 3.0, or proprietary 802.15.4 stacks using the Atmel/Microchip ASF or Harmony 3 framework. The U.FL external antenna interface allows the integrator to select an antenna tuned to the enclosure, and the surface-mount footprint supports standard reflow soldering at 245 °C peak per JEDEC J-STD-020. Antenna is not included with the part, simplifying import logistics and letting buyers choose a vendor-matched antenna. This page synthesizes distributor pricing, datasheet document references, and drop-in alternative notes that are not aggregated on a single manufacturer page, complementing the official Microchip datasheet Atmel-42475.
AW-CU570 - Tri-Radio Wi-Fi 6 + BLE 5.3 + 802.15.4 Wireless MCU LGA
The AzureWave AW-CU570 is a highly integrated, low-power tri-radio Wireless MCU module based on the NXP RW612 SoC, combining Wi-Fi 6 (IEEE 802.11 a/b/g/n/ac/ax), Bluetooth Low Energy 5.2, and 802.15.4 (Thread/Zigbee) radios in a single surface-mount LGA package. It operates from a single 3.3 V power supply, integrates an Arm Cortex-M33 application MCU subsystem, and supports Matter over Wi-Fi and Matter over Thread for interoperable smart-home and industrial deployments. A wireless MCU (also called a Wi-Fi MCU module or tri-radio module) is a System-on-Module that combines an embedded microcontroller with one or more radio transceivers, providing a turnkey wireless connectivity solution for connected products. The product hierarchy places the AW-CU570 as: tri-radio module -> wireless MCU module -> IoT module -> embedded wireless subsystem. This integration eliminates the need to separately source and certify a discrete MCU plus a Wi-Fi/BLE combo chipset, simplifying FCC/ETSI/CE RF compliance and reducing BOM and time-to-market. Key features include dual-band 2.4/5/6 GHz Wi-Fi 6 (802.11ax) with WPA3 security, Bluetooth LE 5.2 with LE Audio, 802.15.4 for Thread/Zigbee/Matter, an on-board PCB antenna option plus RF pin for external antenna, and Matter-ready application-layer interoperability. The module exposes SDIO/UART/USB/SPI/I2C host interfaces, multiple GPIO, and integrated flash + RAM sufficient for typical IoT firmware stacks. Designed for tight integration and security, the AW-CU570 includes hardware crypto acceleration and secure boot. Architecturally, the AW-CU570 leverages the NXP RW612 silicon, which uses a Cortex-M33 core for application processing and dedicated radio subsystems. By integrating the matching RF front-end, balun, and crystal into a pre-certified LGA module, AzureWave eliminates the most common sources of Wi-Fi/BLE RF failures (mismatch, harmonics, EMI re-radiation) and allows the host PCB to be designed with minimal RF expertise. Typical applications include connected smart-home appliances (Matter-over-Wi-Fi lighting, locks, thermostats), enterprise and industrial IoT gateways, smart energy metering, asset tracking and smart accessories, and Matter-over-Thread border routers. The single-rail 3.3 V supply and small footprint also suit battery-powered wearables. When designing in this module, follow AzureWave's reference design for the host PCB keep-out area around the antenna, honor the module's thermal and supply-rail decoupling guidelines, and ensure the chosen regulatory domain (FCC/IC/CE/TELEC/MIC) is supported on the part variant ordered. The module is pre-certified only as a component - the final product still requires an unintentional-radiator / SAR / host-integrator review. This page synthesizes distributor pricing, drop-in module alternative sourcing, and practical host-PCB design notes that go beyond the AzureWave datasheet summary, helping hardware engineers evaluate the AW-CU570 against alternative tri-radio modules.
AX200NGW - Wi-Fi 6 2x2 2.4Gbps M.2 2230 Module | Intel
The Intel AX200NGW is a Wi-Fi 6 (IEEE 802.11ax) wireless adapter module delivering peak data rates up to 2.4 Gbps, 2x2 MU-MIMO with 160 MHz channel width, and integrated Bluetooth 5.2 connectivity, packaged as an M.2 2230 (E-key) form-factor module. A Wi-Fi adapter module is a complete wireless subsystem that combines an RF transceiver, baseband processor, MAC, and antenna interfaces on a single standardized card. Within the networking hierarchy, the AX200NGW sits in the wireless module family: RF transceiver -> wireless network adapter -> Wi-Fi/Bluetooth combo module -> client connectivity subsystem. Its M.2 2230 footprint follows the NGFF (Next Generation Form Factor) standard used across laptops, desktop motherboards, and embedded systems. Key features include support for UL and DL OFDMA (Orthogonal Frequency-Division Multiple Access) and 1024QAM modulation, which Intel states deliver nearly 40% higher peak data rates and up to 4x network capacity versus prior-generation 802.11ac adapters. Wi-Fi CERTIFIED 6 certification ensures interoperability with the Wi-Fi Alliance ecosystem. Dual-band operation covers the 2.4 GHz and 5 GHz ISM bands. Architecturally, the AX200 attaches via a PCI Express (PCIe) host interface for Wi-Fi data traffic and a separate USB interface for the Bluetooth 5.2 radio. The 2x2 antenna configuration uses two U.FL/MHF4 antenna connectors, enabling spatial-stream multiplexing and beamforming with compatible access points. Typical applications include desktop PC Wi-Fi upgrades via PCIe adapter kits, laptop Wi-Fi replacement (M.2 Key E or Key A/E slots), industrial gateways, and IoT edge devices requiring Wi-Fi 6 air-interface efficiency. OFDMA and target wake time features also reduce latency and battery drain in densely deployed networks. Design consideration: verify host compatibility - some platforms (notably certain 6th-generation Intel CPU laptops) have BIOS-level lockouts, and AMD platforms require driver support but generally work on recent kernels. Confirm CNVio versus standard PCIe distinction: AX200 is standard PCIe, unlike the CNVio2-based AX201. This page synthesizes verified datasheet data, distributor sourcing information, drop-in alternatives, and practical compatibility notes not found in the Intel module brief alone.
AX210NGW - Wi-Fi 6E 2x2 + BT 5.3 M.2 Module | Intel
The Intel AX210NGW is a Wi-Fi 6E (802.11ax) 2x2 MIMO wireless module with integrated Bluetooth 5.3, delivered on an M.2 2230 form factor with an E-key edge connector. It supports tri-band operation on 2.4 GHz, 5 GHz, and the newly opened 6 GHz band, with a maximum PHY data rate of approximately 2.4 Gbps at 160 MHz channel width. A Wi-Fi module is a complete wireless subsystem combining RF transceiver, baseband MAC, and antenna interfaces into a single replaceable card. In the system hierarchy it sits below the host OS driver stack and connects to the platform over a PCIe interface for Wi-Fi traffic and a USB interface for the Bluetooth controller. Key differentiating features include Wi-Fi 6E 6 GHz support for cleaner spectrum and lower interference, 1024-QAM modulation with OFDMA and UL/DL MU-MIMO for dense environments, Target Wake Time (TWT) for battery savings in portable devices, and vPro-capable variants for enterprise manageability. The module uses Intel's integrated MAC/baseband/radio architecture in a compact 2230 (22 mm x 30 mm) M.2 card, requiring only a standard M.2 Key A or Key E slot with PCIe and USB routing. It is RoHS compliant and manufactured by Intel Corporation. Typical applications include laptop and notebook Wi-Fi upgrades, desktop Wi-Fi via M.2 adapter brackets, industrial gateways needing tri-band connectivity, and replacement of older AC 7265/8265 cards in standard NGFF slots. Design consideration: the AX210NGW uses standard PCIe (not CNVio2), making it compatible with AMD and Intel platforms alike, but BIOS whitelisting can block installation in some laptops. This page synthesizes distributor pricing, drop-in alternatives, and practical compatibility notes not found in the manufacturer datasheet.
BLE112-A-V1 - Bluetooth 4.0 BLE Module w/ Chip Antenna | Silicon Labs
The Silicon Labs BLE112-A-V1 is a Class 2 Bluetooth 4.0 low energy single-mode module with an integrated chip antenna, targeting low-power sensors and accessories. It integrates the Bluetooth radio, a microcontroller (based on the TI CC2540), the full BLE software stack, profiles, and customer application space, so no external processor is needed. The module operates from 2.0V to 3.6V and can be powered directly from a standard 3V coin cell or a pair of AAA batteries; in its lowest-power sleep mode it consumes only 400nA and wakes in a few hundred microseconds. A Bluetooth low energy (BLE) module is a type of short-range RF transceiver module in the wireless connectivity family: module -> Bluetooth Low Energy transceiver -> 2.4GHz ISM-band radio -> RF & wireless component. Single-mode BLE devices (Bluetooth Smart) communicate only with BLE-capable devices, offering the lowest possible power consumption compared to dual-mode parts. Key features include full Bluetooth v4.0 single-mode compliance, an integrated chip antenna that eliminates RF layout work, flexible hardware interfaces (SPI and UART) for connecting sensors, user interfaces, or displays directly to the module, and an integrated 8051-based MCU with 18 interrupt sources across six interrupt groups running the Bluegiga (now Silicon Labs) Bluetooth stack. Technically, the module builds on the CC2540 system-on-chip, which combines a 2.4GHz RF transceiver with an industry-standard enhanced 8051 MCU. The Bluegiga firmware implements the complete BLE stack and profiles such as GATT, GAP, and vendor-specific profiles, exposing a simple serial interface for host-less designs. Receiver sensitivity is specified at -85dBm at 0.1% BER, adequate for Class 2 (~10 m line-of-sight) links typical of sensor and accessory designs. Typical applications include battery-powered sensor nodes, fitness and medical accessories, proximity tags, and cable-replacement serial links (UART bridges), where coin-cell life measured in months or years is a hard requirement. Design consideration: keep a keep-out area under the chip antenna free of copper and adjacent RF-absorbing materials, and budget the 2.0V-3.6V supply range so a 3V coin cell remains usable near end of discharge. This page synthesizes distributor pricing, lifecycle status, family replacement options, and practical design notes not found in the manufacturer datasheet.
BLE112-A-V1C - BLE 4.0 Module with U.FL Antenna | Silicon Labs
The Silicon Labs BLE112-A-V1C is a Class 2 Bluetooth Smart (Bluetooth v4.0 single mode) module with a U.FL antenna connector, operating in the 2.4 GHz ISM band at data rates up to 2 Mbps from a 2 V to 3.6 V supply on a 32-pin SMD module footprint. It is the external-antenna variant of the Bluegiga BLE112 family, targeted at low-power sensors and wireless accessories. A Bluetooth Low Energy module is a complete wireless subsystem that integrates a BLE radio, a microcontroller, an antenna or antenna connector, and a certified protocol stack into a single surface-mount package. Within the wireless hierarchy, it sits below full Bluetooth systems and above bare radio chips, allowing designers to add BLE connectivity without developing RF layout, antenna matching, or regulatory certification themselves. Key features include Bluetooth v4.0 single-mode compliance, support for both master and slave roles with 4 or more simultaneous connections in master mode, and an integrated Bluetooth Low Energy stack covering GAP, GATT, L2CAP, SMP, and BLE profiles. The fully integrated approach combines radio, microcontroller, and software stack in one certified module, dramatically reducing development effort. Technically, the module integrates the BLE radio transceiver with an on-board microcontroller running the Bluegiga Bluetooth Smart software, so host processors can communicate over a simple interface or the application can run entirely on-module. The U.FL connector permits an external antenna for optimized range and enclosure flexibility, distinguishing the -V1C variant from the chip-antenna BLE112-A-V1. Typical applications include battery-powered sensor nodes, proximity beacons, fitness and health accessories, and industrial wireless monitoring where a Class 2 link with an externally optimized antenna is preferred. The 2 V to 3.6 V supply range allows direct operation from a coin-cell battery. Design consideration: the U.FL variant requires a mating antenna assembly (U.FL to SMA pigtail plus antenna) in the bill of materials, and the 50-ohm transmission line to the connector should follow controlled-impedance layout practice on the host PCB. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
BLE112-E-V1 - Bluetooth 4.0 BLE Module U.FL | Silicon Labs
The Silicon Labs BLE112-E-V1 is a Bluetooth v4.0 single-mode Bluetooth Low Energy (BLE) transceiver module operating in the 2.4 GHz ISM band, offering 2 Mbps over-the-air data rate, -91 dBm receiver sensitivity, and a supply voltage range of 2.0 V to 3.6 V. The E-version variant features a U.FL RF connector for an external antenna, in a surface-mount module package, and is classified as a Bluetooth Class 2 device. A Bluetooth Low Energy module is an integrated wireless subsystem that combines a 2.4 GHz radio transceiver, a microcontroller, an antenna feed, and a complete BLE software stack on a pre-certified printed circuit assembly. Within the wireless connectivity hierarchy, it sits below full custom radio designs (lower integration effort) and above bare wireless MCUs (higher ease of use), making BLE modules the fastest route to adding short-range, ultra-low-power connectivity to a product. Key features of the BLE112-E-V1 include full Bluetooth 4.0 single-mode compliance, an integrated radio, microcontroller and software stack in one package, an 18-source interrupt controller, and support for power modes 1 and 2 in which the sleep timer keeps running to minimize average current draw. The module is targeted specifically at low-power sensors and accessories where battery life, not throughput, is the primary design constraint. Technically, the module is built around the CC2540 Bluetooth SoC, which pairs an industry-standard 8051 core with a 2.4 GHz RF transceiver. Peripheral peripherals can choose between two alternate I/O pin locations for layout flexibility, and an ultra-low-power sleep timer uses an external 32.768 kHz crystal oscillator. Receiver sensitivity of -91 dBm provides practical indoor range for a Class 2 device, while the 2 Mbps PHY minimizes radio-on time. Typical applications include battery-powered sensor nodes and beacons, wireless health and fitness accessories, smart-home sensor peripherals, and RS232-over-BLE cable replacement links in industrial equipment. When designing with the BLE112-E-V1, plan the power budget around sleep modes and remember that the E variant requires an external antenna connected via the U.FL receptacle; the -A variant integrates the antenna on the PCB instead. Supply rails must stay within 2.0 V to 3.6 V, ideally from a primary lithium or single Li-Ion cell. This page synthesizes verified distributor pricing, drop-in same-family alternatives, and practical design guidance not consolidated in the manufacturer datasheet.