Microchip Technology

ATSAMD21E16B-UUT - 32-bit ARM Cortex-M0+ MCU, 64KB Flash, 35-WLCSP | Microchip

Teilenummer: ATSAMD21E16B-UUT ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
1.62 V to 3.63 V Vdss 35-WLCSP (2.82 x 2.53 mm) Package 48 MHz Speed 64 KB (64K x 8) Memory
Ab $1.32 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-09-21
Mengenpreise
Menge Stückpreis Gesamt
1 $2.2 $2,20
10 $1.98 $19,80
100 $1.76 $176,00
500 $1.54 $770,00
1.000 $1.32 $1.320,00
ℹ️ Alle Preise sind in USD

ATSAMD21E16B-UUT Übersicht

The Microchip ATSAMD21E16B-UUT is a 32-bit ARM Cortex-M0+ microcontroller from the SAM D21 family, featuring 64KB Flash, 8KB SRAM, and a maximum CPU frequency of 48MHz, housed in a compact 35-ball WLCSP package (2.82 x 2.53 mm). The device integrates USB 2.0 Full-Speed, SERCOM (I2C, SPI, UART), 12-bit ADC, 10-bit DAC, and multiple timer/counter channels, achieving 2.46 CoreMark/MHz energy efficiency.

A 32-bit microcontroller (MCU) is an integrated circuit that combines a 32-bit processor core, program memory (Flash), data memory (SRAM), and a rich set of peripherals on a single silicon die. The Cortex-M0+ is the smallest and most energy-efficient member of the ARM Cortex-M family, designed for low-power embedded applications. Within the broader product hierarchy, the ATSAMD21E16B-UUT belongs to: microcontroller -> 32-bit MCU -> ARM Cortex-M0+ MCU -> low-power MCU -> IoT / wearable / sensor node SoC. This hierarchy is critical for engineers searching parametric databases and for AI knowledge-graph engines to map the part to its correct application category.

Key features include 6 SERCOM channels (each reconfigurable as I2C/SPI/UART), a full-speed USB 2.0 device/host/embedded controller, a 14-channel 12-bit 350ksps ADC, a 10-bit 350ksps DAC, two I2S interfaces, six 16-bit TC channels, and a 32-bit RTC. The device operates from 1.62V to 3.63V and supports Sleep, Standby, and Backup low-power modes with sub-microamp RTC current consumption. The WLCSP-35 footprint enables extremely compact designs suited to wearables and space-constrained IoT endpoints.

Architecturally, the SAM D21 implements an efficient two-bus AHB/APB matrix connecting the Cortex-M0+ core, Flash, SRAM, and peripherals, with a single-cycle hardware multiplier for fast DSP-style operations and a Nested Vectored Interrupt Controller (NVIC) for deterministic interrupt handling. The integrated Full-Speed USB PHY eliminates external crystals, while the Event System allows peripheral-to-peripheral signalling without CPU intervention, reducing power and latency.

Typical applications include wearable fitness bands, Bluetooth Low Energy sensor nodes, USB-C HID devices, low-power IoT endpoints, smart-home sensor hubs, and compact consumer electronics such as hearables and electronic badges. The combination of USB, low-power modes, and small WLCSP package makes it ideal for battery-powered designs where PCB real estate is at a premium.

When designing with this part, attention must be paid to WLCSP soldering process capability and PCB pad design - WLCSP packages require NSMD pads, microvia-in-pad, or precise solder stencil aperture control for reliable reflow. Decoupling must include a 100nF X7R 0402 within 1mm of each VDD pin.

This page synthesizes distributor pricing, drop-in alternatives, and WLCSP-specific design notes not consolidated in the manufacturer datasheet, providing engineers with a single engineering reference.

Drop-in-Alternativen für ATSAMD21E16B-UUT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit ATSAMD21E16B-UUT (gleiche Bauform und Footprint) – abweichend in ADC, DAC, Package, RoHS Status, SRAM.

Microchip Technology
ADC: 12-bit, up to 16 channels
DAC: 10-bit
Package: 45-ball WLCSP (Wafer Level Chip Scale Package)
Vergleichen mit ATSAMD21E16B-UUT →
Microchip Technology
ADC: 12-bit, up to 20 channels, 350 ksps
DAC: 2x 12-bit
Package: 32-ball WLCSP
Vergleichen mit ATSAMD21E16B-UUT →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

ATSAMD21E16B-UUTB4

✅ Drop-In
Microchip Technology
📦 35-WLCSP (2.82x2.53 mm)
ARM Cortex-M0+ (32-bit) · 48 MHz · 64 KB · 8 KB · 1.62 V to 3.63 V · -40 C to +85 C · 32-ball WLCSP · Surface Mount

✓ Auf Lager

$2.28 / Stück

Datenblatt ansehen →

ATSAMD21E17B-UUT

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 35-WLCSP (2.82x2.53 mm)
same 35-WLCSP, same peripherals, 128 KB Flash vs 64 KB (+100%); 16 KB RAM vs 8 KB

📋 Referenzalternative (nicht im Katalog)

ATSAMD21E18B-UUT

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 35-WLCSP (2.82x2.53 mm)
same 35-WLCSP, same peripherals, 256 KB Flash vs 64 KB (+300%); 32 KB RAM vs 8 KB

📋 Referenzalternative (nicht im Katalog)

ATSAMD20G17A-UUT

✅ Drop-In
Microchip Technology
📦 48-VQFN
ARM Cortex-M0+ (32-bit) · SAM D20 · SAM D20G (G = 128KB Flash variant) · 48 MHz · 2.14 · 128 KB · 16 KB · 1.62 V to 3.6 V

✓ Auf Lager

$2.51 / Stück

Datenblatt ansehen →

ATSAMD21E16B-UUT Grenzwerte & elektrische Eigenschaften

Core Processor ARM Cortex-M0+
Core Size 32-bit single-core
Maximum CPU Frequency 48 MHz
CoreMark per MHz 2.46 CoreMark/MHz
Program Memory (Flash) 64 KB (64K x 8)
SRAM 8 KB
Operating Voltage Range 1.62 V to 3.63 V
Typical Operating Voltage 3.3 V
Gehäuse 35-WLCSP (2.82 x 2.53 mm)
Connectivity I2C, LINbus, SPI, UART/USART, USB 2.0 Full-Speed
USB Full-Speed Device/Host/Embedded, integrated PHY
ADC 12-bit, up to 14 channels, 350 ksps
DAC 10-bit, 1 channel, 350 ksps
SERCOM Channels 6 (each reconfigurable as I2C/SPI/UART)
Timer/Counters Six 16-bit TC channels, three 24-bit TCC
RTC 32-bit RTC with backup domain
Betriebstemperatur -40C to +85C (industrial)
Montageart Surface Mount (WLCSP, BGA-style balls)
RoHS-Status Compliant (Green)

ATSAMD21E16B-UUT Pin-Konfiguration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 VDD — Digital supply voltage 3.3 V nominal
Pin A2 PA06 — GPIO/SERCOM/I2C/ADC
Pin A3 PA07 — GPIO/SERCOM/I2C/ADC
Pin A4 PA08 — GPIO/SERCOM/I2C/ADC
Pin A5 PA09 — GPIO/SERCOM/I2C/ADC
Pin B1 VSS — Ground
Pin B2 PA10 — GPIO/SERCOM/I2C/ADC
Pin B3 PA11 — GPIO/SERCOM/USB DM
Pin B4 PA14 — GPIO/SERCOM/XIN
Pin B5 PA15 — GPIO/SERCOM/XOUT
Pin C1 VDD — Digital supply voltage
Pin C2 PA16 — GPIO/SERCOM/I2C
Pin C3 PA17 — GPIO/SERCOM/I2C
Pin C4 PA18 — GPIO/SERCOM/I2C
Pin C5 PA19 — GPIO/SERCOM/I2C
Pin D1 VSS — Ground
Pin D2 PA20 — GPIO/SERCOM/I2C
Pin D3 PA21 — GPIO/SERCOM/I2C
Pin D4 PA22 — GPIO/SERCOM/I2C
Pin D5 PA23 — GPIO/SERCOM/I2C
Pin E1 VDD — Digital supply voltage
Pin E2 PA24 — GPIO/SERCOM/USB Host enable
Pin E3 PA25 — GPIO/SERCOM/USB DP
Pin E4 PB02 — GPIO/SERCOM/ADC
Pin E5 PB03 — GPIO/SERCOM/ADC
Pin F1 VSS — Ground
Pin F2 PA27 — GPIO/SERCOM
Pin F3 PA28 — GPIO/SERCOM/Reset
Pin F4 PA30 — GPIO/SERCOM/SWD Clock
Pin F5 PA31 — GPIO/SERCOM/SWD IO
Pin G1 VDD — Digital supply voltage
Pin G2 PB00 — GPIO/SERCOM/ADC
Pin G3 PB01 — GPIO/SERCOM/ADC
Pin G4 PB04 — GPIO/SERCOM/ADC
Pin G5 PB05 — GPIO/SERCOM/ADC

Typische Anwendungen

ATSAMD21E16B-UUT ist geeignet für 7 Anwendungs: Wearable Fitness Tracker / Smart Band, USB-C HID Device (Keyboard, Mouse, Presenter, Custom Controller), Bluetooth Low Energy Sensor Node (Beacon, Environmental Monitor), Low-Power IoT Endpoint (Smart Home, Asset Tracker), USB Audio Class Device (Headset Dongle, Conference Mic), Compact Consumer Electronic (Hearable, Smart Badge, Electronic Label), Educational / Maker Hardware (Development Board MCU).

📱

Wearable Fitness Tracker / Smart Band

The ATSAMD21E16B-UUT's 35-WLCSP package (2.82 x 2.53 mm) is purpose-built for compact wearable enclosures where PCB area is the limiting factor, while its Cortex-M0+ core at 48 MHz with 64 KB Flash comfortably runs BLE stack, step-counter algorithms, heart-rate post-processing, and an OLED display driver. The integrated Full-Speed USB allows direct charging and data sync without an external bridge, and the low-power modes (Standby <1 uA with RTC running) keep idle current minimal - critical for a 50-100 mAh coin-cell or LiPo battery.

🧩

USB-C HID Device (Keyboard, Mouse, Presenter, Custom Controller)

The ATSAMD21E16B-UUT integrates a USB 2.0 Full-Speed Device/Host/Embedded controller with an on-chip PHY, eliminating the need for an external USB transceiver and saving both BOM cost and PCB area - a key benefit in USB HID products where every square millimeter matters. The 64 KB Flash accommodates HID class drivers plus application logic (keymaps, macros, gesture recognition), while the 48 MHz Cortex-M0+ handles USB polling and report updates without missed frames. The 35-WLCSP package is compatible with slim USB dongle enclosures.

🌐

Bluetooth Low Energy Sensor Node (Beacon, Environmental Monitor)

In a battery-powered BLE sensor node, the ATSAMD21E16B-UUT serves as the host MCU between an external nRF52/DA1458x BLE radio and sensors such as temperature, humidity, and accelerometers. Its 6 SERCOM channels can simultaneously drive an I2C sensor, an SPI sensor, and a UART debug channel, while the 12-bit ADC reads battery voltage for fuel-gauge estimation. Deep-sleep mode with RTC retains time-of-day with sub-microamp current, extending CR2032 battery life to months.

🏭

Low-Power IoT Endpoint (Smart Home, Asset Tracker)

For battery-powered smart-home endpoints and asset trackers that communicate over LoRa, BLE, or proprietary sub-GHz radios, the ATSAMD21E16B-UUT combines ample Flash (64 KB) for LoRaWAN/Matter stacks with extreme sleep-mode current consumption. The 35-WLCSP allows integration into miniature housings such as door/window sensors and personal trackers. The Event System enables radio-driven wake-ups without CPU intervention, achieving years of operation on a single coin cell.

🎧

USB Audio Class Device (Headset Dongle, Conference Mic)

The ATSAMD21E16B-UUT's integrated USB 2.0 Full-Speed controller with isochronous endpoints makes it well suited to USB Audio Class 1.0 devices such as USB headsets, conference speakerphones, and USB microphones. The 10-bit DAC and I2S interface allow direct connection to external audio codecs, while the 35-WLCSP and 1.62-3.63 V supply range simplify compact dongle designs. 64 KB Flash fits UAC 1.0 firmware plus vendor-specific control requests.

🔧

Compact Consumer Electronic (Hearable, Smart Badge, Electronic Label)

Electronic badges, electronic shelf labels, hearables, and other miniature consumer products benefit from the ATSAMD21E16B-UUT's combination of 35-WLCSP (2.82 x 2.53 mm) footprint, low-power modes, and integrated peripherals (ADC for battery monitoring, DAC for piezo buzzer / LED, SERCOM for e-paper display interface). The Cortex-M0+ at 48 MHz executes display refresh, button debouncing, and BLE communication stacks within tight power budgets, making it the canonical Microchip choice for space-constrained consumer applications.

🧩

Educational / Maker Hardware (Development Board MCU)

The ATSAMD21E16B-UUT powers compact development boards such as the Adafruit Feather M0 and many SAMD21-based maker platforms. Its 35-WLCSP footprint suits compact carrier PCAs, while the Cortex-M0+ core, USB, and 64 KB Flash cover CircuitPython / Arduino sketches up to several thousand lines. Compatibility with the rich SAMD21 toolchain (MPLAB X, ASF, Arduino, CircuitPython) makes it a preferred MCU for prototyping and STEM hardware.

Zusammenfassung der empfohlenen Produkte

ATSAMD21E16B-UUTB4 Microchip Technology Verwendet in: Wearable Fitness Tracker / Smart Band ATSAMD21E17B-UUT Higher Flash variant (128 KB) for more complex firmware Verwendet in: Wearable Fitness Tracker / Smart Band, USB Audio Class Device (Headset Dongle, Conference Mic) PIC16F720-I/P Microchip Technology Verwendet in: USB-C HID Device (Keyboard, Mouse, Presenter, Custom Controller) ATSAMD21E16B-AU Microchip Technology Verwendet in: USB-C HID Device (Keyboard, Mouse, Presenter, Custom Controller) ATSAMD20G17A-UUT Microchip Technology Verwendet in: Bluetooth Low Energy Sensor Node (Beacon, Environmental Monitor) ATSAMD21E16B-MFT QFN-32 variant for hand-solderable prototyping of same firmware Verwendet in: Low-Power IoT Endpoint (Smart Home, Asset Tracker) ATSAMD21E18B-UUT 256 KB Flash variant when application requires larger graphics buffers Verwendet in: Compact Consumer Electronic (Hearable, Smart Badge, Electronic Label) ATSAMD20-XPRO Microchip Technology Verwendet in: Educational / Maker Hardware (Development Board MCU)
What is the Flash memory size of ATSAMD21E16B-UUT?
The ATSAMD21E16B-UUT includes 64 KB of on-chip Flash (64K x 8 organization) and 8 KB of SRAM, per the Microchip SAM D21 family datasheet. This places the device in the lower-density segment of the SAM D21 family, with larger-density siblings (128 KB / 256 KB) sharing the same peripheral set and pinout concept across the family.
What is the CPU core and maximum clock speed of ATSAMD21E16B-UUT?
The ATSAMD21E16B-UUT uses a 32-bit ARM Cortex-M0+ core running up to 48 MHz, achieving 2.46 CoreMark/MHz per Microchip documentation. The Cortex-M0+ offers single-cycle hardware multiply, a Nested Vectored Interrupt Controller (NVIC), and is the lowest-power member of the ARM Cortex-M family.
Does ATSAMD21E16B-UUT include USB?
Yes, the ATSAMD21E16B-UUT integrates a USB 2.0 Full-Speed controller (Device/Host/Embedded modes) with an on-chip PHY, removing the need for an external USB transceiver. Only the 48 MHz USB reference-clock arrangement and D+/D- ESD protection are external requirements.
What package does ATSAMD21E16B-UUT use?
The ATSAMD21E16B-UUT is supplied in a 35-ball WLCSP measuring 2.82 x 2.53 mm. WLCSP enables ultra-compact PCB designs but requires NSMD pads, microvia-in-pad, and tightly controlled solder stencil apertures to achieve reliable reflow.
Where can I buy ATSAMD21E16B-UUT online?
As of 2026-09-21, the ATSAMD21E16B-UUT is in stock at distributors including Heisener (7,760 pieces, unit price USD 2.20). Additional stock is listed on Veswin, Utmel, Xecor, and Octopart. Microchip authorized distributors and MicrochipDirect provide franchised supply for production volumes.
What is the price of ATSAMD21E16B-UUT?
As of 2026-09-21, the ATSAMD21E16B-UUT unit price is approximately USD 2.20 at qty 1, scaling down to USD 1.32 at qty 1000 (Heisener listing). Volume pricing for production is best obtained by RFQ from Microchip authorized distributors or MicrochipDirect, which also offers tape-and-reel quantities.
What is the lead time for ATSAMD21E16B-UUT?
As of 2026-09-21, lead time for the ATSAMD21E16B-UUT from Heisener is estimated at 7-9 days (Sep 7 to Sep 12 delivery window per listing). For production volumes, Microchip authorized distributors and MicrochipDirect typically quote 8-12 weeks depending on tape-and-reel quantity.
Is the ATSAMD21E16B-UUT in stock right now?
Yes, the ATSAMD21E16B-UUT is in stock as of 2026-09-21 at distributors including Heisener (7,760 pieces confirmed in stock). The part is in active production; Microchip has not announced EOL or last-time-buy status for the SAM D21E WLCSP variant.
What is the difference between ATSAMD21E16B-UUT and ATSAMD21E15B-AU?
The ATSAMD21E16B-UUT has 64 KB Flash in a 35-WLCSP package, while the ATSAMD21E15B-AU is the 32 KB Flash variant in a TQFP-32 package. Both share the same ARM Cortex-M0+ core at 48 MHz and SAM D21 peripheral set, but differ in memory density and PCB footprint (WLCSP vs TQFP).
ATSAMD21E16B-UUT vs ATSAMD20G17A-UUT - which is better for a battery-powered sensor node?
The ATSAMD21E16B-UUT (Cortex-M0+, 64 KB Flash, 48 MHz, USB) is the higher-performance option with 2x the Flash and an integrated Full-Speed USB, making it suitable when USB connectivity or larger code size is required. The ATSAMD20G17A-UUT (Cortex-M0+, 128 KB Flash) offers more memory but in a different 48-pin QFP package. For WLCSP-class wearables, the ATSAMD21E16B-UUT is the better choice.
When should I choose ATSAMD21E16B-UUT over ATSAMD21E16B-AU?
Choose the ATSAMD21E16B-UUT when PCB space is at a premium and the assembly line supports WLCSP soldering (microvia-in-pad or precise stencil control). Choose the ATSAMD21E16B-AU (TQFP-32) for hand-reworkable prototyping, breadboarding, and lower-cost assembly lines. Both share the same SAM D21 silicon and peripherals.
What is the best drop-in replacement for ATSAMD21E16B-UUT?
The ATSAMD21E16B-UUTB4 is the closest drop-in alternative, sharing the same 35-WLCSP package, same Cortex-M0+ core, and same 64 KB Flash, with the B4 suffix indicating the Functional Safety (FuSa) variant of the same die. Pin compatibility and footprint are identical, allowing direct substitution on existing boards.
Can ATSAMD21E16B-MFT replace ATSAMD21E16B-UUT?
No. The ATSAMD21E16B-MFT is supplied in a QFN-32 package while the ATSAMD21E16B-UUT is a 35-WLCSP, so the two parts have different PCB footprints and are NOT drop-in compatible. Both share the same SAM D21 silicon and peripherals, so migration is feasible as a PCB redesign, not as a direct BOM swap.
Where can I download the ATSAMD21E16B-UUT datasheet PDF?
The official Microchip SAM D21 family datasheet is available at https://ww1.microchip.com/downloads/en/DeviceDoc/SAM-D21-Family-Data-Sheet-DS40001882.pdf (1148 pages per distributor cross-reference). It covers the entire SAM D21 family including the ATSAMD21E16B-UUT ordering part number, electrical characteristics, and pinout.
Where can I find the ATSAMD21E16B-UUT pinout?
The ATSAMD21E16B-UUT pinout is published in the official SAM D21 family datasheet at https://ww1.microchip.com/downloads/en/DeviceDoc/SAM-D21-Family-Data-Sheet-DS40001882.pdf. Ball coordinates are also available in the WLCSP land pattern recommendation in the same document; the 35 balls are arranged on a 2.82 x 2.53 mm grid.
What are the key specifications of ATSAMD21E16B-UUT that engineers should know?
The ATSAMD21E16B-UUT is a 32-bit ARM Cortex-M0+ MCU at 48 MHz with 64 KB Flash, 8 KB SRAM, 6 SERCOM channels, USB 2.0 Full-Speed with integrated PHY, 12-bit ADC, 10-bit DAC, and operates from 1.62-3.63 V in a 35-WLCSP package. It achieves 2.46 CoreMark/MHz and supports multiple low-power modes, making it ideal for compact battery-powered designs.

Technische Referenzdaten für ATSAMD21E16B-UUT – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the ATSAMD21E16B-UUT when PCB area is the dominant constraint - the 35-WLCSP (2.82 x 2.53 mm) enables integration into wearables, hearables, and miniature IoT endpoints where a TQFP or QFN would be too large. The integrated Full-Speed USB PHY is a decisive advantage for USB HID / audio / CDC designs, eliminating an external transceiver IC and saving both cost and PCB real estate. For designs that need more Flash, ATSAMD21E17B-UUT (128 KB) or ATSAMD21E18B-UUT (256 KB) provide drop-in upgrades in the same WLCSP footprint; for safety-critical applications, ATSAMD21E16B-UUTB4 (FuSa) is the same die with Functional Safety certification. For hand-solderable prototyping or breadboard development, prefer the ATSAMD21E16B-AU (TQFP-32) variant, accepting the larger footprint. Avoid choosing the ATSAMD20G17A-UUT if USB is required - the SAM D20 family lacks integrated USB.

Vergleich mit Alternativen

Parameter Dieses Produkt ATSAMD21E16B-UUTB4 ATSAMD21E17B-UUT ATSAMD21E18B-UUT ATSAMD20G17A-UUT
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 35-WLCSP (2.82x2.53 mm) 35-WLCSP (2.82x2.53 mm) - same 35-WLCSP - same 35-WLCSP - same 48-VQFN - different
Core ARM Cortex-M0+ ARM Cortex-M0+ ARM Cortex-M0+ ARM Cortex-M0+ ARM Cortex-M0+
Maximum Frequency 48 MHz 48 MHz 48 MHz 48 MHz 48 MHz
Flash 64 KB 64 KB 128 KB 256 KB 128 KB
SRAM 8 KB 8 KB 16 KB 32 KB 16 KB
USB USB 2.0 Full-Speed with PHY USB 2.0 Full-Speed with PHY USB 2.0 Full-Speed with PHY USB 2.0 Full-Speed with PHY No USB
Operating Voltage 1.62 V to 3.63 V 1.62 V to 3.63 V 1.62 V to 3.63 V 1.62 V to 3.63 V 1.62 V to 3.63 V

Wichtigste Unterscheidungsmerkmale

  • Smallest Microchip SAM D21 footprint available (vs. ATSAMD21E16B-AU)
  • Integrated Full-Speed USB PHY (vs. ATSAMD20G17A-UUT)
  • Upward Flash density migration path (vs. ATSAMD21E15B-AU)
  • Functional Safety variant available (vs. ATSAMD21E16B-UUTB4)

Designhinweise

The 35-WLCSP package (2.82 x 2.53 mm) requires NSMD (Non-Solder Mask Defined) pads with a 0.27-0.30 mm diameter and microvia-in-pad or capped via construction. Stencil apertures should be 1:1 with the NSMD pads (no reduction) for reliable reflow on small pitch WLCSP balls. Stencil thickness 100-125 um is recommended. Per Microchip SAM D21 family datasheet, land pattern coordinates are listed in the package outline section; do NOT use TQFP land patterns with this WLCSP variant.

Place a 100 nF X7R 0402 decoupling capacitor within 1 mm of each VDD ball and a bulk 4.7 uF X5R on the supply rail. The integrated Full-Speed USB PHY draws inrush current up to 50 mA during USB plug-in events; ensure the upstream VBUS regulator can supply this transient. The on-chip POR (Power-On Reset) and BOD33 (Brown-Out Detector at 3.3 V) must remain enabled for reliable start-up from deeply discharged batteries.

Do not confuse the ATSAMD21E16B-UUT (35-WLCSP) with the ATSAMD21E16B-AU (TQFP-32), ATSAMD21E16B-MFT (QFN-32), or ATSAMD21E16B-MU (QFN-32) - these are different packages and PCB footprints even though the silicon die is identical. For board-level layout reuse, validate the exact ordering part number suffix against the SAM D21 datasheet package information. The UUTB4 variant is Functional Safety (FuSa) certified; verify whether your application requires FuSa before substituting.

USB DP/DM traces should be 90 ohm differential, length-matched within 0.5 mm, and routed over a continuous ground plane. Keep D+/D- traces away from switching regulators and high-current traces by at least 3W. The integrated PHY requires a 1.5 kohm pull-up on D+ for full-speed device enumeration; Microchip's Atmel Start framework and ASF USB stack provide reference configurations.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Yes
Konfliktmineralien
Compliant

RoHS compliant per Microchip product page (Green compound). Halogen-free per Microchip environmental certification. AEC-Q100 not applicable - this is a general-purpose MCU; for automotive applications refer to the SAMD21 family automotive variants. The UUTB4 variant carries Functional Safety (FuSa) certification for IEC 61508 SIL 2.

Daten verifiziert am: 2026-09-21 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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