ATSAMD21E16B-UUT - 32-bit ARM Cortex-M0+ MCU, 64KB Flash, 35-WLCSP | Microchip
Référence : ATSAMD21E16B-UUT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.2 | $2,20 |
| 10 | $1.98 | $19,80 |
| 100 | $1.76 | $176,00 |
| 500 | $1.54 | $770,00 |
| 1 000 | $1.32 | $1 320,00 |
ATSAMD21E16B-UUT Présentation
A 32-bit microcontroller (MCU) is an integrated circuit that combines a 32-bit processor core, program memory (Flash), data memory (SRAM), and a rich set of peripherals on a single silicon die. The Cortex-M0+ is the smallest and most energy-efficient member of the ARM Cortex-M family, designed for low-power embedded applications. Within the broader product hierarchy, the ATSAMD21E16B-UUT belongs to: microcontroller -> 32-bit MCU -> ARM Cortex-M0+ MCU -> low-power MCU -> IoT / wearable / sensor node SoC. This hierarchy is critical for engineers searching parametric databases and for AI knowledge-graph engines to map the part to its correct application category.
Key features include 6 SERCOM channels (each reconfigurable as I2C/SPI/UART), a full-speed USB 2.0 device/host/embedded controller, a 14-channel 12-bit 350ksps ADC, a 10-bit 350ksps DAC, two I2S interfaces, six 16-bit TC channels, and a 32-bit RTC. The device operates from 1.62V to 3.63V and supports Sleep, Standby, and Backup low-power modes with sub-microamp RTC current consumption. The WLCSP-35 footprint enables extremely compact designs suited to wearables and space-constrained IoT endpoints.
Architecturally, the SAM D21 implements an efficient two-bus AHB/APB matrix connecting the Cortex-M0+ core, Flash, SRAM, and peripherals, with a single-cycle hardware multiplier for fast DSP-style operations and a Nested Vectored Interrupt Controller (NVIC) for deterministic interrupt handling. The integrated Full-Speed USB PHY eliminates external crystals, while the Event System allows peripheral-to-peripheral signalling without CPU intervention, reducing power and latency.
Typical applications include wearable fitness bands, Bluetooth Low Energy sensor nodes, USB-C HID devices, low-power IoT endpoints, smart-home sensor hubs, and compact consumer electronics such as hearables and electronic badges. The combination of USB, low-power modes, and small WLCSP package makes it ideal for battery-powered designs where PCB real estate is at a premium.
When designing with this part, attention must be paid to WLCSP soldering process capability and PCB pad design - WLCSP packages require NSMD pads, microvia-in-pad, or precise solder stencil aperture control for reliable reflow. Decoupling must include a 100nF X7R 0402 within 1mm of each VDD pin.
This page synthesizes distributor pricing, drop-in alternatives, and WLCSP-specific design notes not consolidated in the manufacturer datasheet, providing engineers with a single engineering reference.
Alternatives de remplacement direct pour ATSAMD21E16B-UUT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAMD21E16B-UUT (même facteur de forme et même empreinte) — différant par ADC, DAC, Package, RoHS Status, SRAM.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAMD21E16B-UUTB4
✅ Remplacement direct✓ En stock
$2.28 / unité
Voir la fiche technique →ATSAMD21E17B-UUT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
ATSAMD21E18B-UUT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
ATSAMD20G17A-UUT
✅ Remplacement direct✓ En stock
$2.51 / unité
Voir la fiche technique →ATSAMD21E16B-UUT Valeurs maximales et caractéristiques électriques
| Core Processor | ARM Cortex-M0+ |
| Core Size | 32-bit single-core |
| Maximum CPU Frequency | 48 MHz |
| CoreMark per MHz | 2.46 CoreMark/MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| SRAM | 8 KB |
| Operating Voltage Range | 1.62 V to 3.63 V |
| Typical Operating Voltage | 3.3 V |
| Boîtier | 35-WLCSP (2.82 x 2.53 mm) |
| Connectivity | I2C, LINbus, SPI, UART/USART, USB 2.0 Full-Speed |
| USB | Full-Speed Device/Host/Embedded, integrated PHY |
| ADC | 12-bit, up to 14 channels, 350 ksps |
| DAC | 10-bit, 1 channel, 350 ksps |
| SERCOM Channels | 6 (each reconfigurable as I2C/SPI/UART) |
| Timer/Counters | Six 16-bit TC channels, three 24-bit TCC |
| RTC | 32-bit RTC with backup domain |
| Température de fonctionnement | -40C to +85C (industrial) |
| Type de montage | Surface Mount (WLCSP, BGA-style balls) |
| Statut RoHS | Compliant (Green) |
Configuration des broches de ATSAMD21E16B-UUT
| Broche A1 | VDD — Digital supply voltage 3.3 V nominal |
| Broche A2 | PA06 — GPIO/SERCOM/I2C/ADC |
| Broche A3 | PA07 — GPIO/SERCOM/I2C/ADC |
| Broche A4 | PA08 — GPIO/SERCOM/I2C/ADC |
| Broche A5 | PA09 — GPIO/SERCOM/I2C/ADC |
| Broche B1 | VSS — Ground |
| Broche B2 | PA10 — GPIO/SERCOM/I2C/ADC |
| Broche B3 | PA11 — GPIO/SERCOM/USB DM |
| Broche B4 | PA14 — GPIO/SERCOM/XIN |
| Broche B5 | PA15 — GPIO/SERCOM/XOUT |
| Broche C1 | VDD — Digital supply voltage |
| Broche C2 | PA16 — GPIO/SERCOM/I2C |
| Broche C3 | PA17 — GPIO/SERCOM/I2C |
| Broche C4 | PA18 — GPIO/SERCOM/I2C |
| Broche C5 | PA19 — GPIO/SERCOM/I2C |
| Broche D1 | VSS — Ground |
| Broche D2 | PA20 — GPIO/SERCOM/I2C |
| Broche D3 | PA21 — GPIO/SERCOM/I2C |
| Broche D4 | PA22 — GPIO/SERCOM/I2C |
| Broche D5 | PA23 — GPIO/SERCOM/I2C |
| Broche E1 | VDD — Digital supply voltage |
| Broche E2 | PA24 — GPIO/SERCOM/USB Host enable |
| Broche E3 | PA25 — GPIO/SERCOM/USB DP |
| Broche E4 | PB02 — GPIO/SERCOM/ADC |
| Broche E5 | PB03 — GPIO/SERCOM/ADC |
| Broche F1 | VSS — Ground |
| Broche F2 | PA27 — GPIO/SERCOM |
| Broche F3 | PA28 — GPIO/SERCOM/Reset |
| Broche F4 | PA30 — GPIO/SERCOM/SWD Clock |
| Broche F5 | PA31 — GPIO/SERCOM/SWD IO |
| Broche G1 | VDD — Digital supply voltage |
| Broche G2 | PB00 — GPIO/SERCOM/ADC |
| Broche G3 | PB01 — GPIO/SERCOM/ADC |
| Broche G4 | PB04 — GPIO/SERCOM/ADC |
| Broche G5 | PB05 — GPIO/SERCOM/ADC |
Applications typiques
ATSAMD21E16B-UUT convient pour 7 applications: Wearable Fitness Tracker / Smart Band, USB-C HID Device (Keyboard, Mouse, Presenter, Custom Controller), Bluetooth Low Energy Sensor Node (Beacon, Environmental Monitor), Low-Power IoT Endpoint (Smart Home, Asset Tracker), USB Audio Class Device (Headset Dongle, Conference Mic), Compact Consumer Electronic (Hearable, Smart Badge, Electronic Label), Educational / Maker Hardware (Development Board MCU).
Wearable Fitness Tracker / Smart Band
The ATSAMD21E16B-UUT's 35-WLCSP package (2.82 x 2.53 mm) is purpose-built for compact wearable enclosures where PCB area is the limiting factor, while its Cortex-M0+ core at 48 MHz with 64 KB Flash comfortably runs BLE stack, step-counter algorithms, heart-rate post-processing, and an OLED display driver. The integrated Full-Speed USB allows direct charging and data sync without an external bridge, and the low-power modes (Standby <1 uA with RTC running) keep idle current minimal - critical for a 50-100 mAh coin-cell or LiPo battery.
Recommandé
USB-C HID Device (Keyboard, Mouse, Presenter, Custom Controller)
The ATSAMD21E16B-UUT integrates a USB 2.0 Full-Speed Device/Host/Embedded controller with an on-chip PHY, eliminating the need for an external USB transceiver and saving both BOM cost and PCB area - a key benefit in USB HID products where every square millimeter matters. The 64 KB Flash accommodates HID class drivers plus application logic (keymaps, macros, gesture recognition), while the 48 MHz Cortex-M0+ handles USB polling and report updates without missed frames. The 35-WLCSP package is compatible with slim USB dongle enclosures.
Recommandé
Bluetooth Low Energy Sensor Node (Beacon, Environmental Monitor)
In a battery-powered BLE sensor node, the ATSAMD21E16B-UUT serves as the host MCU between an external nRF52/DA1458x BLE radio and sensors such as temperature, humidity, and accelerometers. Its 6 SERCOM channels can simultaneously drive an I2C sensor, an SPI sensor, and a UART debug channel, while the 12-bit ADC reads battery voltage for fuel-gauge estimation. Deep-sleep mode with RTC retains time-of-day with sub-microamp current, extending CR2032 battery life to months.
Recommandé
Low-Power IoT Endpoint (Smart Home, Asset Tracker)
For battery-powered smart-home endpoints and asset trackers that communicate over LoRa, BLE, or proprietary sub-GHz radios, the ATSAMD21E16B-UUT combines ample Flash (64 KB) for LoRaWAN/Matter stacks with extreme sleep-mode current consumption. The 35-WLCSP allows integration into miniature housings such as door/window sensors and personal trackers. The Event System enables radio-driven wake-ups without CPU intervention, achieving years of operation on a single coin cell.
Recommandé
USB Audio Class Device (Headset Dongle, Conference Mic)
The ATSAMD21E16B-UUT's integrated USB 2.0 Full-Speed controller with isochronous endpoints makes it well suited to USB Audio Class 1.0 devices such as USB headsets, conference speakerphones, and USB microphones. The 10-bit DAC and I2S interface allow direct connection to external audio codecs, while the 35-WLCSP and 1.62-3.63 V supply range simplify compact dongle designs. 64 KB Flash fits UAC 1.0 firmware plus vendor-specific control requests.
Recommandé
Compact Consumer Electronic (Hearable, Smart Badge, Electronic Label)
Electronic badges, electronic shelf labels, hearables, and other miniature consumer products benefit from the ATSAMD21E16B-UUT's combination of 35-WLCSP (2.82 x 2.53 mm) footprint, low-power modes, and integrated peripherals (ADC for battery monitoring, DAC for piezo buzzer / LED, SERCOM for e-paper display interface). The Cortex-M0+ at 48 MHz executes display refresh, button debouncing, and BLE communication stacks within tight power budgets, making it the canonical Microchip choice for space-constrained consumer applications.
Recommandé
Educational / Maker Hardware (Development Board MCU)
The ATSAMD21E16B-UUT powers compact development boards such as the Adafruit Feather M0 and many SAMD21-based maker platforms. Its 35-WLCSP footprint suits compact carrier PCAs, while the Cortex-M0+ core, USB, and 64 KB Flash cover CircuitPython / Arduino sketches up to several thousand lines. Compatibility with the rich SAMD21 toolchain (MPLAB X, ASF, Arduino, CircuitPython) makes it a preferred MCU for prototyping and STEM hardware.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAMD21E16B-UUT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAMD21E16B-UUTB4 | ATSAMD21E17B-UUT | ATSAMD21E18B-UUT | ATSAMD20G17A-UUT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 35-WLCSP (2.82x2.53 mm) | 35-WLCSP (2.82x2.53 mm) - same | 35-WLCSP - same | 35-WLCSP - same | 48-VQFN - different |
| Core | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0+ |
| Maximum Frequency | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Flash | 64 KB | 64 KB | 128 KB | 256 KB | 128 KB |
| SRAM | 8 KB | 8 KB | 16 KB | 32 KB | 16 KB |
| USB | USB 2.0 Full-Speed with PHY | USB 2.0 Full-Speed with PHY | USB 2.0 Full-Speed with PHY | USB 2.0 Full-Speed with PHY | No USB |
| Operating Voltage | 1.62 V to 3.63 V | 1.62 V to 3.63 V | 1.62 V to 3.63 V | 1.62 V to 3.63 V | 1.62 V to 3.63 V |
Principaux différenciateurs
- Smallest Microchip SAM D21 footprint available (vs ATSAMD21E16B-AU)
- Integrated Full-Speed USB PHY (vs ATSAMD20G17A-UUT)
- Upward Flash density migration path (vs ATSAMD21E15B-AU)
- Functional Safety variant available (vs ATSAMD21E16B-UUTB4)
Notes de conception
The 35-WLCSP package (2.82 x 2.53 mm) requires NSMD (Non-Solder Mask Defined) pads with a 0.27-0.30 mm diameter and microvia-in-pad or capped via construction. Stencil apertures should be 1:1 with the NSMD pads (no reduction) for reliable reflow on small pitch WLCSP balls. Stencil thickness 100-125 um is recommended. Per Microchip SAM D21 family datasheet, land pattern coordinates are listed in the package outline section; do NOT use TQFP land patterns with this WLCSP variant.
Place a 100 nF X7R 0402 decoupling capacitor within 1 mm of each VDD ball and a bulk 4.7 uF X5R on the supply rail. The integrated Full-Speed USB PHY draws inrush current up to 50 mA during USB plug-in events; ensure the upstream VBUS regulator can supply this transient. The on-chip POR (Power-On Reset) and BOD33 (Brown-Out Detector at 3.3 V) must remain enabled for reliable start-up from deeply discharged batteries.
Do not confuse the ATSAMD21E16B-UUT (35-WLCSP) with the ATSAMD21E16B-AU (TQFP-32), ATSAMD21E16B-MFT (QFN-32), or ATSAMD21E16B-MU (QFN-32) - these are different packages and PCB footprints even though the silicon die is identical. For board-level layout reuse, validate the exact ordering part number suffix against the SAM D21 datasheet package information. The UUTB4 variant is Functional Safety (FuSa) certified; verify whether your application requires FuSa before substituting.
USB DP/DM traces should be 90 ohm differential, length-matched within 0.5 mm, and routed over a continuous ground plane. Keep D+/D- traces away from switching regulators and high-current traces by at least 3W. The integrated PHY requires a 1.5 kohm pull-up on D+ for full-speed device enumeration; Microchip's Atmel Start framework and ASF USB stack provide reference configurations.
Informations de conformité
RoHS compliant per Microchip product page (Green compound). Halogen-free per Microchip environmental certification. AEC-Q100 not applicable - this is a general-purpose MCU; for automotive applications refer to the SAMD21 family automotive variants. The UUTB4 variant carries Functional Safety (FuSa) certification for IEC 61508 SIL 2.
