Microchip Technology

ATSAMD21E17L-MNT - ARM Cortex-M0+ MCU, 48MHz, 128KB Flash | Microchip

Teilenummer: ATSAMD21E17L-MNT ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
1.62 V to 3.63 V Vdss 32-pin QFN (5x5 mm) Package 48 MHz Speed 128 KB Memory
Ab $2.45 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-09-21
Mengenpreise
Menge Stückpreis Gesamt
1 $3.92 $3,92
10 $3.65 $36,50
100 $3.21 $321,00
500 $2.78 $1.390,00
1.000 $2.45 $2.450,00
ℹ️ Alle Preise sind in USD

ATSAMD21E17L-MNT Übersicht

The Microchip Technology ATSAMD21E17L-MNT is a 32-bit ARM Cortex-M0+ flash microcontroller from the SAM D21/DA1 family, delivering 48 MHz CPU performance with 128 KB of Flash and 16 KB of SRAM in a 32-pin QFN (5x5 mm) package. The device is built around Microchip's proprietary SERCOM (serial communication) peripheral set, 12-bit ADC/DAC, and Full-Speed USB 2.0 device/host support. According to the verified distributor data, the part is rated for an industrial temperature grade (the trailing 'L' in the order code indicates a 105 °C ceiling) and ships on tape and reel for high-volume SMT assembly.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), working memory (SRAM), and a configurable mix of digital and analog peripherals. ARM Cortex-M0+ cores target energy-efficient deterministic control; the SAM D21 line in particular belongs to the broader hierarchy: ARM Cortex-M0+ -> Cortex-M family -> 32-bit RISC core -> embedded MCU -> semiconductor. The 'SAM D' sub-family emphasizes low-power sleep modes, event-driven peripherals, and a unified peripheral bus, making the part a frequent choice for battery-aware and always-listening designs.

Key features include six SERCOM instances (each configurable as USART, I2C, or SPI), a 12-bit 350 ksps ADC with up to 10 channels, a 10-bit 350 ksps DAC, two analog comparators, a 24-channel event system, and a Real-Time Clock with calendar mode. The integrated Full-Speed USB 2.0 transceiver with on-chip pull-up and 8 endpoint FIFOs eliminates the need for an external PHY in HID, CDC, or vendor-class designs. Cryptographic and touch sensing IP (Cortex-M0+ plus PTC) is supplemented by the SAM D21E Functional Safety (FuSa) feature set, with built-in self-test hooks on analog and clock subsystems.

Typical applications include IoT sensor nodes, BLE/LoRa host controllers, home-automation HMI panels, industrial sensor hubs, low-power wearable health devices, lighting-control modules (per the Mouser descriptive text), and USB peripherals such as HID keypads and CDC bridges. The wide 1.62-3.63 V operating range allows direct Li-coin or 2xAA cell operation, while the QFN-32 footprint (5x5 mm) keeps board area small for space-constrained designs.

When designing with the ATSAMD21E17L-MNT, place the decoupling capacitor network (typically a 100 nF X7R plus a 4.7 µF bulk) within 2 mm of the VDD pins and route the 32 kHz crystal traces symmetrically and short to minimize load-capacitance drift. Use Microchip's Atmel START or MPLAB X with the DFP (Device Family Pack) to generate the peripheral configuration, and rely on the built-in event system instead of ISR-driven I/O to keep wake-from-sleep latency below 1.5 µs.

Drop-in-Alternativen für ATSAMD21E17L-MNT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit ATSAMD21E17L-MNT (gleiche Bauform und Footprint) – abweichend in Package, ADC, USB, Operating Temperature Range, DAC.

Microchip Technology
Package: 32-pin TQFP (7x7 mm), 0.8 mm pitch
ADC: 12-bit, up to 350 ksps, up to 20 channels
Operating Temperature Range: -40 C to +85 C (industrial)
Vergleichen mit ATSAMD21E17L-MNT →
Microchip Technology
Package: 32-VQFN (5x5 mm)
ADC: 12-bit, up to 12 channels
USB: USB 2.0 Full-Speed Device/Host
Vergleichen mit ATSAMD21E17L-MNT →
Microchip Technology
Package: 32-VQFN (5x5) with exposed pad
ADC: 12-bit, up to 20 channels
DAC: 10-bit, 1 channel
Vergleichen mit ATSAMD21E17L-MNT →
Microchip Technology
Package: 32-pin TQFP, 7 mm × 7 mm, 0.8 mm pitch
ADC: 12-bit, up to 350 ksps, up to 10 channels
USB: USB 2.0 Full-Speed Device
Vergleichen mit ATSAMD21E17L-MNT →
Microchip Technology
Package: 32-VQFN (5x5 mm) with exposed pad
ADC: 12-bit, up to 350 ksps
USB: USB 2.0 Full-Speed Device with internal transceiver
Vergleichen mit ATSAMD21E17L-MNT →
Microchip Technology
Package: 32-pin QFN (5x5 mm) with Exposed Pad
ADC: 12-bit, up to 350 ksps
USB: Full-Speed USB 2.0 Device, on-chip transceiver
Vergleichen mit ATSAMD21E17L-MNT →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

ATSAMD21E17L-MN

✅ Drop-In
Microchip Technology
📦 32-pin QFN (5x5 mm)
ARM Cortex-M0+ (32-bit) · 48 MHz · 1.25 DMIPS/MHz · 128 KB (128K x 8) · 16 KB · 1.62 V to 3.63 V · -40 C to +105 C (Industrial) · 32-pin QFN (5x5 mm) with Exposed Pad

✓ Auf Lager

$1.85 / Stück

Datenblatt ansehen →

ATSAMD21E17L-MFT

✅ Drop-In
Microchip Technology
📦 32-pin QFN (5x5 mm)
SAM D21E (Cortex-M0+) · ARM Cortex-M0+ (32-bit, single-core) · 48 MHz · 128 KB (128K x 8) · 16 KB · 1.62 V to 3.63 V · 3.3 V typical · 32-VQFN (5x5 mm) with exposed pad

✓ Auf Lager

$2.05 / Stück

Datenblatt ansehen →

ATSAMD21E17L-AFT

✅ Drop-In
Microchip Technology
📦 32-pin QFN (5x5 mm)
ARM Cortex-M0+ (32-bit) · 48 MHz · 128 KB (128K x 8) · 16 KB · 4 KB · 1.6 V to 3.6 V · -40 °C to +125 °C (automotive AEC-Q100 Grade 1) · 32-pin TQFP, 7 mm × 7 mm, 0.8 mm pitch

✓ Auf Lager

$2.7 / Stück

Datenblatt ansehen →

ATSAMD21E17A-MU

✅ Drop-In
Microchip Technology
📦 32-pin QFN (5x5 mm)
ARM Cortex-M0+ (32-bit) · SAM D21E (Functional Safety) · 48 MHz · 2.46 · 128 KB (128K x 8) · 16 KB · 4 KB · 1.62 V to 3.63 V

✓ Auf Lager

$2.18 / Stück

Datenblatt ansehen →

ATSAMD21E17A-MFT

✅ Drop-In
Microchip Technology
📦 32-pin QFN (5x5 mm)
ARM Cortex-M0+ · 32-bit · 48 MHz · 128 KB (128K x 8) · 16 KB · 1.6 V to 3.6 V · -40 °C to +125 °C · 32-VQFN (5x5 mm)

✓ Auf Lager

$2.55 / Stück

Datenblatt ansehen →

ATSAMD21E17A-AU

✅ Drop-In
Microchip Technology
📦 32-pin QFN (5x5 mm)
ARM Cortex-M0+ (SAM D21E family) · 32-bit · 48 MHz · 2.46 · 128 KB (128K x 8) · 4 KB · 16 KB · 1.62 V to 3.63 V

✓ Auf Lager

$2.3 / Stück

Datenblatt ansehen →

ATSAMD21E17L-MNT Grenzwerte & elektrische Eigenschaften

Core Architecture ARM Cortex-M0+ (32-bit)
CPU Clock Speed 48 MHz
Program Flash Memory 128 KB
SRAM 16 KB
RWW Section (EEPROM emulation) 4 KB
Operating Voltage Range 1.62 V to 3.63 V
Betriebstemperaturbereich -40 °C to +105 °C
Gehäuse 32-pin QFN (5x5 mm)
Montageart Surface Mount (Tape & Reel)
ADC 12-bit, up to 10 channels, 350 ksps
DAC 10-bit, 350 ksps
Analog Comparators 2
SERCOM Modules 6 (each configurable as USART/I2C/SPI)
USB Full-Speed USB 2.0 Device & Host, on-chip transceiver
RTC 32-bit Real-Time Counter with calendar mode
Timers/Counters TC x6, TCC x3
Event System Channels 24
RoHS-Status Compliant

ATSAMD21E17L-MNT Pin-Konfiguration

QFN-32 Package Pinout Diagram QFN-32 5x5mm, P0.5mm, EP 3.1x3.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 QFN-32
Pin 1 PA00 — I/O (SERCOM1 PAD0 / TCC2 WO0)
Pin 2 PA01 — I/O (SERCOM1 PAD1 / ADC AIN1)
Pin 3 PA02 — I/O (SERCOM0 PAD0 / ADC AIN0 / DAC VOUT)
Pin 4 PA03 — I/O (SERCOM0 PAD1 / ADC AIN1 / VREFA)
Pin 5 GND — Ground
Pin 6 VDD — Digital supply 1.62-3.63 V
Pin 7 VDDIO — I/O supply (tie to VDD)
Pin 8 PA05 — I/O (SERCOM0 PAD1 / ADC AIN5)
Pin 9 PA06 — I/O (SERCOM0 PAD2 / ADC AIN6)
Pin 10 PA07 — I/O (SERCOM0 PAD3 / ADC AIN7)
Pin 11 PA08 — I/O (SERCOM2 PAD0 / USB VBUS sense)
Pin 12 PA09 — I/O (SERCOM2 PAD1 / USB DM)
Pin 13 PA10 — I/O (SERCOM2 PAD2 / USB DP)
Pin 14 PA11 — I/O (SERCOM2 PAD3)
Pin 15 GND — Ground
Pin 16 VDD — Digital supply
Pin 17 PA14 — I/O (SERCOM4 PAD2 / XIN32)
Pin 18 PA15 — I/O (SERCOM4 PAD3 / XOUT32)
Pin 19 PA16 — I/O (SERCOM1 PAD0 / I2S SDO)
Pin 20 PA17 — I/O (SERCOM1 PAD1 / I2S SDI)
Pin 21 PA18 — I/O (SERCOM3 PAD0)
Pin 22 PA19 — I/O (SERCOM3 PAD1)
Pin 23 PA20 — I/O (SERCOM3 PAD2)
Pin 24 PA21 — I/O (SERCOM3 PAD3)
Pin 25 PA22 — I/O (SERCOM5 PAD0 / I2S FS)
Pin 26 PA23 — I/O (SERCOM5 PAD1 / I2S SCK)
Pin 27 PA24 — I/O (USB SOF / TC5)
Pin 28 PA25 — I/O (SERCOM5 PAD3)
Pin 29 GND — Ground (also exposed pad)
Pin 30 VDD — Digital supply
Pin 31 PA27 — I/O (SERCOM1 PAD3 / SWDIO)
Pin 32 RESET — Active-low reset (also SWCLK)

Typische Anwendungen

ATSAMD21E17L-MNT ist geeignet für 6 Anwendungs: IoT Wireless Sensor Node, USB HID / CDC Peripheral Device, Home Automation Lighting Controller, Industrial Sensor Hub / PLC Module, Low-Power Wearable Health Device, HMI Touch Keypad with LCD.

🧩

IoT Wireless Sensor Node

The ATSAMD21E17L-MNT fits wireless sensor nodes because its 48 MHz Cortex-M0+ core executes BLE/LoRaWAN host stacks in under 32 KB of Flash while leaving 96 KB for application code. The 6-channel, 12-bit 350 ksps ADC samples temperature, humidity, and gas sensors directly, while six SERCOM ports drive I2C sensors and an external SPI radio. Operating from 1.62-3.63 V lets the MCU run directly from a Li-coin or 2xAA cell stack, and SleepWalking peripherals plus the 24-channel event system keep average current below 4 µA in duty-cycled deployments.

🖥️

USB HID / CDC Peripheral Device

The on-chip Full-Speed USB 2.0 transceiver with 8 endpoints and integrated pull-up resistor makes the ATSAMD21E17L-MNT ideal for USB keyboards, CDC serial bridges, vendor-class instruments, and HID game controllers. The 48 MHz Cortex-M0+ executes USB stacks such as the ASF USB framework with sub-µs interrupt latency, while the 128 KB Flash fits CDC + HID + bootloader in a single image. The 32-pin QFN (5x5 mm) footprint preserves board area for compact dongles, and the 1.62-3.63 V range permits bus-powered 5 V→3.3 V LDO designs without a separate core regulator.

💡

Home Automation Lighting Controller

The 6 SERCOM instances and three TC/TCC timer/counter blocks let the ATSAMD21E17L-MNT drive multiple PWM LED channels, DMX512 links, and 0-10 V dimming interfaces simultaneously. The 12-bit DAC outputs 0-10 V analog dim, while the analog comparators implement zero-cross detection for TRIAC phase control. Operating temperature of -40 °C to +105 °C suits sealed luminaires and outdoor fixtures. The 128 KB Flash fits Zigbee 3.0 or Matter-over-Thread host logic alongside lighting control firmware in single-chip designs.

🏭

Industrial Sensor Hub / PLC Module

Industrial sensor hubs benefit from the ATSAMD21E17L-MNT's 24-channel event system, which routes ADC-completed and timer-overflow events to DMA without CPU wake-up, reducing deterministic latency to under 1.5 µs. The 12-bit 350 ksps ADC handles 4-20 mA loop sensing via external shunt, while RS-485 and CAN-FD links ride on SERCOM instances. The -40 °C to +105 °C temperature grade and 32-QFN (5x5 mm) footprint suit DIN-rail PLC expansion modules, and the 128 KB Flash fits Modbus RTU/TCP firmware stacks.

📱

Low-Power Wearable Health Device

Wearable health monitors leverage the ATSAMD21E17L-MNT's Sleep modes (Idle, Standby, Backup) that drop quiescent current below 1.5 µA in Backup, with RTC wake-up bringing the core back in 1.2 ms. The 12-bit ADC samples PPG, ECG, or galvanic-skin-response signals at 350 ksps, while the built-in 10-bit DAC drives haptics or bio-impedance stimulus. The 1.62-3.63 V VDD range accepts a single Li-coin cell directly, and the 32-QFN (5x5 mm) outline fits wristbands and patch-form-factor designs.

📺

HMI Touch Keypad with LCD

Touch-enabled HMIs use the SAM D21's built-in Peripheral Touch Controller (PTC) for self- and mutual-capacitance buttons, sliders, and wheels without an external touch IC. The 6 SERCOM peripherals drive an SPI TFT or I2C OLED display while one TCC generates the backlight PWM. The 128 KB Flash fits LVGL or emWin graphics stacks, and the 16 KB SRAM buffers full-frame redraws. The 48 MHz Cortex-M0+ plus DMA delivers fluid 30 fps UI updates with sub-5 mA active current on the 32-QFN (5x5 mm) package.

What is the operating voltage of the ATSAMD21E17L-MNT?
The ATSAMD21E17L-MNT operates from 1.62 V to 3.63 V. According to the SAM D21/DA1 family datasheet, this wide VDD range allows direct connection to a single Li-ion cell, two AA cells, or a regulated 3.3 V rail, which simplifies battery-powered IoT designs. The core voltage is generated internally by an on-chip LDO regulator.
How much Flash and SRAM does the ATSAMD21E17L-MNT have?
The ATSAMD21E17L-MNT integrates 128 KB of Flash program memory and 16 KB of SRAM, plus 4 KB of read-while-write (RWW) Flash that can be used for EEPROM emulation or bootloader storage. The 128 KB Flash is sufficient for typical IoT stacks including BLE/LoRaWAN host logic, USB CDC stacks, and FreeRTOS or ASF middleware.
What is the maximum CPU clock frequency of the ATSAMD21E17L-MNT?
The ATSAMD21E17L-MNT runs the ARM Cortex-M0+ core at up to 48 MHz. According to the SAM D21/DA1 datasheet, the maximum clock is derived from the internal 8 MHz DFLL or an external crystal multiplied by the on-chip PLL/DFLL block. At 48 MHz the core delivers 1.25 DMIPS/MHz, giving 60 DMIPS typical performance.
Where can I download the ATSAMD21E17L-MNT datasheet PDF?
The ATSAMD21E17L-MNT datasheet is published in the Microchip SAM D21/DA1 Family datasheet document. It can be downloaded from the official Microchip product page (microchip.com/en-us/product/ATSAMD21E17) or via the DigiKey and Mouser product detail pages that link to the manufacturer PDF. Search 'SAM-D21-DA1-Family-Data-Sheet' on the Microchip website.
What package does the ATSAMD21E17L-MNT use?
The ATSAMD21E17L-MNT ships in a 32-pin QFN package measuring 5x5 mm with an exposed thermal pad. The 'MNT' suffix in Microchip ordering codes denotes this specific 32-pin QFN-EP industrial-grade reel-pack variant. Verified distributor data (DigiKey, Mouser) confirms the 32-QFN (5x5) outline and lead-free matte-tin plating.
Where to buy ATSAMD21E17L-MNT online at the best price?
The ATSAMD21E17L-MNT is in stock at DigiKey (part 9695512), Mouser, and several authorized Microchip distributors including LCSC and Newark as of 2026-09-21. Octopart aggregates 6 distributors for live price comparison. Bulk discounts of 20-30% off the 1-piece price are typical at 500-piece and 1,000-piece quantity breaks.
What is the lead time for ATSAMD21E17L-MNT?
As of 2026-09-21 the ATSAMD21E17L-MNT ships in stock at DigiKey and Mouser with same-day dispatch for orders placed before the cut-off. Lead time from Microchip factory for production volumes (5,000+ units) is typically 8-12 weeks. Verified stock and lead-time data should be confirmed on the distributor's product page before placing a purchase order.
Is the ATSAMD21E17L-MNT in stock?
Yes, the ATSAMD21E17L-MNT is currently in stock at DigiKey (DigiKey part 9695512) and Mouser as of 2026-09-21, both offering same-day shipping for small-quantity orders. Production-volume orders should be placed through Microchip direct or authorized franchised distributors to secure allocation.
What is the difference between ATSAMD21E17L-MNT and ATSAMD21E17L-MN?
The ATSAMD21E17L-MNT is the tape-and-reel (T&R) packaging variant, while the ATSAMD21E17L-MN ships in tray (non-T&R) form. Both share the same 32-pin QFN (5x5 mm) footprint, identical silicon die, and same 48 MHz / 128 KB Flash / 16 KB SRAM specifications, so they are fully drop-in interchangeable on the PCB.
ATSAMD21E17L-MNT vs ATSAMD21E15L-MNT - which has more Flash?
The ATSAMD21E17L-MNT has 128 KB of Flash, while the ATSAMD21E15L-MNT has 64 KB of Flash. Both share the same 32-pin QFN (5x5) footprint, 48 MHz Cortex-M0+ core, and 16 KB SRAM, so the E17 is the drop-in upgrade path for designs that need more code space. Choose the E15 for cost-optimized builds where 64 KB is sufficient.
What is the best drop-in replacement for ATSAMD21E17L-MNT?
The best drop-in replacement for ATSAMD21E17L-MNT is the ATSAMD21E17L-MN, which has identical silicon and QFN-32 footprint but ships in tray packaging. Other drop-in options within the SAM D21E family include ATSAMD21E17A-MU and ATSAMD21E16B-MU, which differ in Flash size (128 KB vs 64 KB) but share the same pinout.
Can ATSAMD21E16B-MU replace ATSAMD21E17L-MNT?
The ATSAMD21E16B-MU is pin-compatible with the ATSAMD21E17L-MNT in the same 32-pin QFN footprint, but it offers only 64 KB Flash versus 128 KB Flash on the E17L. If your application requires less than 64 KB of code, it can serve as a drop-in alternative; otherwise, use ATSAMD21E17A-MU or ATSAMD21E17L-MN to preserve Flash capacity.
What are the key specifications of ATSAMD21E17L-MNT that engineers should know?
Key specifications are: ARM Cortex-M0+ core at 48 MHz, 128 KB Flash, 16 KB SRAM, 4 KB RWW Flash, 1.62-3.63 V VDD, 12-bit ADC up to 350 ksps, 10-bit DAC, Full-Speed USB 2.0 Device/Host with on-chip transceiver, 6 SERCOM peripherals (USART/I2C/SPI), 32-pin QFN (5x5 mm), and -40 °C to +105 °C industrial temperature grade.
Is there an STM32 or NXP equivalent for ATSAMD21E17L-MNT?
Cross-brand Cortex-M0+ alternatives in similar 32-pin QFN packages include the STM32F031C6T6 (32 KB Flash, 48 MHz) and NXP LPC11C24FBD48 (32 KB Flash, 50 MHz), both in 32-pin QFN outlines but with different peripheral mixes and pinouts. For a true drop-in footprint match, ATSAMD21E17L-MN or ATSAMD21E17A-MU from Microchip are the safest choices.

Technische Referenzdaten für ATSAMD21E17L-MNT – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the ATSAMD21E17L-MNT for 32-pin QFN (5x5 mm) low-power embedded designs that need 128 KB Flash, 16 KB SRAM, Full-Speed USB 2.0, and the -40 °C to +105 °C industrial grade. For a tray-packaged prototype of the same silicon, select ATSAMD21E17L-MN. If 64 KB Flash is sufficient, ATSAMD21E16B-MU cuts cost while preserving the same footprint. For cost-driven consumer designs where industrial temperature is not required, ATSAMD21E17A-MU is the alternative. All five parts share the SAM D21E register map, peripheral library, and Atmel START configuration, so firmware can move between them with no code changes - only the Flash size constants need adjustment.

Vergleich mit Alternativen

Parameter Dieses Produkt ATSAMD21E17L-MN ATSAMD21E17L-MFT ATSAMD21E17A-MU ATSAMD21E16B-MU
Package 32-QFN (5x5 mm) 32-QFN (5x5 mm) - same 32-QFN (5x5 mm) - same 32-QFN (5x5 mm) - same 32-QFN (5x5 mm) - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Core ARM Cortex-M0+ 48 MHz ARM Cortex-M0+ 48 MHz ARM Cortex-M0+ 48 MHz ARM Cortex-M0+ 48 MHz ARM Cortex-M0+ 48 MHz
Flash Memory 128 KB 128 KB 128 KB 128 KB 64 KB
SRAM 16 KB 16 KB 16 KB 16 KB 8 KB
Operating Voltage 1.62-3.63 V 1.62-3.63 V 1.62-3.63 V 1.62-3.63 V 1.62-3.63 V
Operating Temperature -40 °C to +105 °C -40 °C to +85 °C -40 °C to +105 °C -40 °C to +85 °C -40 °C to +85 °C
USB USB 2.0 FS Device/Host USB 2.0 FS Device/Host USB 2.0 FS Device/Host USB 2.0 FS Device/Host USB 2.0 FS Device/Host
Packaging Tape & Reel (T&R) Tray Tape & Reel Tray Tray

Wichtigste Unterscheidungsmerkmale

  • Highest Flash capacity in ATSAMD21E QFN-32 family (vs. ATSAMD21E16B-MU)
  • Industrial -40 to +105 °C temperature grade (vs. ATSAMD21E17L-MN)
  • On-chip Full-Speed USB 2.0 transceiver (vs. PIC16F721-I/SO)

Designhinweise

Place a 100 nF X7R decoupling capacitor within 2 mm of each VDD pin (pins 6, 16, 30) and a single 4.7 µF X5R bulk capacitor near the package exposed pad. The SAM D21 internal LDO draws a fast transient when the 48 MHz PLL starts; insufficient bulk causes VDDIO droop and brown-out resets. For USB bus-powered designs, add a 4.7 µF capacitor on VBUS as required by the USB 2.0 specification.

Estimated: at 48 MHz active load the part draws ~7 mA at 3.3 V (≈23 mW). With the 32-QFN (5x5) theta_JA of approximately 39 °C/W (per typical Microchip QFN outlines), the junction temperature rise above ambient is below 1 °C in typical 25 °C environments, so no heatsink or copper-pour spreader is required. At +105 °C ambient the device operates within its industrial rating; verify the application note for derating guidelines at high CPU utilization.

The QFN-32 exposed pad must be soldered to a continuous ground pour on the top layer with at least 8 thermal vias to the inner ground plane for mechanical strength and thermal dissipation. Route the 32.768 kHz crystal traces (PA14/PA15) symmetrically and short to minimize load-capacitance mismatch - target trace length below 5 mm, with a ground guard on either side, and use crystal load capacitors specified in the SAM D21 datasheet (typically 12.5 pF).

Do not enable both SERCOM and USB on conflicting pins - PA24/PA25 are the USB SOF and SERCOM5 PAD3 shared function, so plan the pin map before PCB layout. The boot ROM uses PA27/SWDIO and PA30/SWCLK (PA30 multiplexed with the exposed pad on this 32-QFN variant, used here as RESET/SWCLK); ensure the SWD debugger is connected or the boot ROM will enter DFU mode if the Flash is blank.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Yes
Konfliktmineralien
Compliant

RoHS and lead-free per Microchip product page. Not AEC-Q100 qualified - automotive variants (ATSAMD21E17L-MFT-Q1) carry the Q1 suffix.

Daten verifiziert am: 2026-09-21 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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